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Author: Yi (Grace) Li
Publisher: Springer Science & Business Media
ISBN: 0387887830
Category : Technology & Engineering
Languages : en
Pages : 445
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Book Description
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author: Yi (Grace) Li
Publisher: Springer Science & Business Media
ISBN: 0387887830
Category : Technology & Engineering
Languages : en
Pages : 445
Get Book Here
Book Description
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author: James E. Morris
Publisher: Springer
ISBN: 3319903624
Category : Technology & Engineering
Languages : en
Pages : 1007
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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author: Rajesh Gomatam
Publisher: BRILL
ISBN: 9004165924
Category : Technology & Engineering
Languages : en
Pages : 434
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Book Description
This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Author: C.P. Wong
Publisher: Springer Science & Business Media
ISBN: 1441900403
Category : Technology & Engineering
Languages : en
Pages : 761
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Book Description
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author: Clinton Taubert
Publisher:
ISBN:
Category : Adhesives
Languages : en
Pages : 0
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Book Description
Electrically conductive adhesives (ECAs) have recently become a critical technological area in component development behind solar cell packaging for die attachment, solderless interconnects, and heat dissipation. The standard example of an ECA employs the use of conductive fillers within a polymeric matrix or host to render the final composite conductive. Electrical conductivity of an ECA is governed by percolation theory, wherein the necessary fillers that host electrons transfer, via physical connection or tunneling, must reach some critical volume fraction to accommodate probable conductive pathways that would be large enough to be considered isotropic [1,2]. Many fillers exist for use in this role, but commonly silver is chosen for its high electrical and thermal conductivities [3]. However, silver (especially micro- or nano-structured) remains an expensive commodity, and typical volume fraction loadings in ECA can approach >30%. This is necessary as the theoretical critical volume fraction required for monodisperse spheres in a randomly oriented isotropic system is ~16% [4]. Such excessive filler loading not only invalidates economic feasibility, but also deteriorates mechanical properties inherent for the host polymer. To mitigate the critical percolation threshold (pc) for volume fraction loading of a filler, combative methods are articulated herein. One approach is to use low-dimensional, high-aspect ratio fillers, such as graphene and carbon nanotubes (CNTs), which have been shown to lower pc [5,6]. Typically, such fillers are more expensive than silver; however, given the low-loading implied to achieve a percolated network, this approach could improve the economic feasibility as an added filler for reducing total filler loading required [7]. In this work, commercial CNTs are employed as a high-aspect ratio filler for the reduction of silver filler loading in an ECA system. Graphene nanoplatelets are also synthesized and used to demonstrate a route for creating tailored high-aspect ratio, low-dimensional fillers which are effective at generating a percolated network at relatively low loading. Utilizing a pre-percolated CNT system, a hybrid silver/CNT system was then generated to achieve enhanced conductivity at lower total loading over pure silver systems, which exhibited a conductivity of 54 S/cm at 12 vol.% loading with a CNT loading of only 8 wt.%. 1. Aharoni, S.M. Electrical Resistivity of a Composite of Conducting Particles in an Insulating Matrix J. Appl. Phys. 43, 2463-2465, (1972) 2 .McLachlan, D.S. et al. Electrical Resistivity of Composites. J. Am. Ceram. Soc. 73, 2187-2203 (1990) 3. Morris, J. E. Electrically Conductive Adhesives, A. Comprehensive Review. 37-77 (1999) 4. Bueche, F. Electrical resistivity of Conducting Particles in an Insulating Matrix. J. Appl. Phys. 43, 4837-8 (1972) 5. Lin, X.; Lin, F., Proceedings of High Density Microsystem Design an Packaging, Conference, Shanhai, China. 382-384 (2004) 6. Marcq, F. et al. Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives. Microelectron. Reliab. 51(7), 1230-1234 (2011) 7. Lyons, A. M. Electrically conductive adhesives, Effect of particle composition and size distribution. Polym. Eng. Sci. 31(6), 445-450, (1991)
Author: James J. Licari
Publisher: William Andrew
ISBN: 1437778909
Category : Technology & Engineering
Languages : en
Pages : 415
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Book Description
Approx.512 pages Approx.512 pages
Author: C. P.(Ching-Ping) Wong
Publisher: Springer Nature
ISBN: 303049991X
Category : Technology & Engineering
Languages : en
Pages : 582
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Book Description
This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Author: Stergios Logothetidis
Publisher: Elsevier
ISBN: 1782420436
Category : Technology & Engineering
Languages : en
Pages : 483
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Book Description
Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. Reviews the properties and production of various flexible organic materials. Describes the integration technologies of flexible organic electronics and their manufacturing methods. Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.
Author: M O Alam
Publisher: Elsevier
ISBN: 0857092898
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Author: K. L. Mittal
Publisher: John Wiley & Sons
ISBN: 1118831349
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
