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Author: David Robert Stauffer
Publisher: Springer Science & Business Media
ISBN: 038779834X
Category : Technology & Engineering
Languages : en
Pages : 495
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Book Description
The simplest method of transferring data through the inputs or outputs of a silicon chip is to directly connect each bit of the datapath from one chip to the next chip. Once upon a time this was an acceptable approach. However, one aspect (and perhaps the only aspect) of chip design which has not changed during the career of the authors is Moore’s Law, which has dictated substantial increases in the number of circuits that can be manufactured on a chip. The pin densities of chip packaging technologies have not increased at the same pace as has silicon density, and this has led to a prevalence of High Speed Serdes (HSS) devices as an inherent part of almost any chip design. HSS devices are the dominant form of input/output for many (if not most) high-integration chips, moving serial data between chips at speeds up to 10 Gbps and beyond. Chip designers with a background in digital logic design tend to view HSS devices as simply complex digital input/output cells. This view ignores the complexity associated with serially moving billions of bits of data per second. At these data rates, the assumptions associated with digital signals break down and analog factors demand consideration. The chip designer who oversimplifies the problem does so at his or her own peril.
Author: David Robert Stauffer
Publisher: Springer Science & Business Media
ISBN: 038779834X
Category : Technology & Engineering
Languages : en
Pages : 495
Get Book Here
Book Description
The simplest method of transferring data through the inputs or outputs of a silicon chip is to directly connect each bit of the datapath from one chip to the next chip. Once upon a time this was an acceptable approach. However, one aspect (and perhaps the only aspect) of chip design which has not changed during the career of the authors is Moore’s Law, which has dictated substantial increases in the number of circuits that can be manufactured on a chip. The pin densities of chip packaging technologies have not increased at the same pace as has silicon density, and this has led to a prevalence of High Speed Serdes (HSS) devices as an inherent part of almost any chip design. HSS devices are the dominant form of input/output for many (if not most) high-integration chips, moving serial data between chips at speeds up to 10 Gbps and beyond. Chip designers with a background in digital logic design tend to view HSS devices as simply complex digital input/output cells. This view ignores the complexity associated with serially moving billions of bits of data per second. At these data rates, the assumptions associated with digital signals break down and analog factors demand consideration. The chip designer who oversimplifies the problem does so at his or her own peril.
Author: Lazaros Iliadis
Publisher: Springer Nature
ISBN: 3031624955
Category :
Languages : en
Pages : 603
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Book Description
Author: Weitao Li
Publisher: Springer
ISBN: 3319620126
Category : Technology & Engineering
Languages : en
Pages : 181
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Book Description
This book is a step-by-step tutorial on how to design a low-power, high-resolution (not less than 12 bit), and high-speed (not less than 200 MSps) integrated CMOS analog-to-digital (AD) converter, to respond to the challenge from the rapid growth of IoT. The discussion includes design techniques on both the system level and the circuit block level. In the architecture level, the power-efficient pipelined AD converter, the hybrid AD converter and the time-interleaved AD converter are described. In the circuit block level, the reference voltage buffer, the opamp, the comparator, and the calibration are presented. Readers designing low-power and high-performance AD converters won’t want to miss this invaluable reference. Provides an in-depth introduction to the newest design techniques for the power-efficient, high-resolution (not less than 12 bit), and high-speed (not less than 200 MSps) AD converter; Presents three types of power-efficient architectures of the high-resolution and high-speed AD converter; Discusses the relevant circuit blocks (i.e., the reference voltage buffer, the opamp, and the comparator) in two aspects, relaxing the requirements and improving the performance.
Author: P. Satish Rama Chowdary
Publisher: Springer Nature
ISBN: 981153828X
Category : Technology & Engineering
Languages : en
Pages : 762
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Book Description
This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics and telecommunication. It includes original research presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2019), organized by the Department of ECE, Raghu Institute of Technology, Andhra Pradesh, India. Written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes around the globe, the papers share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.
Author: Jose Moreira
Publisher: Artech House
ISBN: 1608079864
Category : Technology & Engineering
Languages : en
Pages : 709
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Book Description
This second edition of An Engineer's Guide to Automated Testing of High-Speed Interfaces provides updates to reflect current state-of-the-art high-speed digital testing with automated test equipment technology (ATE). Featuring clear examples, this one-stop reference covers all critical aspects of automated testing, including an introduction to high-speed digital basics, a discussion of industry standards, ATE and bench instrumentation for digital applications, and test and measurement techniques for characterization and production environment. Engineers learn how to apply automated test equipment for testing high-speed digital I/O interfaces and gain a better understanding of PCI-Express 4, 100Gb Ethernet, and MIPI while exploring the correlation between phase noise and jitter. This updated resource provides expanded material on 28/32 Gbps NRZ testing and wireless testing that are becoming increasingly more pertinent for future applications. This book explores the current trend of merging high-speed digital testing within the fields of photonic and wireless testing.
Author: Jung Han Choi
Publisher: CRC Press
ISBN: 1466590122
Category : Science
Languages : en
Pages : 258
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Book Description
Presenting the cutting-edge results of new device developments and circuit implementations, High-Speed Devices and Circuits with THz Applications covers the recent advancements of nano devices for terahertz (THz) applications and the latest high-speed data rate connectivity technologies from system design to integrated circuit (IC) design, providing relevant standard activities and technical specifications. Featuring the contributions of leading experts from industry and academia, this pivotal work: Discusses THz sensing and imaging devices based on nano devices and materials Describes silicon on insulator (SOI) multigate nanowire field-effect transistors (FETs) Explains the theory underpinning nanoscale nanowire metal-oxide-semiconductor field-effect transistors (MOSFETs), simulation methods, and their results Explores the physics of the silicon-germanium (SiGe) heterojunction bipolar transistor (HBT), as well as commercially available SiGe HBT devices and their applications Details aspects of THz IC design using standard silicon (Si) complementary metal-oxide-semiconductor (CMOS) devices, including experimental setups for measurements, detection methods, and more An essential text for the future of high-frequency engineering, High-Speed Devices and Circuits with THz Applications offers valuable insight into emerging technologies and product possibilities that are attractive in terms of mass production and compatibility with current manufacturing facilities.
Author: Brajesh Kumar Kaushik
Publisher: Springer
ISBN: 9811074704
Category : Computers
Languages : en
Pages : 820
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Book Description
This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions. The papers were organized in topical sections named: digital design; analog/mixed signal; VLSI testing; devices and technology; VLSI architectures; emerging technologies and memory; system design; low power design and test; RF circuits; architecture and CAD; and design verification.
Author: Istvan Nagy
Publisher: CRC Press
ISBN: 1040011799
Category : Computers
Languages : en
Pages : 618
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Book Description
This book is about how to design the most complex types of digital circuit boards used inside servers, routers and other equipment, from high-level system architecture down to the low-level signal integrity concepts. It explains common structures and subsystems that can be expanded into new designs in different markets. The book is targeted at all levels of hardware engineers. There are shorter, lower-level introductions to every topic, while the book also takes the reader all they way to the most complex and most advanced topics of digital circuit design, layout design, analysis, and hardware architecture.
Author: Stephen H. Hall
Publisher: Wiley-IEEE Press
ISBN:
Category : Computers
Languages : en
Pages : 376
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Book Description
The importance of interconnect design - Ideal transmission line fundamentals - Crosstalk - Nonideal interconnect issues - Connectors, packages, and vias - Nonideal return paths, simultaneous switching noise, and power delivery - Buffer modeling - Digital timing analysis - Design methodologies - Radiated emissions compliance and system noise minimization - High-speed measurement techniques.
Author: Anatoly Belous
Publisher: Springer Nature
ISBN: 3030254097
Category : Technology & Engineering
Languages : en
Pages : 961
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Book Description
This book describes for readers the entire, interconnected complex of theoretical and practical aspects of designing and organizing the production of various electronic devices, the general and main distinguishing feature of which is the high speed of processing and transmitting of digital signals. The authors discuss all the main stages of design - from the upper system level of the hierarchy (telecommunications system, 5G mobile communications) to the lower level of basic semiconductor elements, printed circuit boards. Since the developers of these devices in practice deal with distorted digital signals that are transmitted against a background of interference, the authors not only explain the physical nature of such effects, but also offer specific solutions as to how to avoid such parasitic effects, even at the design stage of high-speed devices.
