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Author: Curt H. Liebert
Publisher:
ISBN:
Category : Doped semiconductors
Languages : en
Pages : 36
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Book Description
Author: Curt H. Liebert
Publisher:
ISBN:
Category : Doped semiconductors
Languages : en
Pages : 36
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Book Description
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1720
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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 402
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Book Description
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 702
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Book Description
Author: N.M. Ravindra
Publisher: Morgan & Claypool Publishers
ISBN: 1681741768
Category : Science
Languages : en
Pages : 160
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Book Description
Optical properties, particularly in the infrared range of wavelengths, continue to be of enormous interest to both material scientists and device engineers. The need for the development of standards for data of optical properties in the infrared range of wavelengths is very timely considering the on-going transition of nano-technology from fundamental R&D to manufacturing. Radiative properties play a critical role in the processing, process control and manufacturing of semiconductor materials, devices, circuits and systems. The design and implementation of real-time process control methods in manufacturing requires the knowledge of the radiative properties of materials. Sensors and imagers operate on the basis of the radiative properties of materials. This book reviews the optical properties of various semiconductors in the infrared range of wavelengths. Theoretical and experimental studies of the radiative properties of semiconductors are presented. Previous studies, potential applications and future developments are outlined. In Chapter 1, an introduction to the radiative properties is presented. Examples of instrumentation for measurements of the radiative properties is described in Chapter 2. In Chapters 3-11, case studies of the radiative properties of several semiconductors are elucidated. The modeling and applications of these properties are explained in Chapters 12 and 13, respectively. In Chapter 14, examples of the global infrastructure for these measurements are illustrated.
Author: Gerhard Heller
Publisher: Elsevier
ISBN: 0323141846
Category : Science
Languages : en
Pages : 998
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Book Description
Progress in Astronautics and Aeronautics, Volume 20: Thermophysics of Spacecraft and Planetary Bodies: Radiation Properties of Solids and the Electromagnetic Radiation Environment in Space is a collection of technical papers drawn mainly from the American Institute of Aeronautics and Astronautics Thermophysics Specialist Conference, held in New Orleans on April 17-20, 1967. This volume is organized into six part encompassing 45 chapters that offer a selection of the most advanced studies in the dynamic field of thermophysics. Part I deals with radiation properties of solid state materials and the measuring techniques in the laboratory, while Part II describes the thermophysical properties of surfaces used for spacecraft. The papers of Part II also include solid state physics studies of the processes involved in the interaction of UV radiation with solids. Part III discusses the results of thermal flight experiments and on the radiation characteristics of planetary bodies, followed by topics on general radiative properties and the measurements of radiative properties of natural surfaces from satellites in Part IV. Part V contains papers on thermal similitude and on the closely related subject of radiant heat transfer analysis of thermal systems. Lastly, Part VI focuses on the heat transfer within the spacecraft under the conditions of space environment, specifically conductive and radiative transfer. This book is of great value to thermophysicists, space engineers and designers, as well as researchers in the fields of astronautics and aeronautics.
Author:
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1234
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Book Description
Author: F. Roozeboom
Publisher: Springer Science & Business Media
ISBN: 9401587116
Category : Science
Languages : en
Pages : 568
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Book Description
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Author: United States. Superintendent of Documents
Publisher:
ISBN:
Category : United States
Languages : en
Pages : 1504
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Book Description
Author: United States. National Aeronautics and Space Administration Scientific and Technical Information Division
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 478
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Book Description
