Advances in Microcrystalline and Nanocrystalline: Volume 452 PDF Download
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Author: Robert W. Collins
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1098
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Book Description
Proceedings of the December 1996 symposium. Contains 159 papers which describe materials advances involving stuctures spanning more than five orders of magnitude in size--from Group IV molecular clusters to single-crystal grains large enough for fabrication of thin-film transistors within their boundaries. Sections cover topics such as the theory of semiconductor molecular clusters and nanocrystals; luminescent Group IV clusters/nanocrystals and quantum wells; semiconductor systems confined in three and one dimensions; Group III- V, Group II-VI, and metal sulfide, iodide, and oxide nanocrystals; porous silicon; applications of nanocrystal and porous semiconductors; light-emitting properties and applications of porous Si; and research results on the nano-, micro-, and polycrystalline thin films. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Robert W. Collins
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1098
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Book Description
Proceedings of the December 1996 symposium. Contains 159 papers which describe materials advances involving stuctures spanning more than five orders of magnitude in size--from Group IV molecular clusters to single-crystal grains large enough for fabrication of thin-film transistors within their boundaries. Sections cover topics such as the theory of semiconductor molecular clusters and nanocrystals; luminescent Group IV clusters/nanocrystals and quantum wells; semiconductor systems confined in three and one dimensions; Group III- V, Group II-VI, and metal sulfide, iodide, and oxide nanocrystals; porous silicon; applications of nanocrystal and porous semiconductors; light-emitting properties and applications of porous Si; and research results on the nano-, micro-, and polycrystalline thin films. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Leigh T. Canham
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 600
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 1999.
Author: B. M. Caruta
Publisher: Nova Publishers
ISBN: 9781594548970
Category : Technology & Engineering
Languages : en
Pages : 304
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Book Description
Nanotechnology is a 'catch-all' description of activities at the level of atoms and molecules that have applications in the real world. A nanometre is a billionth of a meter, about 1/80,000 of the diameter of a human hair, or 10 times the diameter of a hydrogen atom. Nanotechnology is now used in precision engineering, new materials development as well as in electronics; electromechanical systems as well as mainstream biomedical applications in areas such as gene therapy, drug delivery and novel drug discovery techniques. This book presents the latest research in this frontier field.
Author: P. Schmuki
Publisher: The Electrochemical Society
ISBN: 9781566771344
Category : Science
Languages : en
Pages : 556
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Book Description
Author: Electrochemical Society. Energy Technology Division
Publisher: The Electrochemical Society
ISBN: 9781566772334
Category : Technology & Engineering
Languages : en
Pages : 318
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Book Description
Author: Fernando A. Ponce
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1290
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Book Description
Author: Steven K. Groothuis
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344
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Book Description
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Author:
Publisher:
ISBN:
Category : Catalysts
Languages : en
Pages : 296
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Book Description
Author: Clyde L. Briant
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 546
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Book Description
The study of interfaces is one of the oldest areas of research in materials science. The presence of grain boundaries in materials has long been recognized, as has its crucial role in determining mechanical properties. Another long-recognized concept is that the properties of a surface are quite different from those of the bulk. In recent years, researchers have been able to study these interfaces, both internal and external, with a detail not before possible. These advances have stemmed from the ability to obtain atomic resolution images of interfaces, to measure accurate chemical compositions of interfaces, and to model these interfaces and their properties. This volume goes a step further, beyond structural and chemical studies, to explore how all of this information can be used to engineer interfaces for improved properties and overall improved material performance. Significant attention is given to the crystallographic nature of grain boundaries and interfaces, and the relationship between this nature and the performance of a material. The versatility of electron back-scattering pattern analysis (EBSP) in solving a number of interface-related problems is also featured.
Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 1010
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Book Description
