Author: American Chemical Society. Division of Polymer Chemistry
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 1058
Book Description
Papers Presented at the ... Meeting
Author: American Chemical Society. Division of Polymer Chemistry
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 1058
Book Description
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 1058
Book Description
Index of Conference Proceedings
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Congresses and conventions
Languages : en
Pages : 990
Book Description
Publisher:
ISBN:
Category : Congresses and conventions
Languages : en
Pages : 990
Book Description
Index of Conference Proceedings Received
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 792
Book Description
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 792
Book Description
国立国会図書館所蔵科学技術関係欧文会議錄目錄
Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1024
Book Description
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1024
Book Description
国立国会図書館所蔵科学技術関係欧文会議錄目錄
Author: 国立国会図書館 (Japan)
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1020
Book Description
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1020
Book Description
Paperbound Books in Print
Author:
Publisher:
ISBN:
Category : Paperbacks
Languages : en
Pages : 1256
Book Description
Publisher:
ISBN:
Category : Paperbacks
Languages : en
Pages : 1256
Book Description
Current Catalog
Author: National Library of Medicine (U.S.)
Publisher:
ISBN:
Category : Medicine
Languages : en
Pages : 1144
Book Description
First multi-year cumulation covers six years: 1965-70.
Publisher:
ISBN:
Category : Medicine
Languages : en
Pages : 1144
Book Description
First multi-year cumulation covers six years: 1965-70.
Failure of Plastics
Author:
Publisher: iSmithers Rapra Publishing
ISBN: 9780902348516
Category : Technology & Engineering
Languages : en
Pages : 144
Book Description
Publisher: iSmithers Rapra Publishing
ISBN: 9780902348516
Category : Technology & Engineering
Languages : en
Pages : 144
Book Description
Index of Conference Proceedings Received
Author: British Library. Lending Division
Publisher:
ISBN:
Category : Congresses and conventions
Languages : en
Pages : 492
Book Description
Publisher:
ISBN:
Category : Congresses and conventions
Languages : en
Pages : 492
Book Description
Electronic Materials Handbook
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.