Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D PDF Download
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Author: Fengyuan Sun
Publisher: Editions Publibook
ISBN: 2753903298
Category :
Languages : en
Pages : 178
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Book Description
The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Author: Fengyuan Sun
Publisher: Editions Publibook
ISBN: 2753903298
Category :
Languages : en
Pages : 178
Get Book Here
Book Description
The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Author: Fengyuan Sun
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Book Description
The 3D integration is the most promising technological solution to track the level of integration dictated by Moore's Law (see more than Moore, Moore versus more). It leads to important research for a dozen years. It can superimpose different circuits and components in one box. Its main advantage is to allow a combination of heterogeneous and highly specialized technologies for the establishment of a complete system, while maintaining a high level of performance with very short connections between the different circuits. The objective of this work is to provide consistent modeling via crossing, and / or contacts in the substrate, with various degrees of finesse / precision to allow the high-level designer to manage and especially to optimize the partitioning between the different strata. This modelization involves the development of multiple views at different levels of abstraction: the physical model to "high level" model. This would allow to address various issues faced in the design process: - The physical model using an electromagnetic simulation based on 2D or 3D ( finite element solver ) is used to optimize the via (materials, dimensions etc..) It determines the electrical performance of the via, including high frequency. Electromagnetic simulations also quantify the coupling between adjacent via. - The analytical compact of via their coupling model, based on a description of transmission line or Green cores is used for the simulations at the block level and Spice type simulations. Analytical models are often validated against measurements and / or physical models.
Author: Yue Ma
Publisher: CRC Press
ISBN: 0429680074
Category : Computers
Languages : en
Pages : 226
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Book Description
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Author: Elie Eid
Publisher:
ISBN:
Category :
Languages : fr
Pages : 0
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Book Description
Afin d'améliorer les performances électriques dans les circuits intégrés en 3D, une large modélisation électromagnétique et une caractérisation haute fréquence sont requises. Cela a pour but de quantifier et prédire les phénomènes de couplage par le substrat qui peuvent survenir dans ces circuits intégrés. Ces couplages sont principalement dus aux nombreuses interconnexions verticales par unité de volume qui traversent le silicium et que l'on nomme « Through Silicon Vias » (TSV).L'objectif de cette thèse est de proposer des règles d'optimisation des performances, à savoir la minimisation des effets de couplage par les substrats en RF. Pour cela, différentes configurations de structures de test utilisées pour analyser le couplage sont caractérisées.Les caractérisations sont effectuées sur un très large spectre de fréquence. Les paramètres d'analyse sont les épaisseurs du substrat, les architectures des vias traversant (diamètres, densités, types de barrières), ainsi que la nature des matériaux utilisés. Des modèles électriques permettant de prédire les phénomènes de couplage sont extraits. Différents outils pour l'analyse de ces effets, sont développés dans notre laboratoire. Parallèlement un important travail de modélisation 3D est mené de façon à confronter mesure et simulation et valider nos résultats. Des stratégies d'optimisation pour réduire ces phénomènes dans les circuits 3D ont été proposées, ce qui a permis de fournir de riches informations aux designers.
Author:
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 300
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Book Description
Author:
Publisher:
ISBN:
Category : Efferent pathways
Languages : en
Pages : 1038
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Book Description
Author: R. D. Keynes
Publisher: Cambridge University Press
ISBN: 9780521805841
Category : Medical
Languages : en
Pages : 196
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Book Description
Essential textbook for all undergraduate students of neurobiology, physiology, cell biology and preclinical medicine.
Author: Canada. Patent Office
Publisher:
ISBN:
Category : Copyright
Languages : en
Pages : 1070
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Book Description
Author: Jean-Louis Boulanger
Publisher: John Wiley & Sons
ISBN: 1119002923
Category : Computers
Languages : en
Pages : 342
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Book Description
This book presents real-world examples of formal techniques in an industrial context. It covers formal methods such as SCADE and/or the B Method, in various fields such as railways, aeronautics, and the automotive industry. The purpose of this book is to present a summary of experience on the use of “formal methods” (based on formal techniques such as proof, abstract interpretation and model-checking) in industrial examples of complex systems, based on the experience of people currently involved in the creation and assessment of safety critical system software. The involvement of people from within the industry allows the authors to avoid the usual confidentiality problems which can arise and thus enables them to supply new useful information (photos, architecture plans, real examples, etc.).
Author: Stanley A. Schumm
Publisher: Cambridge University Press
ISBN: 1139444786
Category : Science
Languages : en
Pages : 234
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Book Description
Rivers differ among themselves and through time. An individual river can vary significantly downstream, changing its dimensions and pattern dramatically over a short distance. If hydrology and hydraulics were the primary controls on the morphology and behaviour of large rivers, we would expect long reaches of rivers to maintain characteristic and relatively uniform morphologies. In fact, this is not the case - the variability of large rivers indicates that other important factors are involved. River Variability and Complexity presents an interesting approach to the understanding of river variability. It provides examples of river variability and explains the reasons for them, including fluvial response to human activities. Understanding the mechanisms of variability is important for geomorphologists, geologists, river engineers and sedimentologists as they attempt to interpret ancient fluvial deposits or anticipate river behaviour at different locations and through time. This book provides an excellent background for graduates, researchers and professionals.
