2012 IEEE Nanotechnology Materials and Devices Conference (NMDC2012). PDF Download
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Languages : en
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Languages : en
Pages : 223
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Author: IEEE Staff
Publisher:
ISBN: 9781479917020
Category :
Languages : en
Pages :
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Graphene and Nanotube Based Materials and Devices MEMS NEMS for Bio Nanotechnology Characterization and Simulation of Nanomaterials and Nanostructures Materials and Devices for Nanoelectronics, Nano Optics Materials and Devices for Energy and Environmental Applications
Author: Mourad Elsobky
Publisher: Cambridge University Press
ISBN: 1108983383
Category : Technology & Engineering
Languages : en
Pages : 92
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Book Description
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
Author: Gennady Gildenblat
Publisher: Springer Science & Business Media
ISBN: 9048186145
Category : Technology & Engineering
Languages : en
Pages : 531
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Book Description
Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.
Author: Samar K. Saha
Publisher: CRC Press
ISBN: 0429998082
Category : Technology & Engineering
Languages : en
Pages : 260
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Book Description
To surmount the continuous scaling challenges of MOSFET devices, FinFETs have emerged as the real alternative for use as the next generation device for IC fabrication technology. The objective of this book is to provide the basic theory and operating principles of FinFET devices and technology, an overview of FinFET device architecture and manufacturing processes, and detailed formulation of FinFET electrostatic and dynamic device characteristics for IC design and manufacturing. Thus, this book caters to practicing engineers transitioning to FinFET technology and prepares the next generation of device engineers and academic experts on mainstream device technology at the nanometer-nodes.
Author: Samar K. Saha
Publisher: CRC Press
ISBN: 1351831070
Category : Technology & Engineering
Languages : en
Pages : 385
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Book Description
Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond provides a modern treatise on compact models for circuit computer-aided design (CAD). Written by an author with more than 25 years of industry experience in semiconductor processes, devices, and circuit CAD, and more than 10 years of academic experience in teaching compact modeling courses, this first-of-its-kind book on compact SPICE models for very-large-scale-integrated (VLSI) chip design offers a balanced presentation of compact modeling crucial for addressing current modeling challenges and understanding new models for emerging devices. Starting from basic semiconductor physics and covering state-of-the-art device regimes from conventional micron to nanometer, this text: Presents industry standard models for bipolar-junction transistors (BJTs), metal-oxide-semiconductor (MOS) field-effect-transistors (FETs), FinFETs, and tunnel field-effect transistors (TFETs), along with statistical MOS models Discusses the major issue of process variability, which severely impacts device and circuit performance in advanced technologies and requires statistical compact models Promotes further research of the evolution and development of compact models for VLSI circuit design and analysis Supplies fundamental and practical knowledge necessary for efficient integrated circuit (IC) design using nanoscale devices Includes exercise problems at the end of each chapter and extensive references at the end of the book Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond is intended for senior undergraduate and graduate courses in electrical and electronics engineering as well as for researchers and practitioners working in the area of electron devices. However, even those unfamiliar with semiconductor physics gain a solid grasp of compact modeling concepts from this book.
Author: D. S. Ballantine Jr.
Publisher: Elsevier
ISBN: 0080523331
Category : Science
Languages : en
Pages : 451
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Book Description
Written by an interdisciplinary group of experts from both industry and academia, Acoustic Wave Sensors provides an in-depth look at the current state of acoustic wave devices and the scope of their use in chemical, biochemical, and physical measurements, as well as in engineering applications. Because of the inherent interdisciplinary applications of these devices, this book will be useful for the chemist and biochemist interested in the use and development ofthese sensors for specific applications; the electrical engineer involved in the design and improvement of these devices; the chemical engineer and the biotechnologist interested in using these devices for process monitoring and control; and the sensor community at large. Provides in-depth comparison and analyses of different types of acoustic wave devices Discusses operating principles and design considerations Includes table of relevant material constants for quick reference Presents an extensive review of current uses of these devices for chemical, biochemical, and physical measurements, and engineering applications
Author: Vijay Kumar Thakur
Publisher: Springer
ISBN: 8132224701
Category : Technology & Engineering
Languages : en
Pages : 578
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Book Description
This book contains precisely referenced chapters, emphasizing environment-friendly polymer nanocomposites with basic fundamentals, practicality and alternatives to traditional nanocomposites through detailed reviews of different environmental friendly materials procured from different resources, their synthesis and applications using alternative green approaches. The book aims at explaining basics of eco-friendly polymer nanocomposites from different natural resources and their chemistry along with practical applications which present a future direction in the biomedical, pharmaceutical and automotive industry. The book attempts to present emerging economic and environmentally friendly polymer nanocomposites that are free from side effects studied in the traditional nanocomposites. This book is the outcome of contributions by many experts in the field from different disciplines, with various backgrounds and expertises. This book will appeal to researchers as well as students from different disciplines. The content includes industrial applications and will fill the gap between the research works in laboratory to practical applications in related industries.
Author: Alper Erturk
Publisher: John Wiley & Sons
ISBN: 1119991358
Category : Technology & Engineering
Languages : en
Pages : 377
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Book Description
The transformation of vibrations into electric energy through the use of piezoelectric devices is an exciting and rapidly developing area of research with a widening range of applications constantly materialising. With Piezoelectric Energy Harvesting, world-leading researchers provide a timely and comprehensive coverage of the electromechanical modelling and applications of piezoelectric energy harvesters. They present principal modelling approaches, synthesizing fundamental material related to mechanical, aerospace, civil, electrical and materials engineering disciplines for vibration-based energy harvesting using piezoelectric transduction. Piezoelectric Energy Harvesting provides the first comprehensive treatment of distributed-parameter electromechanical modelling for piezoelectric energy harvesting with extensive case studies including experimental validations, and is the first book to address modelling of various forms of excitation in piezoelectric energy harvesting, ranging from airflow excitation to moving loads, thus ensuring its relevance to engineers in fields as disparate as aerospace engineering and civil engineering. Coverage includes: Analytical and approximate analytical distributed-parameter electromechanical models with illustrative theoretical case studies as well as extensive experimental validations Several problems of piezoelectric energy harvesting ranging from simple harmonic excitation to random vibrations Details of introducing and modelling piezoelectric coupling for various problems Modelling and exploiting nonlinear dynamics for performance enhancement, supported with experimental verifications Applications ranging from moving load excitation of slender bridges to airflow excitation of aeroelastic sections A review of standard nonlinear energy harvesting circuits with modelling aspects.