Handbook of VLSI Microlithography, 2nd Edition PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Handbook of VLSI Microlithography, 2nd Edition PDF full book. Access full book title Handbook of VLSI Microlithography, 2nd Edition by John N. Helbert. Download full books in PDF and EPUB format.
Author: John N. Helbert
Publisher: Cambridge University Press
ISBN: 0080946801
Category : Technology & Engineering
Languages : en
Pages : 1026
Get Book Here
Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: John N. Helbert
Publisher: Cambridge University Press
ISBN: 0080946801
Category : Technology & Engineering
Languages : en
Pages : 1026
Get Book Here
Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: William B. Glendinning
Publisher: William Andrew
ISBN: 1437728227
Category : Technology & Engineering
Languages : en
Pages : 672
Get Book Here
Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: P. Rai-Choudhury
Publisher: IET
ISBN: 9780852969069
Category : Technology & Engineering
Languages : en
Pages : 784
Get Book Here
Book Description
Focusing on the use of microlithography techniques in microelectronics manufacturing, this volume is one of a series addressing a rapidly growing field affecting the integrated circuit industry. New applications in such areas as sensors, actuators and biomedical devices, are described.
Author: Paul H. Holloway
Publisher: Cambridge University Press
ISBN: 0080946143
Category : Technology & Engineering
Languages : en
Pages : 937
Get Book Here
Book Description
This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.
Author: R.J. Shul
Publisher: Springer Science & Business Media
ISBN: 3642569897
Category : Technology & Engineering
Languages : en
Pages : 664
Get Book Here
Book Description
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Author: Stephen Caniglia
Publisher: William Andrew
ISBN: 0815517564
Category : Technology & Engineering
Languages : en
Pages : 651
Get Book Here
Book Description
Encompasses the entire range of industrial refractory materials and forms: properties and their measurement, applications, manufacturing, installation and maintenance techniques, quality assurance, and statistical process control.
Author: Jon Orloff
Publisher: CRC Press
ISBN: 1420045555
Category : Science
Languages : en
Pages : 666
Get Book Here
Book Description
With the growing proliferation of nanotechnologies, powerful imaging technologies are being developed to operate at the sub-nanometer scale. The newest edition of a bestseller, the Handbook of Charged Particle Optics, Second Edition provides essential background information for the design and operation of high resolution focused probe instruments. The book’s unique approach covers both the theoretical and practical knowledge of high resolution probe forming instruments. The second edition features new chapters on aberration correction and applications of gas phase field ionization sources. With the inclusion of additional references to past and present work in the field, this second edition offers perfectly calibrated coverage of the field’s cutting-edge technologies with added insight into how they work. Written by the leading research scientists, the second edition of the Handbook of Charged Particle Optics is a complete guide to understanding, designing, and using high resolution probe instrumentation.
Author: James J. Licari
Publisher: Elsevier
ISBN: 081551798X
Category : Technology & Engineering
Languages : en
Pages : 603
Get Book Here
Book Description
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Author: Hugh O. Pierson
Publisher: William Andrew
ISBN: 0815517394
Category : Technology & Engineering
Languages : en
Pages : 420
Get Book Here
Book Description
This book is a review of the science and technology of the element carbon and its allotropes: graphite, diamond and the fullerenes. This field has expanded greatly in the last three decades stimulated by many major discoveries such as carbon fibers, low-pressure diamond, and the fullerenes. The need for such a book has been felt for some time. These carbon materials are very different in structure and properties. Some are very old (charcoal), others brand new (the fullerenes). They have different applications and markets and are produced by different segments of the industry.Few studies are available that attempt to review the entire field of carbon as a whole discipline. Moreover these studies were written several decades ago and a generally outdated since the development of the technology is moving very rapidly and scope of applications is constantly expanding and reaching into new fields such as aerospace, automotive, semiconductors, optics, and electronics. In this book the author provides a valuable, up-to-date account of both the newer and traditional forms of carbon, both naturally occurring and man-made. This volume will be a valuable resource for both specialists in, and occasional users of carbon materials.
Author: Hugh O. Pierson
Publisher: William Andrew
ISBN: 081551770X
Category : Technology & Engineering
Languages : en
Pages : 363
Get Book Here
Book Description
Refractory carbides and nitrides are useful materials with numerous industrial applications and a promising future, in addition to being materials of great interest to the scientific community. Although most of their applications are recent, the refractory carbides and nitrides have been known for over one hundred years. The industrial importance of the refractory carbides and nitrides is growing rapidly, not only in the traditional and well-established applications based on the strength and refractory nature of these materials such as cutting tools and abrasives, but also in new and promising fields such as electronics and optoelectronics.
