Characterization of Integrated Circuit Packaging Materials PDF Download
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Author: Thomas Moore
Publisher: Elsevier
ISBN: 1483292347
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Author: Thomas Moore
Publisher: Elsevier
ISBN: 1483292347
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Author: William Greig
Publisher: Springer Science & Business Media
ISBN: 0387339132
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author: Yong Liu
Publisher: Springer Science & Business Media
ISBN: 1461410533
Category : Technology & Engineering
Languages : en
Pages : 606
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Book Description
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
ISBN: 1461549191
Category : Technology & Engineering
Languages : en
Pages : 256
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Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Author: X.J. Fan
Publisher: Springer Science & Business Media
ISBN: 1441957197
Category : Technology & Engineering
Languages : en
Pages : 573
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Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author: Xingyou Tian
Publisher: John Wiley & Sons
ISBN: 3527843108
Category : Technology & Engineering
Languages : en
Pages : 373
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Book Description
Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 888
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Book Description
Author: Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems
Publisher: National Academies Press
ISBN: 0309591511
Category : Technology & Engineering
Languages : en
Pages : 76
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Book Description
Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.
Author: Smita Krishnaswamy
Publisher: Springer Science & Business Media
ISBN: 9048196434
Category : Technology & Engineering
Languages : en
Pages : 130
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Book Description
Logic circuits are becoming increasingly susceptible to probabilistic behavior caused by external radiation and process variation. In addition, inherently probabilistic quantum- and nano-technologies are on the horizon as we approach the limits of CMOS scaling. Ensuring the reliability of such circuits despite the probabilistic behavior is a key challenge in IC design---one that necessitates a fundamental, probabilistic reformulation of synthesis and testing techniques. This monograph will present techniques for analyzing, designing, and testing logic circuits with probabilistic behavior.
Author: Atul Tiwari
Publisher: John Wiley & Sons
ISBN: 1119117704
Category : Technology & Engineering
Languages : en
Pages : 660
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Book Description
Strong bonds form stronger materials. For this reason, the investigation on thermal degradation of materials is a significantly important area in research and development activities. The analysis of thermal stability can be used to assess the behavior of materials in the aggressive environmental conditions, which in turn provides valuable information about the service life span of the materiel. Unlike other books published so far that have focused on either the fundamentals of thermal analysis or the degradation pattern of the materials, this book is specifically on the mechanism of degradation of materials. The mechanism of rapturing of chemical bonds as a result of exposure to high-temperature environment is difficult to study and resulting mechanistic pathway hard to establish. Limited information is available on this subject in the published literatures and difficult to excavate. Chapters in this book are contributed by the experts working on thermal degradation and analysis of the wide variety of advanced and traditional materials. Each chapter discusses the material, its possible application, behavior of chemical entities when exposed to high-temperature environment and mode and the mechanistic route of its decomposition. Such information is crucial while selecting the chemical ingredients during the synthesis or development of new materials technology.
