Author: Z. H. Meiksin
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 506
Book Description
Thin and Thick Films for Hybrid Microelectronics
Thick Film Hybrid Microcircuit Technology
Author: Donald W. Hamer
Publisher:
ISBN:
Category : Medical
Languages : en
Pages : 440
Book Description
Publisher:
ISBN:
Category : Medical
Languages : en
Pages : 440
Book Description
Handbook of Thick- and Thin-film Hybrid Microelectronics
Author: Tapan Gupta
Publisher:
ISBN: 9780471723660
Category : Circuits hybrides à couches minces
Languages : en
Pages : 406
Book Description
This is the first handbook on the fabrication and design of hybrid microelectronic circuits. Deals with all aspects of the technology, design, layout and processing of materials. Fills the need for a comprehensive survey of a widely-used technology.
Publisher:
ISBN: 9780471723660
Category : Circuits hybrides à couches minces
Languages : en
Pages : 406
Book Description
This is the first handbook on the fabrication and design of hybrid microelectronic circuits. Deals with all aspects of the technology, design, layout and processing of materials. Fills the need for a comprehensive survey of a widely-used technology.
Thick-film Microelectronics
Author: Morton L. Topfer
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 232
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 232
Book Description
Thick Film Hybrid Microelectronics
Author: Richard A. Rikoski
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Thick Film Technology
Author: Jeremy Agnew
Publisher: Hayden
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 184
Book Description
Publisher: Hayden
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 184
Book Description
Hybrid Microelectronic Circuits: the Thick Film
Author: Richard A. Rikoski
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
Hybrid Microcircuits
Author: Stephen J. Kokal
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 104
Book Description
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 104
Book Description
Electronic Materials Handbook
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Thick Film Hybrid Microelectronics
Author: Richard A. Rikosky
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 164
Book Description
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 164
Book Description