Thin-Films-Stresses and Mechanical Properties VII: PDF Download
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Author: Robert C. Cammarata
Publisher: Cambridge University Press
ISBN: 9781558994102
Category : Technology & Engineering
Languages : en
Pages : 646
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Book Description
Mechanical behavior in thin films continues to be a growing field of interest in the materials research community. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. Examples of affected areas include semiconductor and magnetic recording technology, as well as protective and hard-coating technology. As a result, it is important to study fundamental issues involved in film-substrate adhesion, the development of intrinsic stresses and the mechanisms of plastic deformation, strain relaxation, and fracture in thin films. This book addresses issues towards improving existing, as well as developing new, mechanical property characterization techniques such as more sensitive ultrasonic methods for elastic behavior determination and low-load indentation methods to investigate yield, creep, and fracture behavior. Experimental, theoretical and modelling work is presented. Topics include: novel testing methods; low-load indentation; metallization and reliability; structural and mechanical stability; surface and tribological properties; adhesion; deformation mechanisms; stresses in thin films - generation mechanisms and measurement techniques; multilayered and superlattice thin films and structure/property/processing relationships.
Author: Robert C. Cammarata
Publisher: Cambridge University Press
ISBN: 9781558994102
Category : Technology & Engineering
Languages : en
Pages : 646
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Book Description
Mechanical behavior in thin films continues to be a growing field of interest in the materials research community. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. Examples of affected areas include semiconductor and magnetic recording technology, as well as protective and hard-coating technology. As a result, it is important to study fundamental issues involved in film-substrate adhesion, the development of intrinsic stresses and the mechanisms of plastic deformation, strain relaxation, and fracture in thin films. This book addresses issues towards improving existing, as well as developing new, mechanical property characterization techniques such as more sensitive ultrasonic methods for elastic behavior determination and low-load indentation methods to investigate yield, creep, and fracture behavior. Experimental, theoretical and modelling work is presented. Topics include: novel testing methods; low-load indentation; metallization and reliability; structural and mechanical stability; surface and tribological properties; adhesion; deformation mechanisms; stresses in thin films - generation mechanisms and measurement techniques; multilayered and superlattice thin films and structure/property/processing relationships.
Author: Richard Vinci
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 576
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Robert C. Cammarata
Publisher: Cambridge University Press
ISBN: 9781558994102
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
Mechanical behavior in thin films continues to be a growing field of interest in the materials research community. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. Examples of affected areas include semiconductor and magnetic recording technology, as well as protective and hard-coating technology. As a result, it is important to study fundamental issues involved in film-substrate adhesion, the development of intrinsic stresses and the mechanisms of plastic deformation, strain relaxation, and fracture in thin films. This book addresses issues towards improving existing, as well as developing new, mechanical property characterization techniques such as more sensitive ultrasonic methods for elastic behavior determination and low-load indentation methods to investigate yield, creep, and fracture behavior. Experimental, theoretical and modelling work is presented. Topics include: novel testing methods; low-load indentation; metallization and reliability; structural and mechanical stability; surface and tribological properties; adhesion; deformation mechanisms; stresses in thin films - generation mechanisms and measurement techniques; multilayered and superlattice thin films and structure/property/processing relationships.
Author: Christopher L. Muhlstein
Publisher: ASTM International
ISBN: 0803128894
Category : Gold films
Languages : en
Pages : 333
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Book Description
Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 544
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Thomas E. Buchheit
Publisher: Cambridge University Press
ISBN: 9781107408937
Category : Technology & Engineering
Languages : en
Pages : 472
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Book Description
This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.
Author: William D. Nix
Publisher:
ISBN:
Category :
Languages : en
Pages : 714
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Book Description
This volume consists of eight parts. Papers based on both oral and poster presentations are arranged according to these eight topics. The book begins with papers dealing with microstructural processes and intrinsic stresses in thin films. This is followed by papers on the stresses themselves and on thin film deformation processes. Mechanical testing techniques and the mechanical properties of thin films are presented next. Because indentation has become so important in the study of thin film mechanical properties, a special part of the symposium was devoted to modelling and experiments in indentation. The volume also includes a series of papers on the stresses and mechanical properties of multilayers, focusing mainly on metal multilayers with layer dimensions in the nanometer range. Strain relaxation in heteroepitaxial thin films by the formation of misfit dislocations continues to be one of the important research areas in this field, so a part of this volume is devoted to that topic. The last topics in the volume deal with failure processes in thin films. Papers on adhesion and fracture properties of thin films are grouped together in part VII. The last part of the book deals with the phenomena of electromigration and stress induced voiding in interconnect metal films.
Author:
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 480
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Book Description
Author: Paul H. Townsend
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 808
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Devendra Gupta
Publisher: Springer Science & Business Media
ISBN: 9780080947082
Category : Science
Languages : en
Pages : 552
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Book Description
This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.
