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Author: William G. Duff
Publisher: IET
ISBN: 1891121421
Category : Technology & Engineering
Languages : en
Pages : 306
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Book Description
This book reviews developments in the following topics: electronic system design; EMC; shielding theory; protection technique; bonding; grounding; filter; ferrite; isolator; transient suppressor; cable; and connector.
Author: William G. Duff
Publisher: IET
ISBN: 1891121421
Category : Technology & Engineering
Languages : en
Pages : 306
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Book Description
This book reviews developments in the following topics: electronic system design; EMC; shielding theory; protection technique; bonding; grounding; filter; ferrite; isolator; transient suppressor; cable; and connector.
Author: Jens Lienig
Publisher: Springer
ISBN: 3319558404
Category : Technology & Engineering
Languages : en
Pages : 241
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Book Description
This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.
Author: Karl-Heinz Gonschorek
Publisher: Springer Science & Business Media
ISBN: 3642032907
Category : Technology & Engineering
Languages : en
Pages : 468
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Book Description
The Electromagnetic Compatibility has become an increasingly essential factor for placing a product on the global, world wide market. Fulfilling emission limits and immunity requirements as well as handling apparently complex cases of incompatibility demands a deeper understanding of the physical interrelations and of Maxwell's theory. Based on the authors’ experiences, the textbook provides some help in solving such interferential cases. It contains many illustrative examples and more than 80 exercises with solutions.
Author: Nikolopoulos, Christos D.
Publisher: IGI Global
ISBN: 1522554165
Category : Science
Languages : en
Pages : 346
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Book Description
In the aerospace industry, avoiding operating issues, especially in regard to space missions and satellite structures, is crucial. The vast majority of these issues can be traced to disturbances in the electromagnetic fields used. Electromagnetic Compatibility for Space Systems Design is a critical scholarly resource that examines the applications of electromagnetic compatibility and electromagnetic interference in the space industry. Featuring coverage on a wide range of topics, such as magnetometers, electromagnetic environmental effects, and electromagnetic shielding, this book is geared toward managers, engineers, and researchers seeking current research on the applications of electromagnetic technologies in the aerospace field.
Author: Mark I. Montrose
Publisher: John Wiley & Sons
ISBN: 0471660906
Category : Science
Languages : en
Pages : 344
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Book Description
This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid explanations, this book enablesengineers to grasp both the fundamentals of EMC theory and signalintegrity and the mitigation process needed to prevent an EMCevent. Author Montrose also shows the relationship between time andfrequency domains to help you meet mandatory compliancerequirements placed on printed circuit boards. Using real-world examples the book features: Clear discussions, without complex mathematical analysis, offlux minimization concepts Extensive analysis of capacitor usage for variousapplications Detailed examination of components characteristics with variousgrounding methodologies, including implementation techniques An in-depth study of transmission line theory A careful look at signal integrity, crosstalk, andtermination
Author: Clayton R. Paul
Publisher: John Wiley & Sons
ISBN: 111814399X
Category : Science
Languages : en
Pages : 286
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Book Description
This is a brief but comprehensive book covering the set of EMC skills that EMC practitioners today require in order to be successful in high-speed, digital electronics. The basic skills in the book are new and weren’t studied in most curricula some ten years ago. The rapidly changing digital technology has created this demand for a discussion of new analysis skills particularly for the analysis of transmission lines where the conductors that interconnect the electronic modules have become “electrically large,” longer than a tenth of a wavelength, which are increasingly becoming important. Crosstalk between the lines is also rapidly becoming a significant problem in getting modern electronic systems to work satisfactorily. Hence this text concentrates on the modeling of “electrically large” connection conductors where previously-used Kirchhoff’s voltage and current laws and lumped-circuit modeling have become obsolete because of the increasing speeds of modern digital systems. This has caused an increased emphasis on Signal Integrity. Until as recently as some ten years ago, digital system clock speeds and data rates were in the hundreds of megahertz (MHz) range. Prior to that time, the “lands” on printed circuit boards (PCBs) that interconnect the electronic modules had little or no impact on the proper functioning of those electronic circuits. Today, the clock and data speeds have moved into the low gigahertz (GHz) range.
Author: Keith Armstrong
Publisher:
ISBN: 9780955511844
Category : Electromagnetic compatibility
Languages : en
Pages : 461
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Book Description
Author: Tim Williams
Publisher: Elsevier
ISBN: 9780080469546
Category : Technology & Engineering
Languages : en
Pages : 512
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Book Description
Widely regarded as the standard text on EMC, Tim Williams’ book provides all the key information needed to meet the requirements of the latest EMC Directive. Most importantly, it shows how to incorporate EMC principles into the product design process, avoiding cost and performance penalties, meeting the needs of specific standards and resulting in a better overall product. As well as covering the very latest legal requirements, the fourth edition has been thoroughly updated in line with the latest best practice in EMC compliance and product design. Coverage has been considerably expanded to include the R&TTE and Automotive EMC Directives, as well the military aerospace standards of DEF STAN 59-41 and DO160E. A new chapter on systems EMC is included, while short case studies demonstrate how EMC product design is put into practice. Tim Williams has worked for a variety of companies as an electronic design engineer over the last 25 years. He has monitored the progress of the EMC Directive and its associated standards since it was first made public. He now runs his own consultancy specialising in EMC design and test advice and training. * Includes the compliance procedures of the latest EMC Directive: 2004/108/EC * Short case studies demonstrating how EMC product design is put into practice. * Packed full with many new chapters including: - The R&TTE Directive and the Automotive EMC Directive looking at compliance aspects of radio and telecom terminal equipment and automotive electronic products - New chapter on military aerospace standards of DEP STAN 59-41 and DO1 60E - New chapter on systems EMC
Author: László Tihanyi
Publisher: Newnes
ISBN: 0750623799
Category : Science
Languages : en
Pages : 417
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Book Description
Electronics professionals will find this book invaluable when designing power equipment, because it describes in detail how to cope with the problem of electromagnetic interference. The author shows how to meet the exacting US and European EMC standards for conducted emissions. The book includes a wide range of EMI analysis techniques. An important focus is on the energy content of interference transient signals (traditional analysis concentrates on amplitude and frequency). This provides a more accurate picture of the EMI situation. For those who do not want or need detailed analysis techniques, many approximation methods are also provided. These simplified techniques give accurate results for all but the most stringent applications. The book contains several worked examples and an extensive bibliography, and is sure to be useful to electronic design engineers and others who need to meet international EMC regulations and standards. Laszlo Tihanyi has worked on EMC for over 20 years. Formerly Head of the Department of Power Electronics at the Hungarian Research Institute for the Electrical Industry, he focused primarily on solving EMI problems in electronic systems and developing a dimensioning method for power line filters.
Author: Er-Ping Li
Publisher: John Wiley & Sons
ISBN: 0470623462
Category : Technology & Engineering
Languages : en
Pages : 394
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Book Description
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
