Thermal Stress and Fatigue Analysis of Microelectronic Packaging PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Thermal Stress and Fatigue Analysis of Microelectronic Packaging PDF full book. Access full book title Thermal Stress and Fatigue Analysis of Microelectronic Packaging by Meng Leong Tan. Download full books in PDF and EPUB format.
Author: Meng Leong Tan
Publisher:
ISBN:
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: Meng Leong Tan
Publisher:
ISBN:
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: John Lau
Publisher: Springer Science & Business Media
ISBN: 1468477676
Category : Technology & Engineering
Languages : en
Pages : 904
Get Book Here
Book Description
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Author: John Lau
Publisher:
ISBN: 9781468477689
Category :
Languages : en
Pages : 908
Get Book Here
Book Description
![Thermal Stress Analysis of Electronic Packaging [microform] PDF](https://books.google.com/books/content/images/frontcover/1KWGZwEACAAJ?fife=w80-h100)
Author: Victor Aldea
Publisher: Library and Archives Canada = Bibliothèque et Archives Canada
ISBN: 9780612973985
Category : Electronic packaging
Languages : en
Pages : 210
Get Book Here
Book Description
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 0824743415
Category : Technology & Engineering
Languages : en
Pages : 200
Get Book Here
Book Description
Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems. Practical Guide to the Packaging of Electronics discusses Packaging/enclosure design and reliability Thermal, junction-to-case, and contact interface resistance Direct and indirect flow system design Fin design and fan selection Vital elements of shock and vibration Thermal stresses and strains in the design and analysis of mechanically reliable systems Reliability models and system failure The selection of engineering software to facilitate system analysis Design parameters in an avionics electronics package Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1439870926
Category : Technology & Engineering
Languages : en
Pages : 336
Get Book Here
Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Kim S. Siow
Publisher: Springer
ISBN: 3319992562
Category : Technology & Engineering
Languages : en
Pages : 279
Get Book Here
Book Description
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Author: Chee Wai See Toh
Publisher:
ISBN:
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: Yan Li
Publisher: Springer
ISBN: 3319445863
Category : Technology & Engineering
Languages : en
Pages : 465
Get Book Here
Book Description
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Author: Scott A. Schroeder
Publisher: ASTM International
ISBN: 0803119941
Category : Electronics
Languages : en
Pages : 154
Get Book Here
Book Description
Unlike earlier electronic circuits, today's microelectronic devices demand that solder serve structural as well as electrical ends, and do so at relatively high temperature for years. Fatigue and failure of the solder has therefore become an issue in the industry. Nine studies from a May 1993 sympos
