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Author: Ponnuswamy Sadayappan
Publisher:
ISBN: 9788303050748
Category : Artificial intelligence
Languages : en
Pages : 0
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Book Description
This book constitutes the refereed proceedings of the 35th International Conference on High Performance Computing, ISC High Performance 2020, held in Frankfurt/Main, Germany, in June 2020.* The 27 revised full papers presented were carefully reviewed and selected from 87 submissions. The papers cover a broad range of topics such as architectures, networks & infrastructure; artificial intelligence and machine learning; data, storage & visualization; emerging technologies; HPC algorithms; HPC applications; performance modeling & measurement; programming models & systems software. *The conference was held virtually due to the COVID-19 pandemic. Chapters "Scalable Hierarchical Aggregation and Reduction Protocol (SHARP) Streaming-Aggregation Hardware Design and Evaluation", "Solving Acoustic Boundary Integral Equations Using High Performance Tile Low-Rank LU Factorization", "Scaling Genomics Data Processing with Memory-Driven Computing to Accelerate Computational Biology", "Footprint-Aware Power Capping for Hybrid Memory Based Systems", and "Pattern-Aware Staging for Hybrid Memory Systems" are available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.
Author: Ponnuswamy Sadayappan
Publisher:
ISBN: 9788303050748
Category : Artificial intelligence
Languages : en
Pages : 0
Get Book Here
Book Description
This book constitutes the refereed proceedings of the 35th International Conference on High Performance Computing, ISC High Performance 2020, held in Frankfurt/Main, Germany, in June 2020.* The 27 revised full papers presented were carefully reviewed and selected from 87 submissions. The papers cover a broad range of topics such as architectures, networks & infrastructure; artificial intelligence and machine learning; data, storage & visualization; emerging technologies; HPC algorithms; HPC applications; performance modeling & measurement; programming models & systems software. *The conference was held virtually due to the COVID-19 pandemic. Chapters "Scalable Hierarchical Aggregation and Reduction Protocol (SHARP) Streaming-Aggregation Hardware Design and Evaluation", "Solving Acoustic Boundary Integral Equations Using High Performance Tile Low-Rank LU Factorization", "Scaling Genomics Data Processing with Memory-Driven Computing to Accelerate Computational Biology", "Footprint-Aware Power Capping for Hybrid Memory Based Systems", and "Pattern-Aware Staging for Hybrid Memory Systems" are available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.
Author: Betty Prince
Publisher: John Wiley & Sons
ISBN: 1118760468
Category : Technology & Engineering
Languages : en
Pages : 466
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Book Description
The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference
Author: Rajeev Balasubramonian
Publisher: Springer Nature
ISBN: 3031017633
Category : Technology & Engineering
Languages : en
Pages : 129
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Book Description
The memory system has the potential to be a hub for future innovation. While conventional memory systems focused primarily on high density, other memory system metrics like energy, security, and reliability are grabbing modern research headlines. With processor performance stagnating, it is also time to consider new programming models that move some application computations into the memory system. This, in turn, will lead to feature-rich memory systems with new interfaces. The past decade has seen a number of memory system innovations that point to this future where the memory system will be much more than dense rows of unintelligent bits. This book takes a tour through recent and prominent research works, touching upon new DRAM chip designs and technologies, near data processing approaches, new memory channel architectures, techniques to tolerate the overheads of refresh and fault tolerance, security attacks and mitigations, and memory scheduling.
Author: Shimeng Yu
Publisher: CRC Press
ISBN: 1000567575
Category : Computers
Languages : en
Pages : 214
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Book Description
This book covers semiconductor memory technologies from device bit-cell structures to memory array design with an emphasis on recent industry scaling trends and cutting-edge technologies. The first part of the book discusses the mainstream semiconductor memory technologies. The second part of the book discusses the emerging memory candidates that may have the potential to change the memory hierarchy, and surveys new applications of memory technologies for machine/deep learning applications. This book is intended for graduate students in electrical and computer engineering programs and researchers or industry professionals in semiconductors and microelectronics. Explains the design of basic memory bit-cells including 6-transistor SRAM, 1-transistor-1-capacitor DRAM, and floating gate/charge trap FLASH transistor Examines the design of the peripheral circuits including the sense amplifier and array-level organization for the memory array Examines industry trends of memory technologies such as FinFET based SRAM, High-Bandwidth-Memory (HBM), 3D NAND Flash, and 3D X-point array Discusses the prospects and challenges of emerging memory technologies such as PCM, RRAM, STT-MRAM/SOT-MRAM and FeRAM/FeFET Explores the new applications such as in-memory computing for AI hardware acceleration.
Author: Ponnuswamy Sadayappan
Publisher: Springer Nature
ISBN: 3030507432
Category : Computers
Languages : en
Pages : 564
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Book Description
This book constitutes the refereed proceedings of the 35th International Conference on High Performance Computing, ISC High Performance 2020, held in Frankfurt/Main, Germany, in June 2020.* The 27 revised full papers presented were carefully reviewed and selected from 87 submissions. The papers cover a broad range of topics such as architectures, networks & infrastructure; artificial intelligence and machine learning; data, storage & visualization; emerging technologies; HPC algorithms; HPC applications; performance modeling & measurement; programming models & systems software. *The conference was held virtually due to the COVID-19 pandemic. Chapters "Scalable Hierarchical Aggregation and Reduction Protocol (SHARP) Streaming-Aggregation Hardware Design and Evaluation", "Solving Acoustic Boundary Integral Equations Using High Performance Tile Low-Rank LU Factorization", "Scaling Genomics Data Processing with Memory-Driven Computing to Accelerate Computational Biology", "Footprint-Aware Power Capping for Hybrid Memory Based Systems", and "Pattern-Aware Staging for Hybrid Memory Systems" are available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.
Author: Hao Yu
Publisher: World Scientific
ISBN: 9814699039
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Author: Katsuyuki Sakuma
Publisher: CRC Press
ISBN: 1351779826
Category : Technology & Engineering
Languages : en
Pages : 211
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Book Description
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Author: Ana-Lucia Varbanescu
Publisher: Springer Nature
ISBN: 3031073126
Category : Computers
Languages : en
Pages : 383
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Book Description
This book constitutes the refereed proceedings of the 37th International Conference on High Performance Computing, ISC High Performance 2022, held in Hamburg, Germany, during May 29 – June 2, 2022. The 18 full papers presented were carefully reviewed and selected from 53 submissions. The papers are categorized into the following topical sub-headings: Architecture, Networks, and Storage; Machine Learning, AI, Emerging Technologies; HPC Algorithms and Applications; Performance Modeling, Evaluation and Analysis; and Programming Environments and Systems Software.
Author: Jens Knoop
Publisher: Springer
ISBN: 3319549995
Category : Computers
Languages : en
Pages : 267
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Book Description
This book constitutes the proceedings of the 30th International Conference on Architecture of Computing Systems, ARCS 2017, held in Vienna, Austria, in April 2017. The 19 full papers presented in this volume were carefully reviewed and selected from 42 submissions. They were organized in topical sections entitled: resilience; accelerators; performance; memory systems; parallelism and many-core; scheduling; power/energy.
Author: Georgios Goumas
Publisher: Springer Nature
ISBN: 3031427858
Category : Computers
Languages : en
Pages : 333
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Book Description
This book constitutes the proceedings of the 36th International Conference on Architecture of Computing Systems, ARCS 2023, which took place in Athens, Greece, in June 2023. The 18 full papers in this volume were carefully reviewed and selected from 35 submissions. ARCS provides a platform covering newly emerging and cross-cutting topics, such as autonomous and ubiquitous systems, reconfigurable computing and acceleration, neural networks and artificial intelligence. The selected papers cover a variety of topics from the ARCS core domains, including energy efficiency, applied machine learning, hardware and software system security, reliable and fault-tolerant systems and organic computing. Back to top
