Author:
Publisher: IEEE Computer Society Press
ISBN: 9780780378261
Category : Technology & Engineering
Languages : en
Pages : 329
Book Description
Taken from the proceedings of the 2003 International Conference of the Simulation of Semiconductor Processes and Devices (SISPAD 2003), this volume looks at electron devices.
2003 IEEE International Conference on Simulation of Semiconductor Processes and Devices
Author:
Publisher: IEEE Computer Society Press
ISBN: 9780780378261
Category : Technology & Engineering
Languages : en
Pages : 329
Book Description
Taken from the proceedings of the 2003 International Conference of the Simulation of Semiconductor Processes and Devices (SISPAD 2003), this volume looks at electron devices.
Publisher: IEEE Computer Society Press
ISBN: 9780780378261
Category : Technology & Engineering
Languages : en
Pages : 329
Book Description
Taken from the proceedings of the 2003 International Conference of the Simulation of Semiconductor Processes and Devices (SISPAD 2003), this volume looks at electron devices.
2003 IEEE International Conference on Acoustics, Speech, and Signal Processing
Author:
Publisher:
ISBN: 9780780376632
Category : Electro-acoustics
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9780780376632
Category : Electro-acoustics
Languages : en
Pages :
Book Description
Simulation of Semiconductor Processes and Devices 2004
Author: Gerhard Wachutka
Publisher: Springer Science & Business Media
ISBN: 3709106249
Category : Technology & Engineering
Languages : en
Pages : 387
Book Description
This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004. The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world. Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.
Publisher: Springer Science & Business Media
ISBN: 3709106249
Category : Technology & Engineering
Languages : en
Pages : 387
Book Description
This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004. The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world. Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.
International Conference on Simulation of Semiconductor Processes and Devices
Author:
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 368
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 368
Book Description
SISPAD '97
Author: International Conference on Simulation of Semiconductor Processes and Devices
Publisher:
ISBN:
Category : Electronic books
Languages : en
Pages : 353
Book Description
Publisher:
ISBN:
Category : Electronic books
Languages : en
Pages : 353
Book Description
1997 International Conference on Simulation of Semiconductor Processes and Devices
Author: IEEE Electron Devices Society
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780337756
Category : Technology & Engineering
Languages : en
Pages : 353
Book Description
This conference is aimed at providing an opportunity for presentation and discussion of topics in process, device and circuit modelling for semiconductors. The proceedings contains all papers presented and should serve as a source for scientists and engineers engaged in research and development.
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780337756
Category : Technology & Engineering
Languages : en
Pages : 353
Book Description
This conference is aimed at providing an opportunity for presentation and discussion of topics in process, device and circuit modelling for semiconductors. The proceedings contains all papers presented and should serve as a source for scientists and engineers engaged in research and development.
2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).
Author:
Publisher:
ISBN: 9781538667903
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781538667903
Category :
Languages : en
Pages :
Book Description
SISPAD 2017
Author:
Publisher:
ISBN:
Category : Computer-aided design
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category : Computer-aided design
Languages : en
Pages :
Book Description
2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).
Author:
Publisher:
ISBN: 9784863487635
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9784863487635
Category :
Languages : en
Pages :
Book Description
1997 International Conference on Simulation of Semiconductor Processes and Devices
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 353
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 353
Book Description