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Author: Lian-Tuu Yeh
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 454
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Book Description
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Author: Lian-Tuu Yeh
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 454
Get Book Here
Book Description
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Author: Lian-Tuu Yeh
Publisher:
ISBN: 9780791861097
Category : Technology & Engineering
Languages : en
Pages : 524
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Book Description
This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.
Author: Ralph Remsburg
Publisher: CRC Press
ISBN: 1351835912
Category : Technology & Engineering
Languages : en
Pages : 440
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Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Author: John H. Seely
Publisher: Marcel Dekker
ISBN: 9780824716110
Category : Science
Languages : en
Pages : 362
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Book Description
Author: Sadik Kakaç
Publisher: Springer Science & Business Media
ISBN: 9780792327363
Category : Technology & Engineering
Languages : en
Pages : 976
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Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author: Ralph Remsburg
Publisher: Springer Science & Business Media
ISBN: 9780412122712
Category : Computers
Languages : en
Pages : 632
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Book Description
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Author: S. Kakaç
Publisher: Springer Science & Business Media
ISBN: 9781402033605
Category : Science
Languages : en
Pages : 530
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Book Description
This volume provides a comprehensive state-of-the art assessment of the fundamentals of the Microscale heat transfer and transport phenomena and heat transfer and applications in Microsystems. The modern trend toward miniaturization of devices requires a better understanding of heat mass transfer phenomena in small dimensions. Devices having dimensions of order of microns are being developed for use of cooling of integrated circuits, and in biochemicals-biomedical applications and cryogenics. Microelectromechanical systems (MEMS) have an important impact in medicine, bioengineering, information technologies and other industries.
Author: A. E. Bergles
Publisher: CRC Press
ISBN: 9780891162773
Category : Science
Languages : en
Pages : 1048
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Book Description
Examining one of the major heat transfer issues of the decade, this reference volume presents new contributions from international researchers. The volume contains information on thermal control of devices from microelectronic chips in computers to devices for power conversion.
Author: Cornell Aeronautical Laboratory
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 100
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Book Description
Author:
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 424
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Book Description
