Characterization of Integrated Circuit Packaging Materials PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Characterization of Integrated Circuit Packaging Materials PDF full book. Access full book title Characterization of Integrated Circuit Packaging Materials by Thomas Moore. Download full books in PDF and EPUB format.
Author: Thomas Moore
Publisher: Elsevier
ISBN: 1483292347
Category : Technology & Engineering
Languages : en
Pages : 293
Get Book Here
Book Description
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Author: Thomas Moore
Publisher: Elsevier
ISBN: 1483292347
Category : Technology & Engineering
Languages : en
Pages : 293
Get Book Here
Book Description
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Author: William Greig
Publisher: Springer Science & Business Media
ISBN: 0387339132
Category : Technology & Engineering
Languages : en
Pages : 312
Get Book Here
Book Description
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
ISBN: 1461549191
Category : Technology & Engineering
Languages : en
Pages : 256
Get Book Here
Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Author: EDFAS Desk Reference Committee
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673
Get Book Here
Book Description
Includes bibliographical references and index.
Author:
Publisher: ASM International
ISBN: 0871708043
Category : Technology & Engineering
Languages : en
Pages : 813
Get Book Here
Book Description
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Author: Tejinder Gandhi
Publisher: ASM International
ISBN: 1627082468
Category : Technology & Engineering
Languages : en
Pages : 719
Get Book Here
Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author: Yong Liu
Publisher: Springer Science & Business Media
ISBN: 1461410533
Category : Technology & Engineering
Languages : en
Pages : 606
Get Book Here
Book Description
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author: Charles A. Evans
Publisher: Gulf Professional Publishing
ISBN: 9780750691680
Category : Science
Languages : en
Pages : 784
Get Book Here
Book Description
"This is a comprehensive volume on analytical techniques used in materials science for the characterization of surfaces, interfaces and thin films. This flagship volume is a unique, stand-alone reference for materials science practitioners, process engineers, students and anyone with a need to know about the capabilities available in materials analysis. An encyclopedia of 50 concise articles, this book will also be a practical companion to the forthcoming books in the series."--Knovel.
Author: John Wolstenholme
Publisher: Momentum Press
ISBN: 160650682X
Category : Technology & Engineering
Languages : en
Pages : 217
Get Book Here
Book Description
This book discusses the use of AES and SAM for the characterization of a wide range of technological materials. These include metals and alloys, semiconductors, nanostructures, and insulators. Its value as a tool for high-resolution elemental imaging and compositional depth profiling is illustrated. The application of the technique for obtaining compositional information from the surfaces, interfaces, and thin film structures of technological and engineering materials is demonstrated. This volume also describes the basic physical principles of AES in simple, largely qualitative, terms understandable by any undergraduate science or engineering student. Major components of typical Auger spectrometers are also described because an understanding of the instrumentation is important to anyone wishing to become a skilled analyst. Mention is also made of other types of analysis for which an Auger electron spectrometer may be used, for example, secondary electron microscopy, backscattered electron imaging, X-ray spectroscopy. The relationship between AES and other analysis techniques is also discussed.
Author: Navid Asadizanjani
Publisher: Springer Nature
ISBN: 3030626091
Category : Technology & Engineering
Languages : en
Pages : 193
Get Book Here
Book Description
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
