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Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979
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Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979
Get Book Here
Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: Yufeng Jin
Publisher: CRC Press
ISBN: 1439865973
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 1259861562
Category : Technology & Engineering
Languages : en
Pages : 849
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Book Description
A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field
Author: Tummala
Publisher: McGraw Hill Professional
ISBN: 9780071371698
Category : Technology & Engineering
Languages : en
Pages : 996
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Book Description
"LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Youll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologieswafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing"
Author: Joy Laskar
Publisher: John Wiley & Sons
ISBN: 0470409789
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
Learn the fundamentals of integrated communication microsystems Advanced communication microsystems—the latest technology to emerge in the semiconductor sector after microprocessors—require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration. This book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems from a developer's perspective. The book thoroughly and carefully explores: Fundamental requirements of communication microsystems System design and considerations for wired and wireless communication microsystems Advanced block-level design techniques for communication microsystems Integration of communication systems in a hybrid environment Packaging considerations Power and form factor trade-offs in building integrated microsystems Advanced Integrated Communication Microsystems is an ideal textbook for advanced undergraduate and graduate courses. It also serves as a valuable reference for researchers and practitioners in circuit design for telecommunications and related fields.
Author: Mohd N. Tamin
Publisher: Springer Science & Business
ISBN: 3319000926
Category : Technology & Engineering
Languages : en
Pages : 179
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Book Description
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.
Author: M. Edward Motamedi
Publisher: SPIE Press
ISBN: 9780819450210
Category : Technology & Engineering
Languages : en
Pages : 640
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Book Description
This book introduces the exciting and fast-moving field of MOEMS to graduate students, scientists, and engineers by providing a foundation of both micro-optics and MEMS that will enable them to conduct future research in the field. Born from the relatively new fields of MEMS and micro-optics, MOEMS are proving to be an attractive and low-cost solution to a range of device problems requiring high optical functionality and high optical performance. MOEMS solutions include optical devices for telecommunication, sensing, and mobile systems such as v-grooves, gratings, shutters, scanners, filters, micromirrors, switches, alignment aids, lens arrays, and hermetic wafer-scale optical packaging. An international team of leading researchers contributed to this book, and it presents examples and problems employing cutting-edge MOEM devices. It will inspire researchers to further advance the design, fabrication, and analysis of MOEM systems.
Author: Jens Lienig
Publisher: Springer
ISBN: 3319558404
Category : Technology & Engineering
Languages : en
Pages : 251
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Book Description
This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.
Author: Ellis Meng
Publisher: CRC Press
ISBN: 1420051237
Category : Medical
Languages : en
Pages : 410
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Book Description
Poised to dramatically impact human health, biomedical microsystems (bioMEMS) technologies incorporate various aspects from materials science, biology, chemistry, physics, medicine, and engineering. Reflecting the highly interdisciplinary nature of this area, Biomedical Microsystems covers the fundamentals of miniaturization, biomaterials, microfabrication, and nanotechnology, along with relevant applications. Written by an active researcher who was recently named one of Technology Review’s Young Innovators Under 35, the book begins with an introduction to the benefits of miniaturization. It then introduces materials, fabrication technology, and the necessary components of all bioMEMS. The author also covers fundamental principles and building blocks, including microfluidic concepts, lab-on-a-chip systems, and sensing and detection methods. The final chapters explore several important applications of bioMEMS, such as microdialysis, catheter-based sensors, MEMS implants, neural probes, and tissue engineering. For readers with a limited background in MEMS and bioMEMS, this book provides a practical introduction to the technology used to make these devices, the principles that govern their operation, and examples of their application. It offers a starting point for understanding advanced topics and encourages readers to begin to formulate their own ideas about the design of novel bioMEMS. A solutions manual is available for instructors who want to convert this reference to classroom use.
Author: Gregory Barbillon
Publisher: Springer
ISBN: 9811365490
Category : Technology & Engineering
Languages : en
Pages : 373
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Book Description
This tutorial book offers an in-depth overview of the fundamental principles of micro/nano technologies and devices related to sensing, actuation and diagnosis in fluidics and biosystems. Research in the MEMS/NEMS and lab-on-chip fields has seen rapid growth in both academic and industrial domains, as these biodevices and systems are increasingly replacing traditional large size diagnostic tools. This book is unique in describing not only the devices and technologies but also the basic principles of their operation. The comprehensive description of the fabrication, packaging and principles of micro/nano biosystems presented in this book offers guidance for researchers designing and implementing these biosystems across diverse fields including medical, pharmaceutical and biological sciences. The book provides a detailed overview of the fundamental mechanical, optical, electrical and magnetic principles involved, together with the technologies required for the design, fabrication and characterization of micro/nano fluidic systems and bio-devices. Written by a collaborative team from France and Korea, the book is suitable for academics, researchers, advanced level students and industrial manufacturers.
