Special Section on the International Conference on Frontiers of Characterization and Metrology for Nanoelectronics PDF Download
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Author: International Conference on Characterization and Metrology for ULSI Technology (5, 2005, Richardson, Tex.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 141
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Book Description
Author: International Conference on Characterization and Metrology for ULSI Technology (5, 2005, Richardson, Tex.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 141
Get Book Here
Book Description
Author: E. M. Secula
Publisher:
ISBN: 9781510839113
Category :
Languages : en
Pages :
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Book Description
Author: David G. Seiler
Publisher: American Institute of Physics
ISBN: 9780735407121
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
As the semiconductor industry continues to move toward silicon nanoelectronics and beyond, the introduction of new materials, innovative processing and assembly, and novel devices brings formidable metrology challenges. We have entered an era where nanotechnology is required to meet the demand for smaller, faster, cheaper, and more complex functional chips. Innovative metrology and characterization methods have become critical. This book emphasizes the frontiers of innovation in the characterization and metrology needed to advance nanoelectronics. It comprises applications in nanoelectronic materials and devices, research and development, and manufacturing and diagnostics. Novel characterization methods for beyond CMOS and extreme CMOS devices are addressed, as well as electrical measurements, interconnects, patterning, microscopy, and modeling. The Editors believe that this book of collected papers from world-class leaders provides a basis and effective portrayal of the industry’s characterization and metrology needs and how they are being addressed by industry, academia, and government to continue the dramatic progress in semiconductors into the nanoelectronic regime. It also provides a foundation for stimulating further advances in metrology and new ideas for research and development.
Author: David G. Seiler
Publisher: American Inst. of Physics
ISBN: 9780735404410
Category : Science
Languages : en
Pages : 0
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Book Description
This book contains peer-reviewed papers presented at the 2007 International Conference on Frontiers of Characterization and Metrology. It emphasizes the frontiers of innovation in the characterization and metrology needed to advance nanoelectronics. It provides an effective portrayal of the industry’s characterization and metrology needs and how they are being addressed. It also offers a foundation for further advances in metrology and new ideas for research and development.
Author: E. M. Secula
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author:
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
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Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: Zhiyong Ma
Publisher: CRC Press
ISBN: 1351733958
Category : Science
Languages : en
Pages : 1454
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Book Description
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author: Janusz Bogdanowicz
Publisher: Springer Science & Business Media
ISBN: 3642301088
Category : Technology & Engineering
Languages : en
Pages : 217
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Book Description
One of the critical issues in semiconductor technology is the precise electrical characterization of ultra-shallow junctions. Among the plethora of measurement techniques, the optical reflectance approach developed in this work is the sole concept that does not require physical contact, making it suitable for non-invasive in-line metrology. This work develops extensively all the fundamental physical models of the photomodulated optical reflectance technique and introduces novel approaches that extend its applicability from dose monitoring towards detailed carrier profile reconstruction. It represents a significant breakthrough in junction metrology with potential for industrial implementation.
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
ISBN: 1119966868
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
