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Author: Walter Soroka
Publisher:
ISBN:
Category :
Languages : en
Pages : 548
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Book Description
Author: Walter Soroka
Publisher:
ISBN:
Category :
Languages : en
Pages : 548
Get Book Here
Book Description
Author: Anne Emblem
Publisher: Elsevier
ISBN: 0857095706
Category : Technology & Engineering
Languages : en
Pages : 601
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Book Description
Packaging is a complex and wide-ranging subject. Comprehensive in scope and authoritative in its coverage, Packaging technology provides the ideal introduction and reference for both students and experienced packaging professionals.Part one provides a context for the book, discussing fundamental issues relating to packaging such as its role in society and its diverse functions, the packaging supply chain and legislative, environmental and marketing issues. Part two reviews the principal packaging materials such as glass, metal, plastics, paper and paper board. It also discusses closures, adhesives and labels. The final part of the book discusses packaging processes, from design and printing to packaging machinery and line operations, as well as hazard and risk management in packaging.With its distinguished editors and expert contributors, Packaging technology is a standard text for the packaging industry. The book is designed both to meet the needs of those studying for the Diploma in Packaging Technology and to act as a comprehensive reference for packaging professionals. - Provides the ideal introduction and reference for both students and experienced packaging professionals - Examines fundamental issues relating to packaging, such as its role in society, its diverse functions, the packaging supply chain and legislative, environmental and marketing issues - Reviews the principal packaging materials such as glass, metal, plastics, paper and paper board
Author: Institute of Packaging Professionals
Publisher:
ISBN: 9780615709345
Category : Containers
Languages : en
Pages : 748
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Book Description
Author: Walter Soroka
Publisher: DEStech Publications, Inc
ISBN: 1930268270
Category : Emballage
Languages : en
Pages : 273
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Book Description
Comprising over 4,500 definitions, this book provides explanation of the often arcane, English-language terminology that denotes the materials and manufacturing processes used in different phases of the packaging industry. It is suitable for those who use packaging technology.
Author: S. NATARAJAN
Publisher: PHI Learning Pvt. Ltd.
ISBN: 8120350545
Category : Technology & Engineering
Languages : en
Pages : 161
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Book Description
In the current market scenario, packaging provides the most important first point of contact by which a company presents its products to consumers. Though packaging has to perform functions such as product protection and preservation, it is now being accepted as a value addition process. This compact textbook is designed primarily for the undergraduate students of printing technology and mechanical engineering. The text introduces the concepts and techniques relevant to packaging of industrial, pharmaceutical and food products. It covers the package design concepts with emphasis on graphics and colours, as innovation in packaging is taking place at a rapid pace due to the competition among brands for shelf appeal and space. Besides, it also discusses importance of glass as a packaging material, label types and their design, bulk packaging and test procedures on package to evaluate its worthiness in distribution and storage. In the second edition, the book has been updated wherever necessary. Chapter 7 on “Plastics and Speciality Packaging” has been completely overhauled and split to introduce a new chapter on “Package Finishing and Security (Chapter 8). Thus, in contrast to eight chapters of the previous edition, the book now comprises total nine chapters. Besides undergraduate students, this book will also be useful for diploma students of packaging, researchers and professionals in printing and packaging field. Key Features • A Case Study lends a practical orientation towards the subject of study. • Review questions, arranged in a graded manner, sharpen the analytical skills of the students. • Solved problems reinforce the understanding of the subject.
Author: Yufeng Jin
Publisher: CRC Press
ISBN: 1439865973
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979
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Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: Jung H. Han
Publisher: Academic Press
ISBN: 0123948355
Category : Technology & Engineering
Languages : en
Pages : 624
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Book Description
This new edition of Innovations in Food Packaging ensures that readers have the most current information on food packaging options, including active packaging, intelligent packaging, edible/biodegradable packaging, nanocomposites and other options for package design. Today's packaging not only contains and protects food, but where possible and appropriate, it can assist in inventory control, consumer education, increased market availability and shelf life, and even in ensuring the safety of the food product. As nanotechnology and other technologies have developed, new and important options for maximizing the role of packaging have emerged. This book specifically examines the whole range of modern packaging options. It covers edible packaging based on carbohydrates, proteins, and lipids, antioxidative and antimicrobial packaging, and chemistry issues of food and food packaging, such as plasticization and polymer morphology. Professionals involved in food safety and shelf life, as well as researchers and students of food science, will find great value in this complete and updated overview. - Over 60% updated content — including nine completely new chapters — with the latest developments in technology, processes and materials - Now includes bioplastics, biopolymers, nanoparticles, and eco-design of packaging
Author: Sina Ebnesajjad
Publisher: William Andrew
ISBN: 1455731153
Category : Technology & Engineering
Languages : en
Pages : 413
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Book Description
The value of the groceries purchases in the USA is over $500 billion annually, most of which is accounted for by packaged foods. Plastic packaging of foods is not only ubiquitous in developed economies, but increasingly commonplace in the developing world, where plastic packaging is instrumental in decreasing the proportion of the food supply lost to spoilage. This new handbook is a combination of new material and updated chapters, chosen by Dr. Sina Ebnesajjad, from recently published books on this subject. Plastic Films in Food Packaging offers a practical handbook for engineers, scientists and managers working in the food packaging industry, providing a tailor-made package of science and engineering fundamentals, best practice techniques and guidance on new and emerging technologies. By covering materials, design, packaging processes, machinery and waste management together in one book, the authors enable the reader to take a lifecycle approach to food packaging. The Handbook addresses questions related to film grades, types of packages for different types of foods, packaging technologies, machinery and waste management. Additionally the book provides a review of new and emerging technologies. Two chapters cover the development of barrier films for food packaging and the regulatory and safety aspects of food packaging. - Essential information and practical guidance for engineers and scientists working at all stages of the food packaging lifecycle: from design through manufacture to recycling - Includes key published material on plastic films in food packaging, updated specifically for this Handbook, and new material on the regulatory framework and safety aspects - Coverage of materials and applications together in one handbook enables engineers and scientists to make informed design and manufacturing decisions
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 1259861562
Category : Technology & Engineering
Languages : en
Pages : 849
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Book Description
A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field
