Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures PDF full book. Access full book title Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures by Kanchan Manna. Download full books in PDF and EPUB format.
Author: Kanchan Manna
Publisher: Springer Nature
ISBN: 3030313107
Category : Technology & Engineering
Languages : en
Pages : 167
Get Book Here
Book Description
This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications. Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems; Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems; Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.
Author: Kanchan Manna
Publisher: Springer Nature
ISBN: 3030313107
Category : Technology & Engineering
Languages : en
Pages : 167
Get Book Here
Book Description
This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications. Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems; Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems; Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.
Author: Amit Kumar Singh
Publisher: MDPI
ISBN: 3036508767
Category : Technology & Engineering
Languages : en
Pages : 218
Get Book Here
Book Description
The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends.
Author: Abbas Sheibanyrad
Publisher: Springer
ISBN: 9781461427483
Category : Technology & Engineering
Languages : en
Pages : 278
Get Book Here
Book Description
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Author: Konstantinos Tatas
Publisher: Springer Science & Business Media
ISBN: 1461442745
Category : Technology & Engineering
Languages : en
Pages : 271
Get Book Here
Book Description
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Author: Santanu Kundu
Publisher: CRC Press
ISBN: 1466565276
Category : Technology & Engineering
Languages : en
Pages : 388
Get Book Here
Book Description
Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems.
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
Get Book Here
Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Axel Jantsch
Publisher: Springer Science & Business Media
ISBN: 0306487276
Category : Computers
Languages : en
Pages : 304
Get Book Here
Book Description
As the number of processor cores and IP blocks integrated on a single chip is steadily growing, a systematic approach to design the communication infrastructure becomes necessary. Different variants of packed switched on-chip networks have been proposed by several groups during the past two years. This book summarizes the state of the art of these efforts and discusses the major issues from the physical integration to architecture to operating systems and application interfaces. It also provides a guideline and vision about the direction this field is moving to. Moreover, the book outlines the consequences of adopting design platforms based on packet switched network. The consequences may in fact be far reaching because many of the topics of distributed systems, distributed real-time systems, fault tolerant systems, parallel computer architecture, parallel programming as well as traditional system-on-chip issues will appear relevant but within the constraints of a single chip VLSI implementation.
Author: Laung-Terng Wang
Publisher: Elsevier
ISBN: 0080474799
Category : Technology & Engineering
Languages : en
Pages : 809
Get Book Here
Book Description
This book is a comprehensive guide to new DFT methods that will show the readers how to design a testable and quality product, drive down test cost, improve product quality and yield, and speed up time-to-market and time-to-volume. Most up-to-date coverage of design for testability. Coverage of industry practices commonly found in commercial DFT tools but not discussed in other books. Numerous, practical examples in each chapter illustrating basic VLSI test principles and DFT architectures.
Author: Giovanni De Micheli
Publisher: Elsevier
ISBN: 0080473563
Category : Technology & Engineering
Languages : en
Pages : 408
Get Book Here
Book Description
The design of today's semiconductor chips for various applications, such as telecommunications, poses various challenges due to the complexity of these systems. These highly complex systems-on-chips demand new approaches to connect and manage the communication between on-chip processing and storage components and networks on chips (NoCs) provide a powerful solution. This book is the first to provide a unified overview of NoC technology. It includes in-depth analysis of all the on-chip communication challenges, from physical wiring implementation up to software architecture, and a complete classification of their various Network-on-Chip approaches and solutions. * Leading-edge research from world-renowned experts in academia and industry with state-of-the-art technology implementations/trends * An integrated presentation not currently available in any other book * A thorough introduction to current design methodologies and chips designed with NoCs
Author: Saraju P. Mohanty
Publisher: IET
ISBN: 184919999X
Category : Technology & Engineering
Languages : en
Pages : 439
Get Book Here
Book Description
Continuing from volume 1, this volume outlines circuit- and system-level design approaches and issues for these devices. Topics covered include self-healing analog/RF circuits; on-chip gate delay variability measurement in scaled technology; FinFET SRAM circuits; nanoscale FinFET devices for PVT aware SRAM; low leakage variability aware CMOS logic circuits; thermal effects in MWCNT VLSI interconnects; an accurate PVT-aware statistical logic library for nano-CMOS integrated circuits; SPICEless RTL design optimization of nano-electronic digital integrated circuits; power-delay trade-off driven optimal scheduling of CDFGs during high level synthesis; green on-chip inductors for three-dimensional integrated circuits; 3D NoC -- a promising alternative for tomorrow's nano-system design; and DNA computing.
