Frontiers of Characterization and Metrology for Nanoelectronics 2015 PDF Download
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Author: David G. Seiler
Publisher: American Institute of Physics
ISBN: 9780735407121
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
As the semiconductor industry continues to move toward silicon nanoelectronics and beyond, the introduction of new materials, innovative processing and assembly, and novel devices brings formidable metrology challenges. We have entered an era where nanotechnology is required to meet the demand for smaller, faster, cheaper, and more complex functional chips. Innovative metrology and characterization methods have become critical. This book emphasizes the frontiers of innovation in the characterization and metrology needed to advance nanoelectronics. It comprises applications in nanoelectronic materials and devices, research and development, and manufacturing and diagnostics. Novel characterization methods for beyond CMOS and extreme CMOS devices are addressed, as well as electrical measurements, interconnects, patterning, microscopy, and modeling. The Editors believe that this book of collected papers from world-class leaders provides a basis and effective portrayal of the industry’s characterization and metrology needs and how they are being addressed by industry, academia, and government to continue the dramatic progress in semiconductors into the nanoelectronic regime. It also provides a foundation for stimulating further advances in metrology and new ideas for research and development.
Author: Zhiyong Ma
Publisher: CRC Press
ISBN: 1351733958
Category : Science
Languages : en
Pages : 1454
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Book Description
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author: David G. Seiler
Publisher: American Inst. of Physics
ISBN: 9780735404410
Category : Science
Languages : en
Pages : 0
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Book Description
This book contains peer-reviewed papers presented at the 2007 International Conference on Frontiers of Characterization and Metrology. It emphasizes the frontiers of innovation in the characterization and metrology needed to advance nanoelectronics. It provides an effective portrayal of the industry’s characterization and metrology needs and how they are being addressed. It also offers a foundation for further advances in metrology and new ideas for research and development.
Author: Zhiyong Ma
Publisher: CRC Press
ISBN: 135173394X
Category : Science
Languages : en
Pages : 843
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Book Description
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author: ASM International
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages : 666
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Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Author: Umberto Celano
Publisher: Springer
ISBN: 9783319819068
Category : Science
Languages : en
Pages : 175
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Book Description
This thesis presents the first direct observations of the 3D-shape, size and electrical properties of nanoscale filaments, made possible by a new Scanning Probe Microscopy-based tomography technique referred to as scalpel SPM. Using this innovative technology and nm-scale observations, the author achieves essential insights into the filament formation mechanisms, improves the understanding required for device optimization, and experimentally observes phenomena that had previously been only theoretically proposed.
Author: Nicolas Brodusch
Publisher: Springer
ISBN: 9811044333
Category : Technology & Engineering
Languages : en
Pages : 143
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Book Description
This book highlights what is now achievable in terms of materials characterization with the new generation of cold-field emission scanning electron microscopes applied to real materials at high spatial resolution. It discusses advanced scanning electron microscopes/scanning- transmission electron microscopes (SEM/STEM), simulation and post-processing techniques at high spatial resolution in the fields of nanomaterials, metallurgy, geology, and more. These microscopes now offer improved performance at very low landing voltage and high -beam probe current stability, combined with a routine transmission mode capability that can compete with the (scanning-) transmission electron microscopes (STEM/-TEM) historically run at higher beam accelerating voltage
Author: Elisabeth Mansfield
Publisher: John Wiley & Sons
ISBN: 3527800050
Category : Technology & Engineering
Languages : en
Pages : 630
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Book Description
For the promotion of global trading and the reduction of potential risks, the role of international standardization of nanotechnologies has become more and more important. This book gives an overview of the current status of nanotechnology including the importance of metrology and characterization at the nanoscale, international standardization of nanotechnology, and industrial innovation of nano-enabled products. First the field of nanometrology, nanomaterial standardization and nanomaterial innovation is introduced. Second, major concepts in analytical measurements are given in order to provide a basis for the reliable and reproducible characterization of nanomaterials. The role of standards organizations are presented and finally, an overview of risk management and the commercial impact of metrology and standardization for industrial innovations.
Author: Yan Li
Publisher: Springer Nature
ISBN: 9811570906
Category : Technology & Engineering
Languages : en
Pages : 629
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Book Description
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
