Author: U. Gösele
Publisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding
Author: U. Gösele
Publisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Proceedings of the ... International Symposium on Semiconductor Wafer Bonding
Author:
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 524
Book Description
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 524
Book Description
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
Book Description
Proceedings of the Seventh International Symposium on Silicon-on-Insulator Technology and Devices
Author: Peter L. F. Hemment
Publisher: The Electrochemical Society
ISBN: 9781566771535
Category : Science
Languages : en
Pages : 458
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566771535
Category : Science
Languages : en
Pages : 458
Book Description
Handbook of Wafer Bonding
Author: Peter Ramm
Publisher: John Wiley & Sons
ISBN: 3527326464
Category : Technology & Engineering
Languages : en
Pages : 435
Book Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Publisher: John Wiley & Sons
ISBN: 3527326464
Category : Technology & Engineering
Languages : en
Pages : 435
Book Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Proceedings
Author:
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 264
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 264
Book Description
ULSI Process Integration 5
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 1566775728
Category : Integrated circuits
Languages : en
Pages : 509
Book Description
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Publisher: The Electrochemical Society
ISBN: 1566775728
Category : Integrated circuits
Languages : en
Pages : 509
Book Description
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Ultraclean Surface Processing of Silicon Wafers
Author: Takeshi Hattori
Publisher: Springer Science & Business Media
ISBN: 3662035359
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Publisher: Springer Science & Business Media
ISBN: 3662035359
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Vertical External Cavity Surface Emitting Lasers
Author: Michael Jetter
Publisher: John Wiley & Sons
ISBN: 3527807977
Category : Technology & Engineering
Languages : en
Pages : 594
Book Description
Vertical External Cavity Surface Emitting Lasers Provides comprehensive coverage of the advancement of vertical-external-cavity surface-emitting lasers Vertical-external-cavity surface-emitting lasers (VECSELs) emit coherent light from the infrared to the visible spectral range with high power output. Recent years have seen new device developments – such as the mode-locked integrated (MIXSEL) and the membrane external-cavity surface emitting laser (MECSEL) – expand the application of VECSELs to include laser cooling, spectroscopy, telecommunications, biophotonics, and laser-based displays and projectors. In Vertical External Cavity Surface Emitting Lasers: VECSEL Technology and Applications, leading international research groups provide a comprehensive, fully up-to-date account of all fundamental and technological aspects of vertical external cavity surface emitting lasers. This unique book reviews the physics and technology of optically-pumped disk lasers and discusses the latest developments of VECSEL devices in different wavelength ranges. Topics include OP-VECSEL physics, continuous wave (CW) lasers, frequency doubling, carrier dynamics in SESAMs, and characterization of nonlinear lensing in VECSEL gain samples. This authoritative volume: Summarizes new concepts of DBR-free and MECSEL lasers for the first time Covers the mode-locking concept and its application Provides an overview of the emerging concept of self-mode locking Describes the development of next-generation OPS laser products Vertical External Cavity Surface Emitting Lasers: VECSEL Technology and Applications is an invaluable resource for laser specialists, semiconductor physicists, optical industry professionals, spectroscopists, telecommunications engineers and industrial physicists.
Publisher: John Wiley & Sons
ISBN: 3527807977
Category : Technology & Engineering
Languages : en
Pages : 594
Book Description
Vertical External Cavity Surface Emitting Lasers Provides comprehensive coverage of the advancement of vertical-external-cavity surface-emitting lasers Vertical-external-cavity surface-emitting lasers (VECSELs) emit coherent light from the infrared to the visible spectral range with high power output. Recent years have seen new device developments – such as the mode-locked integrated (MIXSEL) and the membrane external-cavity surface emitting laser (MECSEL) – expand the application of VECSELs to include laser cooling, spectroscopy, telecommunications, biophotonics, and laser-based displays and projectors. In Vertical External Cavity Surface Emitting Lasers: VECSEL Technology and Applications, leading international research groups provide a comprehensive, fully up-to-date account of all fundamental and technological aspects of vertical external cavity surface emitting lasers. This unique book reviews the physics and technology of optically-pumped disk lasers and discusses the latest developments of VECSEL devices in different wavelength ranges. Topics include OP-VECSEL physics, continuous wave (CW) lasers, frequency doubling, carrier dynamics in SESAMs, and characterization of nonlinear lensing in VECSEL gain samples. This authoritative volume: Summarizes new concepts of DBR-free and MECSEL lasers for the first time Covers the mode-locking concept and its application Provides an overview of the emerging concept of self-mode locking Describes the development of next-generation OPS laser products Vertical External Cavity Surface Emitting Lasers: VECSEL Technology and Applications is an invaluable resource for laser specialists, semiconductor physicists, optical industry professionals, spectroscopists, telecommunications engineers and industrial physicists.
Beta-Globulins—Advances in Research and Application: 2013 Edition
Author:
Publisher: ScholarlyEditions
ISBN: 1481673424
Category : Medical
Languages : en
Pages : 888
Book Description
Beta-Globulins—Advances in Research and Application: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Transferrin. The editors have built Beta-Globulins—Advances in Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Transferrin in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Beta-Globulins—Advances in Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Publisher: ScholarlyEditions
ISBN: 1481673424
Category : Medical
Languages : en
Pages : 888
Book Description
Beta-Globulins—Advances in Research and Application: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Transferrin. The editors have built Beta-Globulins—Advances in Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Transferrin in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Beta-Globulins—Advances in Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.