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Author: Keats A Pullen (Jr)
Publisher:
ISBN:
Category :
Languages : en
Pages : 30
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Book Description
The reliability of certain airborne military electronic equipment in terms of measured mean time between failures (MTBF) has recently been shown to be between 3.5 and 6 hours. Reliability in this sense is usually based on actual measurement of time between failures rather than a statistical probability of failure occurring for a given period based on number of components. Improvement of reliability in this sense is based on a determination of the nature of the principal causes of failure and placement of them in the order of their descending probability of occurrence. Based on this ordering, one can often find ways of reducing the probability of occurrence of the causes of failure to the point where they can be considered to be random. Much of the control required for the high-probability causes of failure of electronics can be developed at the network design stage, since the electronic failure problem is frequently associated with either design difficulties or conditions of excessive heat in the environment. Particular emphasis is placed on data presentation herein, since experience has shown designers do work with inadequate information, a major part of the problem can be traced to inadequacies in characterization of components and devices, leading to excessive dissipation and excessive supply voltages. Further problems encountered as a consequence of the effect of a severe environment on a marginal design are discussed, and some ways of finding 'make-do' fixes are described. (Author).
Author: Keats A Pullen (Jr)
Publisher:
ISBN:
Category :
Languages : en
Pages : 30
Get Book Here
Book Description
The reliability of certain airborne military electronic equipment in terms of measured mean time between failures (MTBF) has recently been shown to be between 3.5 and 6 hours. Reliability in this sense is usually based on actual measurement of time between failures rather than a statistical probability of failure occurring for a given period based on number of components. Improvement of reliability in this sense is based on a determination of the nature of the principal causes of failure and placement of them in the order of their descending probability of occurrence. Based on this ordering, one can often find ways of reducing the probability of occurrence of the causes of failure to the point where they can be considered to be random. Much of the control required for the high-probability causes of failure of electronics can be developed at the network design stage, since the electronic failure problem is frequently associated with either design difficulties or conditions of excessive heat in the environment. Particular emphasis is placed on data presentation herein, since experience has shown designers do work with inadequate information, a major part of the problem can be traced to inadequacies in characterization of components and devices, leading to excessive dissipation and excessive supply voltages. Further problems encountered as a consequence of the effect of a severe environment on a marginal design are discussed, and some ways of finding 'make-do' fixes are described. (Author).
Author: United States. Department of Defense. Research and Development Board. Ad Hoc Group on Reliability of Electronic Equipment
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 144
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Book Description
Author: Dhanasekharan Natarajan
Publisher: Springer
ISBN: 3319091115
Category : Technology & Engineering
Languages : en
Pages : 156
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Book Description
This book explains reliability techniques with examples from electronics design for the benefit of engineers. It presents the application of de-rating, FMEA, overstress analyses and reliability improvement tests for designing reliable electronic equipment. Adequate information is provided for designing computerized reliability database system to support the application of the techniques by designers. Pedantic terms and the associated mathematics of reliability engineering discipline are excluded for the benefit of comprehensiveness and practical applications. This book offers excellent support for electrical and electronics engineering students and professionals, bridging academic curriculum with industrial expectations.
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
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Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Titu I. Bajenescu
Publisher: Springer Science & Business Media
ISBN: 3642585051
Category : Technology & Engineering
Languages : en
Pages : 547
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Book Description
This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Author: Eugene R. Hnatek
Publisher: CRC Press
ISBN: 0824743547
Category : Technology & Engineering
Languages : en
Pages : 433
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Book Description
Practical Reliability of Electronic Equipment and Products will help electrical, electronics, manufacturing, mechanical, systems design, and reliability engineers; electronics production managers; electronic circuit designers; and upper-level undergraduate and graduate students in these disciplines.
Author: Marius Bazu
Publisher: John Wiley & Sons
ISBN: 1119990009
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Author: United States. Advisory Group on Reliability of Electronic Equipment
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 608
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Book Description
Author: Geoffrey W. A. Dummer
Publisher: Elsevier
ISBN: 1483149269
Category : Technology & Engineering
Languages : en
Pages : 249
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Book Description
Electronics Reliability–Calculation and Design provides an introduction to the fundamental concepts of reliability. The increasing complexity of electronic equipment has made problems in designing and manufacturing a reliable product more and more difficult. Specific techniques have been developed that enable designers to integrate reliability into their products, and reliability has become a science in its own right. The book begins with a discussion of basic mathematical and statistical concepts, including arithmetic mean, frequency distribution, median and mode, scatter or dispersion of measurements, and the normal and binomial distributions. Separate chapters deal with techniques for calculating equipment and system reliability; safety and derating factors; and the effects of constructional methods on reliability. Subsequent chapters cover environmental effects on reliability; improved reliability through microelectronics or integrated circuits; and failure rates for electronic components. Each chapter concludes with questions to enable students to test their understanding of the topics discussed. This book offers students an introduction to the subject of reliability in a form that is easily assimilated. It also serves as a reference to the various aspects contributing towards increased reliability of both electronic equipment and complete systems.
Author: Titu I. Băjenescu
Publisher: Artech House
ISBN: 1596934360
Category : Technology & Engineering
Languages : en
Pages : 706
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Book Description
The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.
