The Evaporation of a Thin Liquid Film from a Solid Surface PDF Download
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Author: Swiki Arlis Anderson
Publisher:
ISBN:
Category :
Languages : en
Pages : 684
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Book Description
Author: Swiki Arlis Anderson
Publisher:
ISBN:
Category :
Languages : en
Pages : 684
Get Book Here
Book Description
Author: Massoud Kaviany
Publisher: John Wiley & Sons
ISBN: 9780471434634
Category : Science
Languages : en
Pages : 1004
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Book Description
CD-ROM contains: Equations and relations (models) for thermal circuit modeling.
Author: William B. Krantz
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 208
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Book Description
Author: Bharat Bhushan
Publisher: Springer Science & Business Media
ISBN: 9401007365
Category : Science
Languages : en
Pages : 961
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Book Description
The word tribology was fIrst reported in a landmark report by P. Jost in 1966 (Lubrication (Tribology)--A Report on the Present Position and Industry's Needs, Department of Education and Science, HMSO, London). Tribology is the science and technology of two interacting surfaces in relative motion and of related subjects and practices. The popular equivalent is friction, wear and lubrication. The economic impact of the better understanding of tribology of two interacting surfaces in relative motion is known to be immense. Losses resulting from ignorance of tribology amount in the United States alone to about 6 percent of its GNP or about $200 billion dollars per year (1966), and approximately one-third of the world's energy resources in present' use, appear as friction in one form or another. A fundamental understanding of the tribology of the head-medium interface in magnetic recording is crucial to the future growth of the $100 billion per year information storage industry. In the emerging microelectromechanical systems (MEMS) industry, tribology is also recognized as a limiting technology. The advent of new scanning probe microscopy (SPM) techniques (starting with the invention of the scanning tunneling microscope in 1981) to measure surface topography, adhesion, friction, wear, lubricant-fIlm thickness, mechanical properties all on a micro to nanometer scale, and to image lubricant molecules and the availability of supercomputers to conduct atomic-scale simulations has led to the development of a new fIeld referred to as Microtribology, Nanotribology, or Molecular Tribology (see B. Bhushan, J. N. Israelachvili and U.
Author: Massoud Kaviany
Publisher: Springer Science & Business Media
ISBN: 1475734883
Category : Science
Languages : en
Pages : 722
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Book Description
This concise and unified text reviews recent contributions to the principles of convective heat transfer for single and multi-phase systems. This valuable new edition has been updated throughout and contains new examples and problems.
Author: Christopher R. Weinberger
Publisher: Springer
ISBN: 3319334808
Category : Technology & Engineering
Languages : en
Pages : 554
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Book Description
This book presents a unique combination of chapters that together provide a practical introduction to multiscale modeling applied to nanoscale materials mechanics. The goal of this book is to present a balanced treatment of both the theory of the methodology, as well as some practical aspects of conducting the simulations and models. The first half of the book covers some fundamental modeling and simulation techniques ranging from ab-inito methods to the continuum scale. Included in this set of methods are several different concurrent multiscale methods for bridging time and length scales applicable to mechanics at the nanoscale regime. The second half of the book presents a range of case studies from a varied selection of research groups focusing either on a the application of multiscale modeling to a specific nanomaterial, or novel analysis techniques aimed at exploring nanomechanics. Readers are also directed to helpful sites and other resources throughout the book where the simulation codes and methodologies discussed herein can be accessed. Emphasis on the practicality of the detailed techniques is especially felt in the latter half of the book, which is dedicated to specific examples to study nanomechanics and multiscale materials behavior. An instructive avenue for learning how to effectively apply these simulation tools to solve nanomechanics problems is to study previous endeavors. Therefore, each chapter is written by a unique team of experts who have used multiscale materials modeling to solve a practical nanomechanics problem. These chapters provide an extensive picture of the multiscale materials landscape from problem statement through the final results and outlook, providing readers with a roadmap for incorporating these techniques into their own research.
Author: Van P. Carey
Publisher: CRC Press
ISBN: 1498716636
Category : Science
Languages : en
Pages : 731
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Book Description
Since the second edition of Liquid-Vapor Phase-Change Phenomena was written, research has substantially enhanced the understanding of the effects of nanostructured surfaces, effects of microchannel and nanochannel geometries, and effects of extreme wetting on liquid-vapor phase-change processes. To cover advances in these areas, the new third edition includes significant new coverage of microchannels and nanostructures, and numerous other updates. More worked examples and numerous new problems have been added, and a complete solution manual and electronic figures for classroom projection will be available for qualified adopting professors.
Author: Deborah D.L. Chung
Publisher: Elsevier
ISBN: 0080511171
Category : Technology & Engineering
Languages : en
Pages : 383
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Book Description
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors - Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science - Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Author: Rasmus Fehrmann
Publisher: John Wiley & Sons
ISBN: 3527324291
Category : Science
Languages : en
Pages : 498
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Book Description
This unique book gives a timely overview about the fundamentals and applications of supported ionic liquids in modern organic synthesis. It introduces the concept and synthesis of SILP materials and presents important applications in the field of catalysis (e.g. hydroformylation, hydrogenation, coupling reactions, fine chemical synthesis) as well as energy technology and gas separation. Written by pioneers in the field, this book is an invaluable reference book for organic chemists in academia or industry.
Author: Madhusudan Iyengar
Publisher: World Scientific
ISBN: 9811279381
Category : Technology & Engineering
Languages : en
Pages : 479
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Book Description
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
