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Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
Get Book Here
Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0081002181
Category : Technology & Engineering
Languages : en
Pages : 538
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Book Description
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. - Considers techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for particular materials - Addresses consumables and process control for improved CMP
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author: Toshiro Doi
Publisher: William Andrew
ISBN: 1437778593
Category : Science
Languages : en
Pages : 330
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Book Description
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Author: Raivo Jaaniso
Publisher: Woodhead Publishing
ISBN: 0081025602
Category : Technology & Engineering
Languages : en
Pages : 512
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Book Description
Semiconductor Gas Sensors, Second Edition, summarizes recent research on basic principles, new materials and emerging technologies in this essential field. Chapters cover the foundation of the underlying principles and sensing mechanisms of gas sensors, include expanded content on gas sensing characteristics, such as response, sensitivity and cross-sensitivity, present an overview of the nanomaterials utilized for gas sensing, and review the latest applications for semiconductor gas sensors, including environmental monitoring, indoor monitoring, medical applications, CMOS integration and chemical warfare agents. This second edition has been completely updated, thus ensuring it reflects current literature and the latest materials systems and applications. - Includes an overview of key applications, with new chapters on indoor monitoring and medical applications - Reviews developments in gas sensors and sensing methods, including an expanded section on gas sensor theory - Discusses the use of nanomaterials in gas sensing, with new chapters on single-layer graphene sensors, graphene oxide sensors, printed sensors, and much more
Author: Oksana Ostroverkhova
Publisher: Elsevier
ISBN: 0857098764
Category : Technology & Engineering
Languages : en
Pages : 832
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Book Description
Small molecules and conjugated polymers, the two main types of organic materials used for optoelectronic and photonic devices, can be used in a number of applications including organic light-emitting diodes, photovoltaic devices, photorefractive devices and waveguides. Organic materials are attractive due to their low cost, the possibility of their deposition from solution onto large-area substrates, and the ability to tailor their properties. The Handbook of organic materials for optical and (opto)electronic devices provides an overview of the properties of organic optoelectronic and nonlinear optical materials, and explains how these materials can be used across a range of applications.Parts one and two explore the materials used for organic optoelectronics and nonlinear optics, their properties, and methods of their characterization illustrated by physical studies. Part three moves on to discuss the applications of optoelectronic and nonlinear optical organic materials in devices and includes chapters on organic solar cells, electronic memory devices, and electronic chemical sensors, electro-optic devices.The Handbook of organic materials for optical and (opto)electronic devices is a technical resource for physicists, chemists, electrical engineers and materials scientists involved in research and development of organic semiconductor and nonlinear optical materials and devices. - Comprehensively examines the properties of organic optoelectronic and nonlinear optical materials - Discusses their applications in different devices including solar cells, LEDs and electronic memory devices - An essential technical resource for physicists, chemists, electrical engineers and materials scientists
Author: David J.R. Cristaldi
Publisher: Springer Science & Business Media
ISBN: 9048122554
Category : Technology & Engineering
Languages : en
Pages : 303
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Book Description
Liquid Crystal Display Drivers deals with Liquid Crystal Displays from the electronic engineering point of view and is the first expressively focused on their driving circuits. After introducing the physical-chemical properties of the LC substances, their evolution and application to LCDs, the book converges to the examination and in-depth explanation of those reliable techniques, architectures, and design solutions amenable to efficiently design drivers for passive-matrix and active-matrix LCDs, both for small size and large size panels. Practical approaches regularly adopted for mass production but also emerging ones are discussed. The topics treated have in many cases general validity and found application also in alternative display technologies (OLEDs, Electrophoretic Displays, etc.).
Author:
Publisher: Woodhead Publishing
ISBN: 1782424687
Category : Science
Languages : en
Pages : 551
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Book Description
Photodetectors: Materials, Devices and Applications discusses the devices that convert light to electrical signals, key components in communication, computation, and imaging systems. In recent years, there has been significant improvement in photodetector performance, and this important book reviews some of the key advances in the field. Part one covers materials, detector types, and devices, and includes discussion of silicon photonics, detectors based on reduced dimensional charge systems, carbon nanotubes, graphene, nanowires, low-temperature grown gallium arsenide, plasmonic, Si photomultiplier tubes, and organic photodetectors, while part two focuses on important applications of photodetectors, including microwave photonics, communications, high-speed single photon detection, THz detection, resonant cavity enhanced photodetection, photo-capacitors and imaging. Reviews materials, detector types and devices Addresses fabrication techniques, and the advantages and limitations and different types of photodetector Considers a range of application for this important technology Includes discussions of silicon photonics, detectors based on reduced dimensional charge systems, carbon nanotubes, graphene, nanowires, and more
Author: Hans Nørgaard Hansen
Publisher: MDPI
ISBN: 3038426040
Category : Science
Languages : en
Pages : 191
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Book Description
This book is a printed edition of the Special Issue "Micro/Nano Manufacturing" that was published in Micromachines
Author: James Moyne
Publisher: CRC Press
ISBN: 1420040669
Category : Technology & Engineering
Languages : en
Pages : 367
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Book Description
Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control.
