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Author: United States. Bureau of Naval Weapons
Publisher:
ISBN:
Category : Design
Languages : en
Pages : 486
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Book Description
Author: United States. Bureau of Naval Weapons
Publisher:
ISBN:
Category : Design
Languages : en
Pages : 486
Get Book Here
Book Description
Author: Estados Unidos. Bureau of the Naval Weapons
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author: United States. Bureau of Naval Weapons
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 0
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Author: George Shiers
Publisher:
ISBN:
Category :
Languages : en
Pages : 382
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Book Description
Author: Department of Department of Defense
Publisher:
ISBN: 9781986310178
Category :
Languages : en
Pages : 396
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Book Description
MIL-HDBK-419A 29 DECEMBER 1987 Volume 2 of 2 Applications Unfortunately, few Military Handbooks address the need for defense against electromagnetic pulse (EMP) and cybersecurity. While EMP has been thought of as a remote possibility (who in his right mind is going to launch a nuclear weapon of any kind against the U.S.?) Advances in non-nuclear EMP, miniaturization of electronics and autonomous drones suddenly brings EMP into the role of the possible. No longer would an adversary need to risk retaliation when a drone from an unknown source attacks a vital facility. The information in this book is part of the solution to the question "How do we defend against EMP?" List of Applicable EMP and Cybersecurity Publications: MIL-STD-188-125-1 High-altitude electromagnetic pulse (HEMP) Protection For Ground-Based C4I Facilities Performing Critical, Time-Urgent Missions MIL-STD-188-124A Grounding, Bonding and Shielding for Common Long Haul/Tactical Communication Systems MIL-HDBK -1195 Radio Frequency Shielded Enclosures TOP 01-2-620 High-Altitude Electromagnetic Pulse (HEMP) Testing MIL-HDBK-1012/1 Electronic Facilities Engineering MIL-HDBK-1013/1A Design Guidelines for Physical Security of Facilities
Author:
Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 24
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Book Description
Author: Truck and Bus Electrical Systems Committee
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Book Description
The climatic, dynamic, and electrical environments from naturaland vehicle-induced sources that influence the performance andreliability of vehicle and tractor/trailer electronic components,are included in this sAE Recommended Practice. Test methods thatcan be used to simulate these environmental conditions are alsoincluded. This information is applicable to diesel power trucks inClasses 6, 7, and 8.This guideline is intended to aid the designer of automotiveelectronic systems and components by providing material that may beused to develop environmental design goals.The last review of this document was August, 1994. The task force was reformed and the entire document was reviewedfor current practices. Minor changes were made for previous typos. The new areas identified that need to be addressedwith further research are new corrosion tests due to the new chemicals that are being used on the roadways and asecond test alternative to be added for a higher pressure spray. When the work is completed it will be incorporated intothe document via the proper procedures.
Author: Stephen Sangwine
Publisher: CRC Press
ISBN: 1351837664
Category : Technology & Engineering
Languages : en
Pages : 247
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Book Description
Most introductory textbooks in electronics focus on the theory while leaving the practical aspects to be covered in laboratory courses. However, the sooner such matters are introduced, the better able students will be to include such important concerns as parasitic effects and reliability at the very earliest stages of design. This philosophy has kept Electronic Components and Technology thriving for two decades, and this completely updated third edition continues the approach with a more international outlook. Not only does this textbook introduce the properties, behavior, fabrication, and use of electronic components, it also helps students grasp and apply sound engineering practice by incorporating in-depth discussions on topics such as safety and reliability. The author employs a holistic treatment that clearly demonstrates how electronic components and subsystems work together, reinforcing the concepts with numerous examples, case studies, problems, illustrations, and objectives. This edition was updated to reflect advances and changes to industrial practice, including packaging technologies, digital oscilloscopes, lead-free solders, and new battery technologies. Additionally, the text's scope now extends to include terminology and standards used worldwide. Including coverage of topics often ignored in other textbooks on the subject, Electronic Components and Technology, Third Edition encourages students to be better, more thoughtful designers and prepares them with current industrial practices.
Author: Robert S. Villanucci
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 584
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Book Description
This solid classic presents a practical and realistic approach for developing skills in planning, designing and constructing electronic equipment. Its logical presentation helps beginning technicians become competent in all aspects of electronic packaging design and fabrication techniques. Tracks today's sophisticated design, construction and packaging techniques brought about by the adoption of new electronic device packages for high-density assemblies in conjunction with more functionally complicated printed circuit board technologies. The authors incorporates new material on safety throughout the book, including the latest mailing and Internet addresses of government agencies and private companies involved in safety. Features new material on ergonomics related to using computers. Includes material on multilayer printed circuit board design, layer-to-layer coding, layer representation, antipad and thermal relief pad configurations, and a simple four layer MLB design. Expands coverage of PCB Soldering to include new data acquisition equipment to accurately measure the thermal profile of a soldering iron, as well as new material on cleaning solvents so that informed selections can be made to better protect the atmosphere. Increases coverage of Surface Mount Technology to include new equipment for prototype work as well as small-to-medium volume production.
Author: Electronic Engineering Association (Great Britain)
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 87
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Book Description
