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Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 746
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Book Description
Issues for 1973- cover the entire IEEE technical literature.
Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 746
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Book Description
Issues for 1973- cover the entire IEEE technical literature.
Author:
Publisher:
ISBN:
Category : Electric circuits
Languages : en
Pages : 984
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Book Description
Author: Eitan N. Shauly
Publisher: CRC Press
ISBN: 1000631354
Category : Technology & Engineering
Languages : en
Pages : 831
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Book Description
Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Author: British Library. Lending Division
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 976
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Book Description
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 792
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Book Description
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1351831003
Category : Technology & Engineering
Languages : en
Pages : 893
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Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Author:
Publisher:
ISBN:
Category : Computer input-output equipment
Languages : en
Pages : 536
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Book Description
Author:
Publisher:
ISBN:
Category : Computer architecture
Languages : en
Pages : 536
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Book Description
Author: Krzysztof Iniewski
Publisher: John Wiley & Sons
ISBN: 1118181476
Category : Technology & Engineering
Languages : en
Pages : 632
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Book Description
The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 380
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Book Description
