ULSI Process Integration 6 PDF Download
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Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1566777445
Category : Integrated circuits
Languages : en
Pages : 547
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Book Description
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1566777445
Category : Integrated circuits
Languages : en
Pages : 547
Get Book
Book Description
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Author: C. L. Claeys
Publisher:
ISBN: 9781607680949
Category : Integrated circuits
Languages : en
Pages : 533
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Book Description
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1607686759
Category :
Languages : en
Pages : 335
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Book Description
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 1566775728
Category : Integrated circuits
Languages : en
Pages : 509
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Book Description
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566772419
Category : Computers
Languages : en
Pages : 408
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Book Description
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
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Book Description
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1607682613
Category :
Languages : en
Pages : 429
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Book Description
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566773089
Category : Technology & Engineering
Languages : en
Pages : 636
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Book Description
Author: D. Harame
Publisher: The Electrochemical Society
ISBN: 1607685434
Category :
Languages : en
Pages : 1042
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Book Description
Author: Rajiv Kohli
Publisher: William Andrew
ISBN: 9781437778311
Category : Science
Languages : en
Pages : 312
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Book Description
Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. Topics covered include: A systems analysis approach to contamination control Physical factors that influence the behavior of particle deposition in enclosures An overview of current yield models and description of advanced models Types of strippable coatings, their properties and applications of these coatings for removal of surface contaminants In-depth coverage of ultrasonic cleaning Contamination and cleaning issues at the nanoscale Experimental results illustrating the impact of model parameters on the removal of particle contamination The expert contributions in this book provide a valuable source of information on the current status and recent developments in surface contamination and cleaning. The book will be of value to industry, government and academic personnel involved in research and development, manufacturing, process and quality control, and procurement specifications across sectors including microelectronics, aerospace, optics, xerography and joining (adhesive bonding). ABOUT THE EDITORS Rajiv Kohli is a leading expert with The Aerospace Corporation in contaminant particle behavior, surface cleaning, and contamination control. At the NASA Johnson Space Center in Houston, Texas, he provides technical support for contamination control related to ground-based and manned spaceflight hardware for the Space Shuttle, the International Space Station, and the new Constellation Program that is designed to meet the United States Vision for Space Exploration. Kashmiri Lal "Kash" Mittal was associated with IBM from 1972 to 1994. Currently, he is teaching and consulting in the areas of surface contamination and cleaning, and in adhesion science and technology. He is the Editor-in-Chief of the Journal of Adhesion Science and Technology and is the editor of 98 published books, many of them dealing with surface contamination and cleaning. Also available Developments in Surface Contamination and Cleaning, Volume 1: Fundamentals and Applied Aspects (edited by Rajiv Kohli & K.L. Mittal). ISBN: 9780815515555. · Provides guidance on best-practice cleaning techniques and the avoidance of surface contamination · Covers contamination and cleaning issues at the nanoscale · Includes an in-depth look at ultrasonic cleaning
