Guide for Achieving Plating/Finish Compatibility with Connectors and Accessories Used in Electrical Wiring Interconnect Systems (EWIS) PDF Download
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Author: AE-8C1 Connectors Committee
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Book Description
The intent of this ARP is to provide guidance to assist users in choosing compatible component finishes/platings to achieve the best corrosion resistance performance for compatible components/couples. This SAE Recommended Practice is intended as a guide toward standard practice and is subject to change to keep pace with experience and technical advances. A galvanic compatibililty table is provided to assist with the compatible plating/finish selection. Specific plating performance parameters for each individual plating and each connector/accessory specification have also been provided to assist the product user with compatible plating/finish selection. This document provides users a means to identify and select compatible galvanic couples to achieve the best connector and accessory plating/finish performance. Individual component specifications do not address finish selection for different plating configurations affecting the entire EWIS performance as a system (Backshell to Connector Plug to Connector Receptacle to Backshell).
Author: AE-8C1 Connectors Committee
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Get Book Here
Book Description
The intent of this ARP is to provide guidance to assist users in choosing compatible component finishes/platings to achieve the best corrosion resistance performance for compatible components/couples. This SAE Recommended Practice is intended as a guide toward standard practice and is subject to change to keep pace with experience and technical advances. A galvanic compatibililty table is provided to assist with the compatible plating/finish selection. Specific plating performance parameters for each individual plating and each connector/accessory specification have also been provided to assist the product user with compatible plating/finish selection. This document provides users a means to identify and select compatible galvanic couples to achieve the best connector and accessory plating/finish performance. Individual component specifications do not address finish selection for different plating configurations affecting the entire EWIS performance as a system (Backshell to Connector Plug to Connector Receptacle to Backshell).
Author: AE-8C1 Connectors Committee
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Get Book Here
Book Description
The intent of this ARP is to provide guidance to assist users in choosing compatible component finishes/platings to achieve the best corrosion resistance performance for compatible components/couples. This SAE Recommended Practice is intended as a guide toward standard practice and is subject to change to keep pace with experience and technical advances. A galvanic compatibility table is provided to assist with the compatible plating/finish selection. Specific plating performance parameters for each individual plating and each connector/accessory specification have also been provided to assist the product user with compatible plating/finish selection. This document provides users a means to identify and select compatible galvanic couples to achieve the best connector and accessory plating/finish performance. Individual component specifications do not address finish selection for different plating configurations affecting the entire EWIS performance as a system (Backshell to Connector Plug to Connector Receptacle to Backshell).
Author: Department of Department of Defense
Publisher:
ISBN: 9781986310178
Category :
Languages : en
Pages : 396
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Book Description
MIL-HDBK-419A 29 DECEMBER 1987 Volume 2 of 2 Applications Unfortunately, few Military Handbooks address the need for defense against electromagnetic pulse (EMP) and cybersecurity. While EMP has been thought of as a remote possibility (who in his right mind is going to launch a nuclear weapon of any kind against the U.S.?) Advances in non-nuclear EMP, miniaturization of electronics and autonomous drones suddenly brings EMP into the role of the possible. No longer would an adversary need to risk retaliation when a drone from an unknown source attacks a vital facility. The information in this book is part of the solution to the question "How do we defend against EMP?" List of Applicable EMP and Cybersecurity Publications: MIL-STD-188-125-1 High-altitude electromagnetic pulse (HEMP) Protection For Ground-Based C4I Facilities Performing Critical, Time-Urgent Missions MIL-STD-188-124A Grounding, Bonding and Shielding for Common Long Haul/Tactical Communication Systems MIL-HDBK -1195 Radio Frequency Shielded Enclosures TOP 01-2-620 High-Altitude Electromagnetic Pulse (HEMP) Testing MIL-HDBK-1012/1 Electronic Facilities Engineering MIL-HDBK-1013/1A Design Guidelines for Physical Security of Facilities
Author: National Fire Protection Association
Publisher: NationalFireProtectionAssoc
ISBN: 0877657904
Category : Education
Languages : en
Pages : 14
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Book Description
Presents the latest electrical regulation code that is applicable for electrical wiring and equipment installation for all buildings, covering emergency situations, owner liability, and procedures for ensuring public and workplace safety.
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 322
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Book Description
Author: Franklin Fisher
Publisher: CreateSpace
ISBN: 9781478241522
Category :
Languages : en
Pages : 564
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Book Description
This book is an attempt to present under one cover the current state of knowledge concerning the potential lightning effects on aircraft and that means that are available to designers and operators to protect against these effects. The impetus for writing this book springs from two sources- the increased use of nonmetallic materials in the structure of aircraft and the constant trend toward using electronic equipment to handle flight-critical control and navigation function.
Author: Henry W. Ott
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 456
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Book Description
This updated and expanded version of the very successful first edition offers new chapters on controlling the emission from electronic systems, especially digital systems, and on low-cost techniques for providing electromagnetic compatibility (EMC) for consumer products sold in a competitive market. There is also a new chapter on the susceptibility of electronic systems to electrostatic discharge. There is more material on FCC regulations, digital circuit noise and layout, and digital circuit radiation. Virtually all the material in the first edition has been retained. Contains a new appendix on FCC EMC test procedures.
Author: Thomas Parke Hughes
Publisher: JHU Press
ISBN: 9780801846144
Category : Science
Languages : en
Pages : 492
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Book Description
Awarded the Dexter Prize by the Society for the History of Technology, this book offers a comparative history of the evolution of modern electric power systems. It described large-scale technological change and demonstrates that technology cannot be understood unless placed in a cultural context.
Author: Barrie D. Dunn
Publisher: Springer
ISBN: 3319233629
Category : Technology & Engineering
Languages : en
Pages : 677
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Book Description
The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
Author: Ning-Cheng Lee
Publisher: Newnes
ISBN: 0750672188
Category : Technology & Engineering
Languages : en
Pages : 282
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Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
