High-Speed Circuit Board Signal Integrity, Second Edition PDF Download
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Author: Stephen C. Thierauf
Publisher: Artech House
ISBN: 163081444X
Category : Technology & Engineering
Languages : en
Pages : 321
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Book Description
This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.
Author: Stephen C. Thierauf
Publisher: Artech House
ISBN: 163081444X
Category : Technology & Engineering
Languages : en
Pages : 321
Get Book Here
Book Description
This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.
Author: Stephen C. Thierauf
Publisher: Artech House
ISBN: 9781580538466
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
This leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise circuit design. Discusses both design and debug issues at gigabit per second data rates.
Author: Stephen H. Hall
Publisher: John Wiley & Sons
ISBN: 1118210689
Category : Science
Languages : en
Pages : 608
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Book Description
A synergistic approach to signal integrity for high-speed digital design This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications. Following an introduction to the importance of signal integrity, chapter coverage includes: Electromagnetic fundamentals for signal integrity Transmission line fundamentals Crosstalk Non-ideal conductor models, including surface roughness and frequency-dependent inductance Frequency-dependent properties of dielectrics Differential signaling Mathematical requirements of physical channels S-parameters for digital engineers Non-ideal return paths and via resonance I/O circuits and models Equalization Modeling and budgeting of timing jitter and noise System analysis using response surface modeling Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.
Author: Douglas Brooks
Publisher: Prentice Hall Professional
ISBN: 9780131418844
Category : Computers
Languages : en
Pages : 418
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Book Description
Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.
Author: Stephen C. Thierauf
Publisher: Artech House Publishers
ISBN: 9781596939813
Category : Technology & Engineering
Languages : en
Pages : 239
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Book Description
This unique book provides you with practical guidance on understanding and interpreting signal integrity (SI) performance to help you with your challenging circuit board design projects. You find high-level discussions of important SI concepts presented in a clear and easily accessible format, including question and answer sections and bulleted lists. This valuable resource features rules of thumb and simple equations to help you make estimates of critical signal integrity parameters without using circuit simulators of CAD (computer-aided design). The book is supported with over 120 illustrations, nearly 100 equations, and detailed reference lists at the end of each chapter.
Author: Madhavan Swaminathan
Publisher: Pearson Education
ISBN: 0132797178
Category : Technology & Engineering
Languages : en
Pages : 599
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Book Description
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Author: Inder J. Bahl
Publisher: Artech House
ISBN: 1630819336
Category : Technology & Engineering
Languages : en
Pages : 593
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Book Description
Fully updated and including entirely new chapters, this Second Edition provides in-depth coverage of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Featuring extensive formulas for lumped elements, design trade-offs, and an updated and current list of references, the book helps you understand the value and usefulness of lumped elements in the design of RF, microwave and millimeter wave components and circuits. You’ll find a balanced treatment between standalone lumped elements and their circuits using MICs, MMICs and RFICs technologies. You’ll also find detailed information on a broader range RFICs that was not available when the popular first edition was published. The book captures – in one consolidated volume -- the fundamentals, equations, modeling, examples, references and overall procedures to design, test and produce microwave components that are indispensable in industry and academia today. With its superb organization and expanded coverage of the subject, this is a must-have, go-to resource for practicing engineers and researchers in industry, government and university and microwave engineers working in the antenna area. Students will also find it a useful reference with its clear explanations, many examples and practical modeling guidelines.
Author: Eric Bogatin
Publisher: Pearson Education
ISBN: 0132349795
Category : Technology & Engineering
Languages : en
Pages : 793
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Book Description
With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.
Author: Eric Bogatin
Publisher: Artech House
ISBN: 1630816922
Category : Technology & Engineering
Languages : en
Pages : 603
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Book Description
This multimedia eBook establishes a solid foundation in the essential principles of how signals interact with transmission lines, how the physical design of interconnects affects transmission line properties, and how to interpret single-ended and differential time domain reflection (TDR) measurements to extract important figures of merits and avoid common mistakes. This book presents an intuitive understanding of transmission lines. Instructional videos are provided in every chapter that cover important aspects of the interconnect design and characterization process. This video eBook helps establish foundations for designing and characterizing the electrical properties of interconnects to explain in a simplified way how signals propagate and interact with interconnects and how the physical design of transmission structures will impact performance. Never be intimidated by impedance or differential pairs again.
Author: Kaixue Ma
Publisher: Artech House
ISBN: 1685690300
Category : Technology & Engineering
Languages : en
Pages : 305
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Book Description
Substrate Integrated Suspended Line Circuits and Systems provides a systematic overview of the new transmission line - the substrate-integrated suspension line (SISL). It details the fundamentals and classical application examples of the SISL. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems are systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideal for researchers, engineers, scientists, scholars, educators, and students. Since transmission line is a fundamental component of microwave and mm-wave circuits, the properties of a transmission line, such as losses, size, and dispersion, are vital to the performance of the whole system. Suspended line has been proved to be an excellent transmission line, as it has attractive features such as low loss, weak dispersion, high power capacity, and low effective dielectric constant. However, Conventional waveguide suspended line circuits require metal housing to form air cavities which is Substrate Integrated Suspended Line Circuits and Systems essential to the operation of suspended lines circuits. Also, the metal shell should provide mechanical support and shielding, which contribute to large size and heavy weight. Meanwhile, precise mechanical fabrication and assembling are strongly required, which brings difficulties to the design and fabrication of conventional suspended line circuits, and the manufacturing cost of suspended line circuits increases correspondingly. In this book, we will introduce a new platform of high-performance transmission line, i.e. substrate integrated suspended line (SISL). SISL keeps all the merits of the suspended line while overcomes the drawbacks of conventional waveguide suspended line circuits. Moreover, it is self-packaged and highly integrated. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems will be systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideally designed for researchers, engineers, scientists, scholars, educators, and students.
