Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices PDF Download
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Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566774123
Category : Technology & Engineering
Languages : en
Pages : 332
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Book Description
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566774123
Category : Technology & Engineering
Languages : en
Pages : 332
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Book Description
Author: Yoshihiko Imanaka
Publisher: Springer Science & Business Media
ISBN: 0387233148
Category : Technology & Engineering
Languages : en
Pages : 252
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Book Description
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 1420018965
Category : Technology & Engineering
Languages : en
Pages : 458
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Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author: K. M. Nair
Publisher: John Wiley & Sons
ISBN: 1118408179
Category : Technology & Engineering
Languages : en
Pages : 323
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Book Description
This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
Author: Wei Wu
Publisher: Royal Society of Chemistry
ISBN: 1839167181
Category : Technology & Engineering
Languages : en
Pages : 685
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Book Description
Modern printing technology has paved the way for the fabrication of thin inexpensive electronics and is now established as a topic taught on advanced level courses across materials science and engineering. The properties of printed electronics, such as thin-form factor, flexibility, stretchability, portability, and rollability mean that they have a wide range of applications, including in wearable devices, smart packaging, healthcare, and the automotive industry. This book describes the key printing technologies for printed electronics. Chapters cover principles and mechanisms, techniques, inorganic and organic materials, substrates, post-treatment and applications of printed electronics technologies. Written by a leader in the field, this title will be essential reading for students on courses across materials science, electronics science, manufacturing and engineering, as well as those with an interest in printed electronics.
Author: Mailadil T. Sebastian
Publisher: John Wiley & Sons
ISBN: 1119208556
Category : Technology & Engineering
Languages : de
Pages : 1000
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Book Description
The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.
Author: Guosheng Jiang
Publisher: Springer Science & Business Media
ISBN: 146141962X
Category : Technology & Engineering
Languages : en
Pages : 163
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Book Description
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Author: Ahmed Sharif
Publisher: John Wiley & Sons
ISBN: 3527344195
Category : Technology & Engineering
Languages : en
Pages : 398
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Book Description
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Author: Haleh Ardebili
Publisher: William Andrew
ISBN: 0128119799
Category : Technology & Engineering
Languages : en
Pages : 510
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Book Description
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Author: Relva C. Buchanan
Publisher: CRC Press
ISBN: 1482293048
Category : Technology & Engineering
Languages : en
Pages : 693
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Book Description
The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
