Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 448
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Nanoengineered Assemblies and Advanced Micro/Nanosystems: Volume 820
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 448
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 448
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Nanoengineered Assemblies and Advanced Micro/Nanosystems:
Author: David P. Taylor
Publisher: Cambridge University Press
ISBN: 9781107409156
Category : Technology & Engineering
Languages : en
Pages : 444
Book Description
This book combines the proceedings of Symposium O, Advanced Microsystems - Integration with Nanotechnology and Biology, and Symposium R, Three-Dimensional Nanoengineered Assemblies II, both from the 2004 MRS Spring Meeting in San Francisco. The book addresses scientific and technology challenges in materials science for advanced nano- and Microsystems - self-assembled materials; interfacial sciences and novel microsystems/microdevices; nanoparticle synthesis and applications; nanomaterials and nanofabrications in microsystems and microdevices; tissue engineering; integrated microanalysis; and nano- and biomicrosystems and devices. Symposium R aimed to advance the practice and progress of nanoengineering in three dimensions. Novel approaches to materials processing and applications for >2D structures that will advance present practice, even if they cannot yet be applied to the nanometer scale, are featured. Included are contact-based processing schemes such as soft lithography, template transfer, self-assembly, biological or biomimetic interactions, and various mass transport processes. The manipulation of nanoparticles and plasmon processes is also addressed, as are three-dimensional photonic structures - even if they are not yet on the nanoscale.
Publisher: Cambridge University Press
ISBN: 9781107409156
Category : Technology & Engineering
Languages : en
Pages : 444
Book Description
This book combines the proceedings of Symposium O, Advanced Microsystems - Integration with Nanotechnology and Biology, and Symposium R, Three-Dimensional Nanoengineered Assemblies II, both from the 2004 MRS Spring Meeting in San Francisco. The book addresses scientific and technology challenges in materials science for advanced nano- and Microsystems - self-assembled materials; interfacial sciences and novel microsystems/microdevices; nanoparticle synthesis and applications; nanomaterials and nanofabrications in microsystems and microdevices; tissue engineering; integrated microanalysis; and nano- and biomicrosystems and devices. Symposium R aimed to advance the practice and progress of nanoengineering in three dimensions. Novel approaches to materials processing and applications for >2D structures that will advance present practice, even if they cannot yet be applied to the nanometer scale, are featured. Included are contact-based processing schemes such as soft lithography, template transfer, self-assembly, biological or biomimetic interactions, and various mass transport processes. The manipulation of nanoparticles and plasmon processes is also addressed, as are three-dimensional photonic structures - even if they are not yet on the nanoscale.
Integration of Advanced Micro- and Nanoelectronic Devices--critical Issues and Solutions
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 506
Book Description
"This volume is the joint proceedings of papers presented in Symposium D, 'High-k Insulators and Ferroelectrics for Advanced Microelectronic Devices,' and Symposium E, 'Integration Challenges in Next-Generation Oxide-Based Nanoelectronics,' held April 13-16 at the 2004 MRS Spring Meeting in San Francisco, California."--p. x
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 506
Book Description
"This volume is the joint proceedings of papers presented in Symposium D, 'High-k Insulators and Ferroelectrics for Advanced Microelectronic Devices,' and Symposium E, 'Integration Challenges in Next-Generation Oxide-Based Nanoelectronics,' held April 13-16 at the 2004 MRS Spring Meeting in San Francisco, California."--p. x
Fundamentals of Nanoindentation and Nanotribology
Author:
Publisher:
ISBN:
Category : Nanotechnology
Languages : en
Pages : 440
Book Description
Publisher:
ISBN:
Category : Nanotechnology
Languages : en
Pages : 440
Book Description
Fundamentals of Nanoindentation and Nanotribology III
Author: Kathryn J. Wahl
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 444
Book Description
This volume focuses on methods to measures and model small-volume mechanical and tribological properties. Nanoscale characterization of the mechanical and tribological properties of surfaces is important in many engineering applications.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 444
Book Description
This volume focuses on methods to measures and model small-volume mechanical and tribological properties. Nanoscale characterization of the mechanical and tribological properties of surfaces is important in many engineering applications.
Interfacial Engineering for Optimized Properties
Author:
Publisher:
ISBN:
Category : Grain boundaries
Languages : en
Pages : 336
Book Description
Publisher:
ISBN:
Category : Grain boundaries
Languages : en
Pages : 336
Book Description
New Materials for Microphotonics: Volume 817
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 304
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 304
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004
Author: R. J. Carter
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
Book Description
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
Book Description
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Surface Engineering ...
Author:
Publisher:
ISBN:
Category : Surfaces (Technology)
Languages : en
Pages : 392
Book Description
Publisher:
ISBN:
Category : Surfaces (Technology)
Languages : en
Pages : 392
Book Description
Materials and Processes for Nonvolatile Memories: Volume 830
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 416
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 416
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.