Thermal and Electro-thermal System Simulation 2020 PDF Download
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Author: Márta Rencz
Publisher: MDPI
ISBN: 303943831X
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author: Márta Rencz
Publisher: MDPI
ISBN: 303943831X
Category : Technology & Engineering
Languages : en
Pages : 310
Get Book Here
Book Description
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author: Márta Rencz
Publisher: MDPI
ISBN: 3039217364
Category : Technology & Engineering
Languages : en
Pages : 222
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Book Description
With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Author: Márta Rencz
Publisher:
ISBN: 9783039438327
Category :
Languages : en
Pages : 310
Get Book Here
Book Description
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author: Márta Rencz
Publisher:
ISBN: 9783039217373
Category : Engineering (General). Civil engineering (General)
Languages : en
Pages : 222
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Book Description
With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Author: Tamara Bechtold
Publisher: Springer Science & Business Media
ISBN: 3540346139
Category : Technology & Engineering
Languages : en
Pages : 185
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Book Description
This book provides the reader with a complete methodology and software environment for creating efficient dynamic compact models for electro-thermal MEMS devices. It supplies the basic knowledge and understanding for using model order reduction at the engineering level. This tutorial is written for MEMS engineers and is enriched with many case studies which equip readers with the know-how to facilitate the simulation of a specific problem.
Author: Cheng Siong Chin
Publisher:
ISBN: 9781536168310
Category : Science
Languages : en
Pages : 102
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Book Description
"This book covers an overview and applications of the thermal storage systems used in batteries for the electric automotive industry such as in electric vehicles, thermal storage system in smart grid systems, thermal harvesting for battery-less use for wireless sensor networks, thermo-electric generators and biomedical sensing. The thermal storage system can be used to harvest energy for implementation of battery-less, zero-maintenance and place-and-forget electronic systems. This book has been prepared for the needs of those who seek an application on developing the thermal system. The choice of material is guided by the basic objective of making an engineer or student capable of dealing with thermal system design. The book can be used as reference book for undergraduate and postgraduate students in the area of thermal system overview, design and applications. Lithium iron phosphate (LiFePO4) batteries have gained significant traction in the electric automotive industry in the recent years mainly due to their high safety performance, flat voltage profile and low cost. Although LiFePO4 batteries have excellent thermal stability, they still suffer from thermal runaway like other lithium-ion type cells. Thermal volatility is a major drawback in the lithium-ion and sufficient knowledge of the thermal distribution and heat generation of the LiFePO4 battery is necessary to avoid catastrophic thermal failure. The first chapter details the thermal analysis of a LiFePO4 battery cell with a latent heat thermal cooling wrap. The model has been developed as a tool to study the cooling effects of the wrap on the battery cell during discharging. The proposed latent heat storage based battery cooling wrap is used to passively manage the heat produced by the cell and absorbing and maintaining the battery temperature within operational temperatures and below thermal runaway temperature. Thermal energy storage (TES) is another important concept of the smart grid systems. For non-renewable, the benefit of TES systems is the improvement of the generation performance by supporting the energy demand during peak hours. Also, TES is often able to improve the system efficiency in a way that is more energy and cost effective. The best-known method for thermal energy storage is by utilizing the latent heat of fusion of energy storage material known as phase change materials (PCM). TES systems are classified into two main categories such as sensible and latent heat storage. An overview of the research on performance improvement are also delineated. Hence, the thermal energy harvesting has indeed gained attention in the last decade due to its promising possibilities in area such as wireless sensor networks (WSN) for wide range of IoT (Internet of Things) applications. Thermal energy scavenging from waste heat can enable implementation of battery-less, zero-maintenance and place-and-forget electronic systems. Scavenging energy from the temperature difference between human body heat and ambiance is an attractive solution for powering wearables for continuous health monitoring, biomedical sensing and body area sensor networks (BASN). The low energy efficiency and low voltage output of the thermo-electric generators (TEG) pose challenges to the deployment of industry ready powering systems"--
Author: Qilian Liang
Publisher: Springer Nature
ISBN: 9811394091
Category : Technology & Engineering
Languages : en
Pages : 2720
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Book Description
This book brings together papers from the 2019 International Conference on Communications, Signal Processing, and Systems, which was held in Urumqi, China, on July 20–22, 2019. Presenting the latest developments and discussing the interactions and links between these multidisciplinary fields, the book spans topics ranging from communications to signal processing and systems. It is chiefly intended for undergraduate and graduate students in electrical engineering, computer science and mathematics, researchers and engineers from academia and industry, as well as government employees.
Author: Leonid Sokolinsky
Publisher: Springer Nature
ISBN: 303138864X
Category : Computers
Languages : en
Pages : 373
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Book Description
This book constitutes the refereed post proceedings of the 17th International Conference on Parallel Computational Technologies, PCT 2023, held in Saint Petersburg, Russia, during March 28–30, 2023. The 25 full papers included in this book were carefully reviewed and selected from 71 submissions. They were organized in topical sections as follows: "High Performance Architectures, Tools and Technologies", "Parallel Numerical Algorithms", and "Supercomputer Simulation".
Author: Krzysztof Górecki
Publisher: MDPI
ISBN: 303650334X
Category : Technology & Engineering
Languages : en
Pages : 140
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Book Description
This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
Author: Dongkai Shangguan
Publisher: CRC Press
ISBN: 1040028691
Category : Technology & Engineering
Languages : en
Pages : 549
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Book Description
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
