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Author: Eli Chiprout
Publisher: Springer Science & Business Media
ISBN: 1461531160
Category : Technology & Engineering
Languages : en
Pages : 207
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Book Description
The intense drive for signal integrity has been at the forefront ofrapid and new developments in CAD algorithms. Thousands ofengineers, intent on achieving the best design possible, use SPICE on a daily basis for analog simulation and general circuit analysis. But the strained demand for high data speeds, coupled with miniaturizationon an unprecedented scale, has highlighted the previously negligible effects of interconnects; effects which are not always handled appro priately by the present levels of SPICE. Signals at these higher speeds may be degraded by long interconnect lengths compared to the increasingly shorter sig nal rise times. Interconnect structures can be diverse (pins, connectors, leads, microstrips, striplines, etc. ) and present at any of the hierarchical packaging levels: integrated circuits, printed circuit boards, multi-chip modules or sys tem backplanes. Analysis of these effects in any CAD package has become a necessity. Asymptotic waveform evaluation (AWE) and other moment matching tech niques have recently proven useful in the analysis of interconnect structures and various networks containing large linear structures with nonlinear termi nations. Previously, all that was available to the designer was a full SPICE simulation or a quick but uncertain timing estimation. Moment matching, used in linear systems analysis as a method of model reduction, describes a method to extract a small set of dominant poles from a large network. The information is obtained from the Taylor series coefficients (moments) of that system.
Author: Eli Chiprout
Publisher: Springer Science & Business Media
ISBN: 1461531160
Category : Technology & Engineering
Languages : en
Pages : 207
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Book Description
The intense drive for signal integrity has been at the forefront ofrapid and new developments in CAD algorithms. Thousands ofengineers, intent on achieving the best design possible, use SPICE on a daily basis for analog simulation and general circuit analysis. But the strained demand for high data speeds, coupled with miniaturizationon an unprecedented scale, has highlighted the previously negligible effects of interconnects; effects which are not always handled appro priately by the present levels of SPICE. Signals at these higher speeds may be degraded by long interconnect lengths compared to the increasingly shorter sig nal rise times. Interconnect structures can be diverse (pins, connectors, leads, microstrips, striplines, etc. ) and present at any of the hierarchical packaging levels: integrated circuits, printed circuit boards, multi-chip modules or sys tem backplanes. Analysis of these effects in any CAD package has become a necessity. Asymptotic waveform evaluation (AWE) and other moment matching tech niques have recently proven useful in the analysis of interconnect structures and various networks containing large linear structures with nonlinear termi nations. Previously, all that was available to the designer was a full SPICE simulation or a quick but uncertain timing estimation. Moment matching, used in linear systems analysis as a method of model reduction, describes a method to extract a small set of dominant poles from a large network. The information is obtained from the Taylor series coefficients (moments) of that system.
Author: Almudena Suarez
Publisher: John Wiley & Sons
ISBN: 0470385898
Category : Technology & Engineering
Languages : en
Pages : 729
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Book Description
Presents simulation techniques that substantially increase designers' control over the oscillationin autonomous circuits This book facilitates a sound understanding of the free-running oscillation mechanism, the start-up from the noise level, and the establishment of the steady-state oscillation. It deals with the operation principles and main characteristics of free-running and injection-locked oscillators, coupled oscillators, and parametric frequency dividers. Analysis and Design of Autonomous Microwave Circuits provides: An exploration of the main nonlinear-analysis methods, with emphasis on harmonic balance and envelope transient methods Techniques for the efficient simulation of the most common autonomous regimes A presentation and comparison of the main stability-analysis methods in the frequency domain A detailed examination of the instabilization mechanisms that delimit the operation bands of autonomous circuits Coverage of techniques used to eliminate common types of undesired behavior, such as spurious oscillations, hysteresis, and chaos A thorough presentation of the oscillator phase noise A comparison of the main methodologies of phase-noise analysis Techniques for autonomous circuit optimization, based on harmonic balance A consideration of different design objectives: presetting the oscillation frequency and output power, increasing efficiency, modifying the transient duration, and imposing operation bands Analysis and Design of Autonomous Microwave Circuits is a valuable resource for microwave designers, oscillator designers, and graduate students in RF microwave design.
Author: Jeong-Taek Kong
Publisher: Springer Science & Business Media
ISBN: 1461523214
Category : Technology & Engineering
Languages : en
Pages : 276
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Book Description
Digital Timing Macromodeling for VLSI Design Verification first of all provides an extensive history of the development of simulation techniques. It presents detailed discussion of the various techniques implemented in circuit, timing, fast-timing, switch-level timing, switch-level, and gate-level simulation. It also discusses mixed-mode simulation and interconnection analysis methods. The review in Chapter 2 gives an understanding of the advantages and disadvantages of the many techniques applied in modern digital macromodels. The book also presents a wide variety of techniques for performing nonlinear macromodeling of digital MOS subcircuits which address a large number of shortcomings in existing digital MOS macromodels. Specifically, the techniques address the device model detail, transistor coupling capacitance, effective channel length modulation, series transistor reduction, effective transconductance, input terminal dependence, gate parasitic capacitance, the body effect, the impact of parasitic RC-interconnects, and the effect of transmission gates. The techniques address major sources of errors in existing macromodeling techniques, which must be addressed if macromodeling is to be accepted in commercial CAD tools by chip designers. The techniques presented in Chapters 4-6 can be implemented in other macromodels, and are demonstrated using the macromodel presented in Chapter 3. The new techniques are validated over an extremely wide range of operating conditions: much wider than has been presented for previous macromodels, thus demonstrating the wide range of applicability of these techniques.
Author: Ayman Issam Kayssi
Publisher:
ISBN:
Category :
Languages : en
Pages : 326
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Book Description
Author: Mustafa Celik
Publisher: Springer Science & Business Media
ISBN: 0306479710
Category : Technology & Engineering
Languages : en
Pages : 316
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Book Description
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1351837583
Category : Technology & Engineering
Languages : en
Pages : 704
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Book Description
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Author: Ernest S. Kuh
Publisher: World Scientific
ISBN: 9789810209254
Category : Technology & Engineering
Languages : en
Pages : 172
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Book Description
Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1482254611
Category : Technology & Engineering
Languages : en
Pages : 798
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Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Author:
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 2332
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Book Description
Author: Piet Wambacq
Publisher: Springer Science & Business Media
ISBN: 0306480891
Category : Technology & Engineering
Languages : en
Pages : 318
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Book Description
This unique book provides an overview of the current state of the art and very recent research results that have been achieved as part of the Low-Power Initiative of the European Union, in the field of analogue, RF and mixed-signal design methodologies and CAD tools.
