Fabrication and Characterization of Gallium Nitride Electronic Devices PDF Download
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Author: Jerry Wayne Johnson
Publisher:
ISBN:
Category :
Languages : en
Pages : 536
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Author: Jerry Wayne Johnson
Publisher:
ISBN:
Category :
Languages : en
Pages : 536
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Author: Robert F Davis
Publisher: World Scientific
ISBN: 9814482692
Category : Technology & Engineering
Languages : en
Pages : 295
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Book Description
The unique materials properties of GaN-based semiconductors have stimulated a great deal of interest in research and development regarding nitride materials growth and optoelectronic and nitride-based electronic devices. High electron mobility and saturation velocity, high sheet carrier concentration at heterojunction interfaces, high breakdown field, and low thermal impedance of GaN-based films grown over SiC or bulk AlN substrates make nitride-based electronic devices very promising. The chemical inertness of nitrides is another key property.This volume, written by experts on different aspects of nitride technology, addresses the entire spectrum of issues related to nitride materials and devices, and it will be useful for technologists, scientists, engineers, and graduate students who are working on wide bandgap materials and devices. The book can also be used as a supplementary text for graduate courses on wide bandgap semiconductor technology.
Author: Atanu Das
Publisher:
ISBN:
Category :
Languages : zh-CN
Pages :
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Author: Wang Rui
Publisher:
ISBN:
Category :
Languages : en
Pages : 130
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Rare Earth (RE) doped III-nitrides are being widely investigated for potential applications in optical communication and displays, due to the wide and direct energy bandgap of GaN resulting in low thermal quenching of RE ion sharp emission from ultraviolet (UV) through visible to infrared (IR) region. The UC Nanolab has been conducting RE doped GaN research for more than 10 years and many achievements were obtained, ranging from material growth to device fabrication. This dissertation studied RE emission in GaN material, focusing on the effects of electronic impurity (Si) co-doping on RE luminescence. Advanced RE doped GaN electroluminescent devices (ELDs) were also designed and fabricated. Detailed device characterization was carried out and the effect of co-dopant was investigated. Eu-doped GaN thin films were grown on sapphire wafers by molecular beam epitaxy (MBE) technique and the growth conditions were optimized for the strongest Eu luminescence. It was found that GaN thin film quality and Eu doping concentration mutually affected Eu luminescence. High quality GaN:Eu thin films were grown under Ga rich condition (III/V>1), but the strongest Eu luminescence was obtained under slightly N rich condition (III/V1). The optimum Eu doping concentration is ~0.1-1.0at.%, depending on the GaN:Eu thin film quality. Higher growth temperature (750°C) was also found to enhance Eu luminescence intensity (~10x) and efficiency (~30x). The effect of Si co-doping in GaN:RE thin films was investigated. Eu photoluminescence (PL) was enhanced ~5-10x by moderate Si co-doping (~0.05at.%) mostly due to the increase of Eu PL lifetime, but decreased very fast at high Si co-doping concentration (>0.08at.%). The increase of Eu PL lifetime is possibly due to the incorporation of Si uniformly distributing Eu ions and shielding Eu-Eu interactions. Combined with the increase in excitation cross section and carrier flux, there is a significant enhancement on Eu PL intensity. The electrical properties of GaN:RE thin films were changed from high resistive to weakly n-type due to increased electron concentration introduced by Si co-doping. GaN:RE ELDs were fabricated and the electrical and optical properties were studied by I-V and electroluminescence (EL) measurements. A hetero-junction PIN structure was designed on n-GaN:Si/GaN:RE/p-Si, employing p-Si substrates as p-type conductive layer. RE ions EL emission was found to be much stronger under forward bias than under reverse bias. The Si co-doping was also studied in GaN:RE ELDs. It was found that Er EL had strong visible & IR emission under forward bias, while there is little or no emission under reverse bias. A pn hetero-junction structure formed between p-Si and n-GaN:(Si, Er) layers was proposed to be responsible for the emission control. GaN:(Si, Eu) AC thin film ELDs were also fabricated and shown that the Si co-doping increased the Eu ions emission intensity and efficiency.
Author: Padhraic Liam Mulligan
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: Farid Medjdoub
Publisher: CRC Press
ISBN: 1482220040
Category : Technology & Engineering
Languages : en
Pages : 372
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Addresses a Growing Need for High-Power and High-Frequency Transistors Gallium Nitride (GaN): Physics, Devices, and Technology offers a balanced perspective on the state of the art in gallium nitride technology. A semiconductor commonly used in bright light-emitting diodes, GaN can serve as a great alternative to existing devices used in microelectronics. It has a wide band gap and high electron mobility that gives it special properties for applications in optoelectronic, high-power, and high-frequency devices, and because of its high off-state breakdown strength combined with excellent on-state channel conductivity, GaN is an ideal candidate for switching power transistors. Explores Recent Progress in High-Frequency GaN Technology Written by a panel of academic and industry experts from around the globe, this book reviews the advantages of GaN-based material systems suitable for high-frequency, high-power applications. It provides an overview of the semiconductor environment, outlines the fundamental device physics of GaN, and describes GaN materials and device structures that are needed for the next stage of microelectronics and optoelectronics. The book details the development of radio frequency (RF) semiconductor devices and circuits, considers the current challenges that the industry now faces, and examines future trends. In addition, the authors: Propose a design in which multiple LED stacks can be connected in a series using interband tunnel junction (TJ) interconnects Examine GaN technology while in its early stages of high-volume deployment in commercial and military products Consider the potential use of both sunlight and hydrogen as promising and prominent energy sources for this technology Introduce two unique methods, PEC oxidation and vapor cooling condensation methods, for the deposition of high-quality oxide layers A single-source reference for students and professionals, Gallium Nitride (GaN): Physics, Devices, and Technology provides an overall assessment of the semiconductor environment, discusses the potential use of GaN-based technology for RF semiconductor devices, and highlights the current and emerging applications of GaN.
Author: Yaqi Wang
Publisher:
ISBN:
Category : Diodes, Schottky-barrier
Languages : en
Pages : 94
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Author: Corey Michael Foster
Publisher:
ISBN:
Category :
Languages : en
Pages : 66
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Author: Yi Fan Qi
Publisher:
ISBN:
Category :
Languages : en
Pages :
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"Gallium nitride (GaN) high electron mobility transistors (HEMTs) have a potential in electronic fields such as broadband communication and radar applications. GaN possesses many advantages including a direct and wide bandgap, making GaN HEMTs ideal to high voltage and high temperature. Experiments have yielded devices with high power output efficiency and bandwidth compared to other modern transistor devices. In this work, GaN HEMTs on silicon substrates with various gate lengths have been designed and fabricated. The current-voltage characteristics and breakdown voltages of the HEMTs have been measured. The design, fabrication, and characterization of different devices were presented, as well as the measurements and discussion of devices under effects of heat treatment. Although the fabrication technology is still immature and under development, GaN HEMTs have shown promising results in radio frequency, high power, and wireless power transfer applications. The goal of this work is to investigate the electrical properties of the GaN HEMTs and to develop this technology in high power devices in the future." --
Author: Rico Hentschel
Publisher: BoD – Books on Demand
ISBN: 3752641762
Category : Science
Languages : en
Pages : 156
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Book Description
Efficient power conversion is essential to face the continuously increasing energy consumption of our society. GaN based vertical power field effect transistors provide excellent performance figures for power-conversion switches, due to their capability of handling high voltages and current densities with very low area consumption. This work focuses on a vertical trench gate metal oxide semiconductor field effect transistor (MOSFET) with conceptional advantages in a device fabrication preceded GaN epitaxy and enhancement mode characteristics. The functional layer stack comprises from the bottom an n+/n--drift/p-body/n+-source GaN layer sequence. Special attention is paid to the Mg doping of the p-GaN body layer, which is a complex topic by itself. Hydrogen passivation of magnesium plays an essential role, since only the active (hydrogen-free) Mg concentration determines the threshold voltage of the MOSFET and the blocking capability of the body diode. Fabrication specific challenges of the concept are related to the complex integration, formation of ohmic contacts to the functional layers, the specific implementation and processing scheme of the gate trench module and the lateral edge termination. The maximum electric field, which was achieved in the pn- junction of the body diode of the MOSFET is estimated to be around 2.1 MV/cm. From double-sweep transfer measurements with relatively small hysteresis, steep subthreshold slope and a threshold voltage of 3 - 4 V a reasonably good Al2O3/GaN interface quality is indicated. In the conductive state a channel mobility of around 80 - 100 cm2/Vs is estimated. This value is comparable to device with additional overgrowth of the channel. Further enhancement of the OFF-state and ON-state characteristics is expected for optimization of the device termination and the high-k/GaN interface of the vertical trench gate, respectively. From the obtained results and dependencies key figures of an area efficient and competitive device design with thick drift layer is extrapolated. Finally, an outlook is given and advancement possibilities as well as technological limits are discussed.
