Thermal Conductivity of the Elements PDF Download
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Author: Cho Yen Ho
Publisher: American Institute of Physics
ISBN:
Category : Science
Languages : en
Pages : 818
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Book Description
Author: Cho Yen Ho
Publisher: American Institute of Physics
ISBN:
Category : Science
Languages : en
Pages : 818
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 500
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Book Description
Author: A. P. Barsis
Publisher:
ISBN:
Category : Deuterium
Languages : en
Pages : 636
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Book Description
Author: Robert L. Powell
Publisher:
ISBN:
Category : Metals
Languages : en
Pages : 76
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Book Description
Author: Daniel R. Flynn
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 824
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Book Description
Author: A. Cezairliyan
Publisher:
ISBN:
Category : Alloys
Languages : en
Pages : 154
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Book Description
A brief outline of the present theory of thermal conductivity of metals is given with particular emphasis to cryogenic temperatures. The Principle of Corresponding States is applied to thermal conductivity of metallic elements and their dilute alloys at low temperatures. Based on the theory of metals and the Principle of Corresponding States a universal relation for the reduced thermal conductivity is obtained. Discrepencies between the theoretical and experimental results are investigated and the thermal conductivity relation is modified to remove these discrepancies. The interaction (coupling) between ideal and impurity thermal resistance is also treated. As a preliminary investigation, the Principle of Corresponding States is also applied to thermal conductivity of semi-metallic solids at low temperatures.
Author: T. Ashworth
Publisher: Springer Science & Business Media
ISBN: 1468449168
Category : Technology & Engineering
Languages : en
Pages : 734
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Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated. These Conferences on thermal conductivity grew out of the needs of researchers in the field. The Conferences were held annu ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conduc tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub licity and continuing funding support, when they see something worthwhile going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for research ers in other fields on how to jointly attack their own problem areas.
Author: Jerome G. Hust
Publisher:
ISBN:
Category : Tungsten
Languages : en
Pages : 52
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Book Description
Author: Yves Jannot
Publisher: John Wiley & Sons
ISBN: 1786302551
Category : Technology & Engineering
Languages : en
Pages : 342
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Book Description
This book presents the main methods used for thermal properties measurement. It aims to be accessible to all those, specialists in heat transfer or not, who need to measure the thermal properties of a material. The objective is to allow them to choose the measurement method the best adapted to the material to be characterized, and to pass on them all the theoretical and practical information allowing implementation with the maximum of precision.
Author: Subhash L. Shinde
Publisher: Springer Science & Business Media
ISBN: 0387251006
Category : Science
Languages : en
Pages : 285
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Book Description
The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.
