Directions of Heat Transfer in Electronic Equipment PDF Download
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Author: National Science Foundation
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: National Science Foundation
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: Cornell Aeronautical Laboratory
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 220
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Author: United States. Navy Department. Bureau of Ships
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 220
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Author: Sung Jin Kim
Publisher: CRC Press
ISBN: 1000151743
Category : Technology & Engineering
Languages : en
Pages : 264
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Book Description
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Author: Ralph Remsburg
Publisher: Springer Science & Business Media
ISBN: 9780412122712
Category : Computers
Languages : en
Pages : 632
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Book Description
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Author: A. D. Kraus
Publisher:
ISBN:
Category :
Languages : en
Pages : 152
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Author: Avram Bar-Cohen
Publisher:
ISBN:
Category : Electronc apparatus and appliances
Languages : en
Pages : 264
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Author: James P. Welsh
Publisher:
ISBN:
Category : Airplanes
Languages : en
Pages : 220
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Author: John H. Seely
Publisher: Marcel Dekker
ISBN:
Category : Science
Languages : en
Pages : 368
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Author: United States. Ships Bureau
Publisher:
ISBN:
Category : Airplanes
Languages : en
Pages : 208
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