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Author: Khaled Salah
Publisher: Springer
ISBN: 3319076116
Category : Technology & Engineering
Languages : en
Pages : 181
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Book Description
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Author: Khaled Salah
Publisher: Springer
ISBN: 3319076116
Category : Technology & Engineering
Languages : en
Pages : 181
Get Book Here
Book Description
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Author: Lennart Bamberg
Publisher: Springer Nature
ISBN: 3030982297
Category : Technology & Engineering
Languages : en
Pages : 403
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Book Description
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Author: Khaled Salah Mohamed
Publisher: Springer Nature
ISBN: 3030372243
Category : Technology & Engineering
Languages : en
Pages : 241
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Book Description
This book discusses and compares several new trends that can be used to overcome Moore’s law limitations, including Neuromorphic, Approximate, Parallel, In Memory, and Quantum Computing. The author shows how these paradigms are used to enhance computing capability as developers face the practical and physical limitations of scaling, while the demand for computing power keeps increasing. The discussion includes a state-of-the-art overview and the essential details of each of these paradigms.
Author: Yoni Van Den Eede
Publisher: Lexington Books
ISBN: 1498550150
Category : Philosophy
Languages : en
Pages : 295
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Book Description
Postphenomenology and Media: Essays on Human–Media–World Relations sheds light on how new, digital media are shaping humans and their world. It does so by using the postphenomenological framework to comprehensively study “human-media relations,” making use of conceptual instruments such as the transparency-opacity distinction, embodiment, multistability, variational analysis, and cultural hermeneutics. This collection outlines central issues of media and mediation theory that can be explored postphenomenologically and showcases research at the cutting edge of philosophy of media and technology. The contributors together enlarge the range of thinking about human-media-world relations in contemporary society, reflecting the interdisciplinary range of this school of thought, and explore, sometimes self-reflexively and sometimes critically, the provocative landscape of postphenomenology and media.
Author: Yongke Sun
Publisher: Springer Science & Business Media
ISBN: 1441905529
Category : Technology & Engineering
Languages : en
Pages : 353
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Book Description
Strain Effect in Semiconductors: Theory and Device Applications presents the fundamentals and applications of strain in semiconductors and semiconductor devices that is relevant for strain-enhanced advanced CMOS technology and strain-based piezoresistive MEMS transducers. Discusses relevant applications of strain while also focusing on the fundamental physics pertaining to bulk, planar, and scaled nano-devices. Hence, this book is relevant for current strained Si logic technology as well as for understanding the physics and scaling for future strained nano-scale devices.
Author: Jens Lienig
Publisher: Springer
ISBN: 3319735586
Category : Technology & Engineering
Languages : en
Pages : 171
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Book Description
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Author: Mohammad Abdullah Al Faruque
Publisher: Springer
ISBN: 3030130509
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
This book presents the state-of-the-art and breakthrough innovations in design automation for cyber-physical systems.The authors discuss various aspects of cyber-physical systems design, including modeling, co-design, optimization, tools, formal methods, validation, verification, and case studies. Coverage includes a survey of the various existing cyber-physical systems functional design methodologies and related tools will provide the reader unique insights into the conceptual design of cyber-physical systems.
Author: Giovanni De Micheli
Publisher: Elsevier
ISBN: 0080473563
Category : Technology & Engineering
Languages : en
Pages : 408
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Book Description
The design of today's semiconductor chips for various applications, such as telecommunications, poses various challenges due to the complexity of these systems. These highly complex systems-on-chips demand new approaches to connect and manage the communication between on-chip processing and storage components and networks on chips (NoCs) provide a powerful solution. This book is the first to provide a unified overview of NoC technology. It includes in-depth analysis of all the on-chip communication challenges, from physical wiring implementation up to software architecture, and a complete classification of their various Network-on-Chip approaches and solutions.* Leading-edge research from world-renowned experts in academia and industry with state-of-the-art technology implementations/trends* An integrated presentation not currently available in any other book* A thorough introduction to current design methodologies and chips designed with NoCs
Author: Yuan Xie
Publisher: Springer Science & Business Media
ISBN: 144190784X
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
