Author: Katayun Barmak
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671
Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Metallic Films for Electronic, Optical and Magnetic Applications
Author: Katayun Barmak
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671
Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671
Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Thin Films Stresses and Mechanical Properties VI
Author: William W. Gerberich
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Thin Films Stresses and Mechanical Properties VI
Author: Shefford P. Baker
Publisher: Materials Research Society
ISBN: 9781558993396
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Publisher: Materials Research Society
ISBN: 9781558993396
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Thin Films--stresses and Mechanical Properties XI
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 480
Book Description
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 480
Book Description
Thin Films - Stresses and Mechanical Properties VIII: Volume 594
Author: Richard Vinci
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 576
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 576
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Thin Films--stresses and Mechanical Properties X
Author: Sean G. Corcoran
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 616
Book Description
This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 616
Book Description
This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)
Mechanical Properties of Materials
Author: Joshua Pelleg
Publisher: Springer Science & Business Media
ISBN: 9400743424
Category : Science
Languages : en
Pages : 645
Book Description
The subject of mechanical behavior has been in the front line of basic studies in engineering curricula for many years. This textbook was written for engineering students with the aim of presenting, in a relatively simple manner, the basic concepts of mechanical behavior in solid materials. A second aim of the book is to guide students in their laboratory experiments by helping them to understand their observations in parallel with the lectures of their various courses; therefore the first chapter of the book is devoted to mechanical testing. Another aim of the book is to provide practicing engineers with basic help to bridge the gap of time that has passed from their graduation up to their actual involvement in engineering work. The book also serves as the basis for more advanced studies and seminars when pursuing courses on a graduate level. The content of this textbook and the topics discussed correspond to courses that are usually taught in universities and colleges all over the world, but with a different and more modern approach. It is however unique by the inclusion of an extensive chapter on mechanical behavior in the micron and submicron/nanometer range. Mechanical deformation phenomena are explained and often related to the presence of dislocations in structures. Many practical illustrations are provided representing various observations encountered in actual structures of particularly technical significance. A comprehensive list of references at the end of each chapter is included to provide a broad basis for further studying the subject.
Publisher: Springer Science & Business Media
ISBN: 9400743424
Category : Science
Languages : en
Pages : 645
Book Description
The subject of mechanical behavior has been in the front line of basic studies in engineering curricula for many years. This textbook was written for engineering students with the aim of presenting, in a relatively simple manner, the basic concepts of mechanical behavior in solid materials. A second aim of the book is to guide students in their laboratory experiments by helping them to understand their observations in parallel with the lectures of their various courses; therefore the first chapter of the book is devoted to mechanical testing. Another aim of the book is to provide practicing engineers with basic help to bridge the gap of time that has passed from their graduation up to their actual involvement in engineering work. The book also serves as the basis for more advanced studies and seminars when pursuing courses on a graduate level. The content of this textbook and the topics discussed correspond to courses that are usually taught in universities and colleges all over the world, but with a different and more modern approach. It is however unique by the inclusion of an extensive chapter on mechanical behavior in the micron and submicron/nanometer range. Mechanical deformation phenomena are explained and often related to the presence of dislocations in structures. Many practical illustrations are provided representing various observations encountered in actual structures of particularly technical significance. A comprehensive list of references at the end of each chapter is included to provide a broad basis for further studying the subject.
Comprehensive Structural Integrity
Author: Ian Milne
Publisher: Elsevier
ISBN: 0080490735
Category : Business & Economics
Languages : en
Pages : 4647
Book Description
The aim of this major reference work is to provide a first point of entry to the literature for the researchers in any field relating to structural integrity in the form of a definitive research/reference tool which links the various sub-disciplines that comprise the whole of structural integrity. Special emphasis will be given to the interaction between mechanics and materials and structural integrity applications. Because of the interdisciplinary and applied nature of the work, it will be of interest to mechanical engineers and materials scientists from both academic and industrial backgrounds including bioengineering, interface engineering and nanotechnology. The scope of this work encompasses, but is not restricted to: fracture mechanics, fatigue, creep, materials, dynamics, environmental degradation, numerical methods, failure mechanisms and damage mechanics, interfacial fracture and nano-technology, structural analysis, surface behaviour and heart valves. The structures under consideration include: pressure vessels and piping, off-shore structures, gas installations and pipelines, chemical plants, aircraft, railways, bridges, plates and shells, electronic circuits, interfaces, nanotechnology, artificial organs, biomaterial prostheses, cast structures, mining... and more. Case studies will form an integral part of the work.
Publisher: Elsevier
ISBN: 0080490735
Category : Business & Economics
Languages : en
Pages : 4647
Book Description
The aim of this major reference work is to provide a first point of entry to the literature for the researchers in any field relating to structural integrity in the form of a definitive research/reference tool which links the various sub-disciplines that comprise the whole of structural integrity. Special emphasis will be given to the interaction between mechanics and materials and structural integrity applications. Because of the interdisciplinary and applied nature of the work, it will be of interest to mechanical engineers and materials scientists from both academic and industrial backgrounds including bioengineering, interface engineering and nanotechnology. The scope of this work encompasses, but is not restricted to: fracture mechanics, fatigue, creep, materials, dynamics, environmental degradation, numerical methods, failure mechanisms and damage mechanics, interfacial fracture and nano-technology, structural analysis, surface behaviour and heart valves. The structures under consideration include: pressure vessels and piping, off-shore structures, gas installations and pipelines, chemical plants, aircraft, railways, bridges, plates and shells, electronic circuits, interfaces, nanotechnology, artificial organs, biomaterial prostheses, cast structures, mining... and more. Case studies will form an integral part of the work.
Surface Properties And Engineering Of Complex Intermetallics
Author: Esther Belin-ferre
Publisher: World Scientific
ISBN: 9814465011
Category : Science
Languages : en
Pages : 408
Book Description
This book is the third in a series of 4 books issued yearly as a deliverable of the research school established within the European Network of Excellence CMA (for Complex Metallic Alloys). It is written by reputed experts in the fields of surface physics and chemistry, metallurgy and process engineering, combining expertise found inside as well as outside the network.The CMA network focuses on the huge group of largely unknown multinary alloys and compounds formed with crystal structures based on giant unit cells containing clusters, with many tens or up to more than thousand atoms per unit cell. In these phases, for many phenomena, the physical length scales are substantially smaller than the unit-cell dimension. Hence, these materials offer unique combinations of properties, which are mutually excluded in conventional materials: metallic electric conductivity combined with low thermal conductivity, combination of good light absorption with high-temperature stability, combination of high metallic hardness with reduced wetting by liquids, electrical and thermal resistance tuneable by composition variation, excellent resistance to corrosion, reduced cold-welding and adhesion, enhanced hydrogen storage capacity and light absorption, etc.The series of books will concentrate on: development of fundamental knowledge with the aim of understanding materials phenomena, technologies associated with the production, transformation and processing of knowledge-based multifunctional materials, surface engineering, support for new materials development and new knowledge-based higher performance materials for macro-scale applications.
Publisher: World Scientific
ISBN: 9814465011
Category : Science
Languages : en
Pages : 408
Book Description
This book is the third in a series of 4 books issued yearly as a deliverable of the research school established within the European Network of Excellence CMA (for Complex Metallic Alloys). It is written by reputed experts in the fields of surface physics and chemistry, metallurgy and process engineering, combining expertise found inside as well as outside the network.The CMA network focuses on the huge group of largely unknown multinary alloys and compounds formed with crystal structures based on giant unit cells containing clusters, with many tens or up to more than thousand atoms per unit cell. In these phases, for many phenomena, the physical length scales are substantially smaller than the unit-cell dimension. Hence, these materials offer unique combinations of properties, which are mutually excluded in conventional materials: metallic electric conductivity combined with low thermal conductivity, combination of good light absorption with high-temperature stability, combination of high metallic hardness with reduced wetting by liquids, electrical and thermal resistance tuneable by composition variation, excellent resistance to corrosion, reduced cold-welding and adhesion, enhanced hydrogen storage capacity and light absorption, etc.The series of books will concentrate on: development of fundamental knowledge with the aim of understanding materials phenomena, technologies associated with the production, transformation and processing of knowledge-based multifunctional materials, surface engineering, support for new materials development and new knowledge-based higher performance materials for macro-scale applications.
Mechanical Properties of Structural Films
Author: Christopher L. Muhlstein
Publisher: ASTM International
ISBN: 0803128894
Category : Gold films
Languages : en
Pages : 333
Book Description
Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of
Publisher: ASTM International
ISBN: 0803128894
Category : Gold films
Languages : en
Pages : 333
Book Description
Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of