ISTFA 2021 PDF Download
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Author: ASM INTERNATIONAL.
Publisher:
ISBN: 9781627084192
Category :
Languages : en
Pages :
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Book Description
Author: ASM INTERNATIONAL.
Publisher:
ISBN: 9781627084192
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: Navid Asadizanjani
Publisher: Elsevier
ISBN: 0443185433
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing
Author: Kimia Zamiri Azar
Publisher: Springer Nature
ISBN: 3031379896
Category : Technology & Engineering
Languages : en
Pages : 385
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Book Description
This book demonstrates the breadth and depth of IP protection through logic locking, considering both attacker/adversary and defender/designer perspectives. The authors draw a semi-chronological picture of the evolution of logic locking during the last decade, gathering and describing all the DO’s and DON’Ts in this approach. They describe simple-to-follow scenarios and guide readers to navigate/identify threat models and design/evaluation flow for further studies. Readers will gain a comprehensive understanding of all fundamentals of logic locking.
Author: ASM International
Publisher:
ISBN: 9781627083331
Category :
Languages : en
Pages : 396
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Book Description
The International Symposium for Testing and Failure Analysis is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques. ASM International and EDFAS has made the very difficult decision to cancel ISTFA 2020, that was scheduled for November 15-19, 2020 in Pasadena, California due to Covid -19 restrictions. This ISTFA 2020 publication includes the papers that were accepted for the planned 2020 conference. The theme of the planned conference was The Rise of MEMS (Microelectromechanical Systems) and 3D Failure Analysis. ISTFA 2021 will take place October 31- November 4, 2021 in Phoenix, Arizona.
Author: ASM International
Publisher: ASM International
ISBN: 1615030905
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author: Mark Tehranipoor
Publisher: Springer Nature
ISBN: 3031586875
Category :
Languages : en
Pages : 538
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Book Description
Author: ASM International
Publisher: ASM International
ISBN: 161503076X
Category : Technology & Engineering
Languages : en
Pages : 453
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Book Description
Author: Patrick Girard
Publisher: Springer Nature
ISBN: 3031196392
Category : Technology & Engineering
Languages : en
Pages : 320
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Book Description
This book provides a state-of-the-art guide to Machine Learning (ML)-based techniques that have been shown to be highly efficient for diagnosis of failures in electronic circuits and systems. The methods discussed can be used for volume diagnosis after manufacturing or for diagnosis of customer returns. Readers will be enabled to deal with huge amount of insightful test data that cannot be exploited otherwise in an efficient, timely manner. After some background on fault diagnosis and machine learning, the authors explain and apply optimized techniques from the ML domain to solve the fault diagnosis problem in the realm of electronic system design and manufacturing. These techniques can be used for failure isolation in logic or analog circuits, board-level fault diagnosis, or even wafer-level failure cluster identification. Evaluation metrics as well as industrial case studies are used to emphasize the usefulness and benefits of using ML-based diagnosis techniques.
Author: Ovidiu Vermesan
Publisher: CRC Press
ISBN: 1000881911
Category : Computers
Languages : en
Pages : 143
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Book Description
Recent technological developments in sensors, edge computing, connectivity, and artificial intelligence (AI) technologies have accelerated the integration of data analysis based on embedded AI capabilities into resource-constrained, energy-efficient hardware devices for processing information at the network edge. Embedded AI combines embedded machine learning (ML) and deep learning (DL) based on neural networks (NN) architectures such as convolutional NN (CNN), or spiking neural network (SNN) and algorithms on edge devices and implements edge computing capabilities that enable data processing and analysis without optimised connectivity and integration, allowing users to access data from various sources. Embedded AI efficiently implements edge computing and AI processes on resource-constrained devices to mitigate downtime and service latency, and it successfully merges AI processes as a pivotal component in edge computing and embedded system devices. Embedded AI also enables users to reduce costs, communication, and processing time by assembling data and by supporting user requirements without the need for continuous interaction with physical locations. This book provides an overview of the latest research results and activities in industrial embedded AI technologies and applications, based on close cooperation between three large-scale ECSEL JU projects, AI4DI, ANDANTE, and TEMPO. The book’s content targets researchers, designers, developers, academics, post-graduate students and practitioners seeking recent research on embedded AI. It combines the latest developments in embedded AI, addressing methodologies, tools, and techniques to offer insight into technological trends and their use across different industries.
Author: Farimah Farahmandi
Publisher: Springer Nature
ISBN: 3031268962
Category : Technology & Engineering
Languages : en
Pages : 415
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Book Description
This book provides an overview of current hardware security problems and highlights how these issues can be efficiently addressed using computer-aided design (CAD) tools. Authors are from CAD developers, IP developers, SOC designers as well as SoC verification experts. Readers will gain a comprehensive understanding of SoC security vulnerabilities and how to overcome them, through an efficient combination of proactive countermeasures and a wide variety of CAD solutions.
