ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis PDF Download
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Author: ASM International
Publisher: ASM International
ISBN: 1627080996
Category : Technology & Engineering
Languages : en
Pages : 593
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Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author: ASM International
Publisher: ASM International
ISBN: 1627080996
Category : Technology & Engineering
Languages : en
Pages : 593
Get Book Here
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author: ASM International
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
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Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: ASM International
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages : 666
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Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Author: Cher Ming Tan
Publisher: Woodhead Publishing
ISBN: 012822407X
Category : Technology & Engineering
Languages : en
Pages : 190
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Book Description
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author: Shahin Tajik
Publisher: Springer
ISBN: 3319758209
Category : Technology & Engineering
Languages : en
Pages : 91
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Book Description
This book investigates the susceptibility of intrinsic physically unclonable function (PUF) implementations on reconfigurable hardware to optical semi-invasive attacks from the chip backside. It explores different classes of optical attacks, particularly photonic emission analysis, laser fault injection, and optical contactless probing. By applying these techniques, the book demonstrates that the secrets generated by a PUF can be predicted, manipulated or directly probed without affecting the behavior of the PUF. It subsequently discusses the cost and feasibility of launching such attacks against the very latest hardware technologies in a real scenario. The author discusses why PUFs are not tamper-evident in their current configuration, and therefore, PUFs alone cannot raise the security level of key storage. The author then reviews the potential and already implemented countermeasures, which can remedy PUFs’ security-related shortcomings and make them resistant to optical side-channel and optical fault attacks. Lastly, by making selected modifications to the functionality of an existing PUF architecture, the book presents a prototype tamper-evident sensor for detecting optical contactless probing attempts.
Author: Markku Tilli
Publisher: Elsevier
ISBN: 012817787X
Category : Technology & Engineering
Languages : en
Pages : 1028
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Book Description
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Author: Katsuyuki Sakuma
Publisher: CRC Press
ISBN: 1351779834
Category : Technology & Engineering
Languages : en
Pages : 217
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Book Description
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Author: Elias G. Strangas
Publisher: John Wiley & Sons
ISBN: 1119722780
Category : Technology & Engineering
Languages : en
Pages : 448
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Book Description
Fault Diagnosis, Prognosis, and Reliability for Electrical Machines and Drives An insightful treatment of present and emerging technologies in fault diagnosis and failure prognosis In Fault Diagnosis, Prognosis, and Reliability for Electrical Machines and Drives, a team of distinguished researchers delivers a comprehensive exploration of current and emerging approaches to fault diagnosis and failure prognosis of electrical machines and drives. The authors begin with foundational background, describing the physics of failure, the motor and drive designs and components that affect failure and signals, signal processing, and analysis. The book then moves on to describe the features of these signals and the methods commonly used to extract these features to diagnose the health of a motor or drive, as well as the methods used to identify the state of health and differentiate between possible faults or their severity. Fault Diagnosis, Prognosis, and Reliability for Electrical Machines and Drives discusses the tools used to recognize trends towards failure and the estimation of remaining useful life. It addresses the relationships between fault diagnosis, failure prognosis, and fault mitigation. The book also provides: A thorough introduction to the modes of failure, how early failure precursors manifest themselves in signals, and how features extracted from these signals are processed A comprehensive exploration of the fault diagnosis, the results of characterization, and how they used to predict the time of failure and the confidence interval associated with it A focus on medium-sized drives, including induction, permanent magnet AC, reluctance, and new machine and drive types Perfect for researchers and students who wish to study or practice in the rea of electrical machines and drives, Fault Diagnosis, Prognosis, and Reliability for Electrical Machines and Drives is also an indispensable resource for researchers with a background in signal processing or statistics.
Author: Tibor Grasser
Publisher: Springer Nature
ISBN: 3030375005
Category : Technology & Engineering
Languages : en
Pages : 724
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Book Description
This book summarizes the state-of-the-art, regarding noise in nanometer semiconductor devices. Readers will benefit from this leading-edge research, aimed at increasing reliability based on physical microscopic models. Authors discuss the most recent developments in the understanding of point defects, e.g. via ab initio calculations or intricate measurements, which have paved the way to more physics-based noise models which are applicable to a wider range of materials and features, e.g. III-V materials, 2D materials, and multi-state defects. Describes the state-of-the-art, regarding noise in nanometer semiconductor devices; Enables readers to design more reliable semiconductor devices; Offers the most up-to-date information on point defects, based on physical microscopic models.
Author: Navid Asadizanjani
Publisher: Elsevier
ISBN: 0443185433
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing
