Heat transfer, 2nd UK national conference, Glasgow, 14-16 September 1988 PDF Download
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Author: Institution of Mechanical Engineers
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Author: Institution of Mechanical Engineers
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Book Description
Author:
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ISBN:
Category : Heat
Languages : en
Pages : 858
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Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 930
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Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages :
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Author:
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ISBN: 9780852986592
Category : Heat
Languages : en
Pages : 0
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Publisher: Mechanical Engineering Publications Limited
ISBN: 9780852986660
Category : Heat
Languages : en
Pages : 0
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Author:
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Category : Heat
Languages : en
Pages :
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![Second [2.] UK National Conference on Heat Transfer PDF](https://books.google.com/books/content/images/frontcover/DJM-mwEACAAJ?fife=w80-h100)
Author: UK National Conference on Heat Transfer
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 930
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Author: L. P. Yarin
Publisher: Springer Science & Business Media
ISBN: 3540787550
Category : Science
Languages : en
Pages : 487
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Book Description
The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.
