High-performance Polymers: Conductive adhesives PDF Download
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Author: Guy Rabilloud
Publisher: Institut Francais Du Petrole P
ISBN: 9782710807162
Category : Science
Languages : en
Pages : 0
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Book Description
Please, please don't order this book from State Mutual Book and Periodical Service which lists it in Books in Print for a whopping $680. Editions Technip, a French publisher, has no designated US distributor, and no protection against such skullduggery. The volume reviews the present status of electrically conductive and thermally conductive adhesive technology, primarily for the well established die attach market, but also for the anisotropic adhesive films used to interconnect electronic drivers to liquid crystal display panels, and adhesives which are currently tested to replace soft solders in surface mount technology. Coverage includes applications, market survey, and standards; electrical and thermal conductivities; fillers and resins; properties of uncured and of cured adhesives; thermally-induced stresses; reliability concerns; and current developments. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Guy Rabilloud
Publisher: Institut Francais Du Petrole P
ISBN: 9782710807162
Category : Science
Languages : en
Pages : 0
Get Book Here
Book Description
Please, please don't order this book from State Mutual Book and Periodical Service which lists it in Books in Print for a whopping $680. Editions Technip, a French publisher, has no designated US distributor, and no protection against such skullduggery. The volume reviews the present status of electrically conductive and thermally conductive adhesive technology, primarily for the well established die attach market, but also for the anisotropic adhesive films used to interconnect electronic drivers to liquid crystal display panels, and adhesives which are currently tested to replace soft solders in surface mount technology. Coverage includes applications, market survey, and standards; electrical and thermal conductivities; fillers and resins; properties of uncured and of cured adhesives; thermally-induced stresses; reliability concerns; and current developments. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Guy Rabilloud
Publisher: Editions OPHRYS
ISBN: 9782710810940
Category :
Languages : en
Pages : 382
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Book Description
Author: Yi (Grace) Li
Publisher: Springer Science & Business Media
ISBN: 0387887830
Category : Technology & Engineering
Languages : en
Pages : 445
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Book Description
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author: Guy Rabilloud
Publisher: Editions TECHNIP
ISBN: 9782710807193
Category : Technology & Engineering
Languages : en
Pages : 374
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Book Description
Summarizes the results published so far in the literature as an introduction to the third volume of the series, which will focus on the applications of heterocyclic polymers in the electronics industry. Considers the chemistry and applications of polyphenylquinoxalines and polymides, both of which have been used to make high-performance adhesives, composites, coatings, films, fibers, and foams that are now commercially available. Primarily a reference for materials scientists, polymer chemists, manufacturers of electronic components, and process engineers, but also potentially a textbook. Distributed in the US by Enfield Publishing and Distribution. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Rajesh Gomatam
Publisher: BRILL
ISBN: 9004165924
Category : Technology & Engineering
Languages : en
Pages : 434
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Book Description
This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Author: Yi Li
Publisher:
ISBN:
Category : Adhesives Electric properties
Languages : en
Pages :
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Book Description
Electrically conductive adhesives (ECAs) are one of the lead-free interconnect materials with the advantages of environmental friendliness, mild processing conditions, fewer processing steps, low stress on the substrates, and fine pitch interconnect capability. However, some challenging issues still exist for the currently available ECAs, including lower electrical conductivity, conductivity fatigue in reliability tests, limited current-carrying capability, poor impact strength, etc. The interfacial properties is one of the major considerations when resolving these challenges and developing high performance conductive adhesives. Surface functionalization and interface modification are the major approaches used in this thesis. Fundamental understanding and analysis of the interaction between various types of interface modifiers and ECA materials and substrates are the key for the development of high performance ECA for lead-free interconnects. The results of this thesis provide the guideline for the enhancement of interfacial properties of metal-metal and metal-polymer interactions. Systematic investigation of various types of ECAs contributes to a better understanding of materials requirements for different applications, such as surface mount technology (SMT), flip chip applications, flat panel display modules with high resolution, etc. Improvement of the electrical, thermal and reliability of different ECAs make them a potentially ideal candidate for high power and fine pitch microelectronics packaging option.
Author: M O Alam
Publisher: Elsevier
ISBN: 0857092898
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Author: Vikas Mittal
Publisher: John Wiley & Sons
ISBN: 1118171942
Category : Technology & Engineering
Languages : en
Pages : 454
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Book Description
This book describes advances in synthesis, processing, and technology of environmentally friendly polymers generated from renewable resources. With contents based on a wide range of functional monomers and contributions from eminent researchers, this volume demonstrates the design, synthesis, properties and applications of plant oil based polymers, presenting an elaborate review of acid mediated polymerization techniques for the generation of green polymers. Chemical engineers are provided with state-of-the-art information that acts to further progress research in this direction.
Author: John H. Lau
Publisher: McGraw Hill Professional
ISBN: 0071500871
Category : Technology & Engineering
Languages : en
Pages : 671
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Book Description
ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs * Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate * Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages * Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging * Environmental issues for conventional PCBs and substrates * Some environmentally conscious flame-retardants for PCBs and organic substrates * Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety * Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives * Criteria, development approaches, and varieties of alloys and properties of lead-free solders * Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders * Manufacturing process and performance of lead-free surface finishes for both PCB and component applications * Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process * Fundamental understanding of electrically conductive adhesive (ECA) technology * Effects of lubricant removal and cure shrinkage on ECAs * Mechanisms underlying the contact resistance shifts of ECAs * Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs * Stabilization of contact resistance of ECAs using various additives
Author: Junwei Gu
Publisher: Elsevier
ISBN: 0323952321
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
Thermally Conductive Polymer Composites provides an important introduction to the key principles, methods, and research directions of this emerging thermal management material category. This book introduces thermal conduction, measurement methods, thermal conduction mechanisms, and related theories. It also reviews classification and processing techniques which impact thermal conductivity performance. Thermally conductive composites discussed include intrinsically thermally conductive polymers, thermally conductive fillers, and thermally conductive polymer composites. Furthermore, the interfacial thermal resistance is thoroughly explained including basic concepts, theoretical research, and characterization. Finally, the practical applications of thermally conductive polymer composites are illustrated such as thermally conductive plastics, thermally conductive rubbers, and thermally conductive adhesives. Covers measurement methods, thermal conductivity mechanisms and models Introduces thermally conductive polymers, intrinsically thermal conductors, fillers and composites, as well as interfaces Reviews advances in classification and processing techniques
