The Electrodeposition and Throwing Power of Nickel and Cobalt Especially from Alkaline Plating Baths PDF Download
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Author: George Finley Webb
Publisher:
ISBN:
Category :
Languages : en
Pages : 290
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Book Description
Author: George Finley Webb
Publisher:
ISBN:
Category :
Languages : en
Pages : 290
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Book Description
Author: Clarence William Schaaf
Publisher:
ISBN:
Category :
Languages : en
Pages : 98
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Book Description
Author: James B. Mohler
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 328
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Book Description
CONTENTS - Introduction - I. Mechanism of Electrodeposition - 2. Laws and Characteristics of Plating Baths - 3. The Deposit - 4. Preparatory Steps of Plating - 5. Preparation of the Surface - 6. Cleaning - 7. Pickling - 8. Strike Plating - 9. Rinsing - 10. Anodizing - 11. Brass Plating - 12. Bronze Plating - 13. Cadmium Plating - 14. Chromate Coatings - 15. Chromium Plating - 16. Acid Copper Plating - 17. Copper Cyanide Baths - 18. Iron Plating - 19. Lead Plating - 20. Lead-Tin - 21. Nickel Plating - 22. Electroless Nickel - 23. Phosphate Coatings - 24. Silver Plating - 25. Acid Tin Plating - 26. Alkaline Tin Plating - 27. Tin-Nickel - 28. Tin-Zinc - 29. Acid Zinc Baths - 30. Zinc Cyanide Baths - 31. Control of a Plating Bath - 32. Plating Tests - 33. Gravity, Conductivity, and Voltage - 34. Electroplated Alloys - 35. Layer Plating - 36. Applications of Electroplating - 37. Plating Bath Troubles - 38. Continuous Plating - 39. Plating on Plastics - 40. Preparation of Metals for Painting - 41. Analytical Methods for Plating Baths - Appendix - Conversion Factors - Electrochemical Yields - Electrochemical Formulas - Electrochemical Equivalents - Single Electrode Potentials - Stripping Chart - Glossary - Index -
Author: James Paul Nowlen
Publisher:
ISBN:
Category : Chemistry, Metallurgic
Languages : en
Pages : 102
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Book Description
Author: Paul Franklin Hoglund
Publisher:
ISBN:
Category : Alloy plating
Languages : en
Pages : 352
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Book Description
Author: Donald A. Swalheim
Publisher:
ISBN:
Category :
Languages : en
Pages : 246
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Book Description
Author: Frederick Adolph Lowenheim
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 608
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Book Description
Author: Abner Brenner
Publisher: Elsevier
ISBN: 1483223108
Category : Technology & Engineering
Languages : en
Pages : 677
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Book Description
Electrodeposition of Alloys: Principles and Practice, Volume II: Practical and Specific Information provides sufficient information for preparing and operating alloy plating baths. This book is organized into five sections encompassing 21 chapters that also consider the facts and theory of alloy plating. The five sections discuss the five types of alloy plating system with respect to the plating variables. Each section deals with the fundamental bases of alloy deposition, which have been summed up in six principles. This book further examines the role of diffusion in alloy deposition and the role of the density versus potential relations in alloy deposition, as well as certain misconceptions regarding their value in alloy deposition have been pointed out. This book will prove useful to electrochemists, researchers, and electrochemistry teachers and students.
Author: F. Keith Shelton
Publisher:
ISBN:
Category : Cobalt ores
Languages : en
Pages : 52
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Book Description
Author: Mordechay Schlesinger
Publisher: Wiley-Interscience
ISBN:
Category : Science
Languages : en
Pages : 926
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Book Description
A new collection of authoritative contributions on the state of the art of electrochemical deposition Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations. Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes: * Electrodeposition of various metals and metal alloys * Electrodeposition of semiconductors and electrodeposition on nonconductors * Electrodeposition of conductive polymers * Electroless deposition of various metals and alloys * Preparation procedures for deposition * Manufacturing technologies, monitoring, testing, and control * Deposition and the environment
