Materials Science of High Temperature Polymers for Microelectronics: PDF Download
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Author: D. T. Grubb
Publisher: Cambridge University Press
ISBN: 9781107409859
Category : Technology & Engineering
Languages : en
Pages : 414
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: D. T. Grubb
Publisher: Cambridge University Press
ISBN: 9781107409859
Category : Technology & Engineering
Languages : en
Pages : 414
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: David T. Grubb
Publisher:
ISBN:
Category :
Languages : en
Pages : 399
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Book Description
Author: D. T. Grubb
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 424
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: K. L. Mittal
Publisher: BRILL
ISBN: 9004170804
Category : Technology & Engineering
Languages : en
Pages : 434
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Book Description
The topics covered in this proceedings volume include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.
Author: R.R. Tummala
Publisher: Springer Science & Business Media
ISBN: 1461560373
Category : Computers
Languages : en
Pages : 1060
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Book Description
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author: Vladimir A. Bershtein
Publisher: Springer Nature
ISBN: 3031329430
Category : Technology & Engineering
Languages : en
Pages : 186
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Book Description
This book presents an overview of polymer nanocomposites for use in various high-temperature applications. Specifically, it focuses on the structure and physical properties of nanocomposites based on heterocyclic matrices derived from nitrile monomers such as cyanate esters or phthalonitriles. Due to increasing interest in new heat-resistant, lightweight materials for use in extreme conditions, such as in aeronautics, microelectronics, and various industrial machinery, the high thermal stability of heterocyclic polymer networks, in particular, has attracted much attention from materials researchers and engineers. Featuring a comprehensive review of the most recent advances in research on the structure and physical properties of these promising high-temperature polymer nanocomposites, this book will be of particular interest to materials scientists and engineers working throughout the fields of aeronautical and microelectronic engineering. In general, this book is intended for use by researchers of composite materials and specialists engaged in material selection for work in extreme conditions; for students specializing in materials science; for polymer physicists, and for university libraries.
Author: L. F. Thompson
Publisher:
ISBN:
Category : Language Arts & Disciplines
Languages : en
Pages : 592
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Book Description
Developed from a symposium at the 203rd Meeting of the ACS in San Francisco, April 1992, this volume presents new information on advanced polymers for applications in the manufacture of electronic devices and systems. The 38 chapter-papers are organized in four sections: chemically amplified resists; top-surface imaging and dry development resists; electron-beam, X-ray, and photoresists; and polyimides and dielectric polymers. Annotation copyright by Book News, Inc., Portland, OR
Author: Hiroshi Ito
Publisher:
ISBN:
Category : Language Arts & Disciplines
Languages : en
Pages : 488
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Book Description
Reports recent developments in polymer science and technology pertinent to microelectronics. Addresses such topics as photophysics and radiation physics and chemistry of polymers; photoresists, electron beam resists, and X-ray resists; insulating materials in microelectronics; photoresponsive materials; silicon-containing polymers; conducting polymers; and optoelectronic materials. Includes international contributions from both academia and industry.
Author: K. L. Mittal
Publisher: VSP
ISBN: 9789067643788
Category : Technology & Engineering
Languages : en
Pages : 554
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Book Description
Annotation Containing 32 peer-reviewed papers, this volume documents the proceedings of the international symposium of the same name (held under the aegis of the Materials Science and Technology Conferences) in December of 2001. Devoted to research into high-temperature polymers, the papers are organized into sections dealing with synthesis, properties, and bulk characterization in the first half and surface modification, interfacial or adhesion aspects, and applications in the second. Annotation (c)2003 Book News, Inc., Portland, OR (booknews.com).
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 9067644226
Category : Technology & Engineering
Languages : en
Pages : 582
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Book Description
This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and their characterization, properties and applications; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polyimide as a tunneling barrier; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.
