Author: Clemens J.M. Lasance
Publisher: Springer Science & Business Media
ISBN: 1461450918
Category : Technology & Engineering
Languages : en
Pages : 550
Book Description
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
Thermal Management for LED Applications
Author: Clemens J.M. Lasance
Publisher: Springer Science & Business Media
ISBN: 1461450918
Category : Technology & Engineering
Languages : en
Pages : 550
Book Description
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
Publisher: Springer Science & Business Media
ISBN: 1461450918
Category : Technology & Engineering
Languages : en
Pages : 550
Book Description
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
Light-Emitting Diodes
Author: Jinmin Li
Publisher: Springer
ISBN: 3319992112
Category : Technology & Engineering
Languages : en
Pages : 601
Book Description
Comprehensive in scope, this book covers the latest progresses of theories, technologies and applications of LEDs based on III-V semiconductor materials, such as basic material physics, key device issues (homoepitaxy and heteroepitaxy of the materials on different substrates, quantum efficiency and novel structures, and more), packaging, and system integration. The authors describe the latest developments of LEDs with spectra coverage from ultra-violet (UV) to the entire visible light wavelength. The major aspects of LEDs, such as material growth, chip structure, packaging, and reliability are covered, as well as emerging and novel applications beyond the general and conventional lightings. This book, written by leading authorities in the field, is indispensable reading for researchers and students working with semiconductors, optoelectronics, and optics. Addresses novel LED applications such as LEDs for healthcare and wellbeing, horticulture, and animal breeding; Editor and chapter authors are global leading experts from the scientific and industry communities, and their latest research findings and achievements are included; Foreword by Hiroshi Amano, one of the 2014 winners of the Nobel Prize in Physics for his work on light-emitting diodes.
Publisher: Springer
ISBN: 3319992112
Category : Technology & Engineering
Languages : en
Pages : 601
Book Description
Comprehensive in scope, this book covers the latest progresses of theories, technologies and applications of LEDs based on III-V semiconductor materials, such as basic material physics, key device issues (homoepitaxy and heteroepitaxy of the materials on different substrates, quantum efficiency and novel structures, and more), packaging, and system integration. The authors describe the latest developments of LEDs with spectra coverage from ultra-violet (UV) to the entire visible light wavelength. The major aspects of LEDs, such as material growth, chip structure, packaging, and reliability are covered, as well as emerging and novel applications beyond the general and conventional lightings. This book, written by leading authorities in the field, is indispensable reading for researchers and students working with semiconductors, optoelectronics, and optics. Addresses novel LED applications such as LEDs for healthcare and wellbeing, horticulture, and animal breeding; Editor and chapter authors are global leading experts from the scientific and industry communities, and their latest research findings and achievements are included; Foreword by Hiroshi Amano, one of the 2014 winners of the Nobel Prize in Physics for his work on light-emitting diodes.
Fundamentals of Solid-State Lighting
Author: Vinod Kumar Khanna
Publisher: CRC Press
ISBN: 1466561092
Category : Technology & Engineering
Languages : en
Pages : 606
Book Description
Compared to traditional electrical filaments, arc lamps, and fluorescent lamps, solid-state lighting offers higher efficiency, reliability, and environmentally friendly technology. LED / solid-state lighting is poised to take over conventional lighting due to cost savings—there is pretty much no debate about this. In response to the recent activity in this field, Fundamentals of Solid-State Lighting: LEDs, OLEDs, and Their Applications in Illumination and Displays covers a range of solid-state devices, technologies, and materials used for lighting and displays. It also examines auxiliary but critical requirements of efficient applications, such as modeling, thermal management, reliability, and smart lighting. The book discusses performance metrics of LEDs such as efficiency, efficacy, current–voltage characteristics, optical parameters like spectral distribution, color temperature, and beam angle before moving on to luminescence theory, injection luminescence, radiative and non-radiative recombination mechanisms, recombination rates, carrier lifetimes, and related topics. This lays down the groundwork for understanding LED operation. The book then discusses energy gaps, light emission, semiconductor material, special equipment, and laboratory facilities. It also covers production and applications of high-brightness LEDs (HBLEDs) and organic LEDs (OLEDs). LEDs represent the landmark development in lighting since the invention of electric lighting, allowing us to create unique, low-energy lighting solutions, not to talk about their minor maintenance expenses. The rapid strides of LED lighting technology over the last few years have changed the dynamics of the global lighting market, and LEDs are expected to be the mainstream light source in the near future. In a nutshell, the book traces the advances in LEDs, OLEDs, and their applications, and presents an up-to-date and analytical perspective of the scenario for audiences of different backgrounds and interests.
Publisher: CRC Press
ISBN: 1466561092
Category : Technology & Engineering
Languages : en
Pages : 606
Book Description
Compared to traditional electrical filaments, arc lamps, and fluorescent lamps, solid-state lighting offers higher efficiency, reliability, and environmentally friendly technology. LED / solid-state lighting is poised to take over conventional lighting due to cost savings—there is pretty much no debate about this. In response to the recent activity in this field, Fundamentals of Solid-State Lighting: LEDs, OLEDs, and Their Applications in Illumination and Displays covers a range of solid-state devices, technologies, and materials used for lighting and displays. It also examines auxiliary but critical requirements of efficient applications, such as modeling, thermal management, reliability, and smart lighting. The book discusses performance metrics of LEDs such as efficiency, efficacy, current–voltage characteristics, optical parameters like spectral distribution, color temperature, and beam angle before moving on to luminescence theory, injection luminescence, radiative and non-radiative recombination mechanisms, recombination rates, carrier lifetimes, and related topics. This lays down the groundwork for understanding LED operation. The book then discusses energy gaps, light emission, semiconductor material, special equipment, and laboratory facilities. It also covers production and applications of high-brightness LEDs (HBLEDs) and organic LEDs (OLEDs). LEDs represent the landmark development in lighting since the invention of electric lighting, allowing us to create unique, low-energy lighting solutions, not to talk about their minor maintenance expenses. The rapid strides of LED lighting technology over the last few years have changed the dynamics of the global lighting market, and LEDs are expected to be the mainstream light source in the near future. In a nutshell, the book traces the advances in LEDs, OLEDs, and their applications, and presents an up-to-date and analytical perspective of the scenario for audiences of different backgrounds and interests.
Thermal Management for Opto-electronics Packaging and Applications
Author: Xiaobing Luo
Publisher: John Wiley & Sons
ISBN: 1119179297
Category : Technology & Engineering
Languages : en
Pages : 373
Book Description
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Publisher: John Wiley & Sons
ISBN: 1119179297
Category : Technology & Engineering
Languages : en
Pages : 373
Book Description
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)
Author: Avram Bar-Cohen
Publisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Publisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Qpedia Thermal Management – Electronics Cooling Book, Volume 2
Author: Advanced Thermal Solutions
Publisher: Advanced Thermal Solutions
ISBN: 0984627901
Category : Science
Languages : en
Pages : 206
Book Description
The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
Publisher: Advanced Thermal Solutions
ISBN: 0984627901
Category : Science
Languages : en
Pages : 206
Book Description
The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
LED for Lighting Applications
Author: Patrick Mottier
Publisher: John Wiley & Sons
ISBN: 0470610298
Category : Technology & Engineering
Languages : en
Pages : 299
Book Description
Light Emitting Diodes (LEDs) are no longer confined to use in commercial signage and have now moved firmly, and with unquestioned advantages, into the field of commercial and domestic lighting. This development was prompted in the late 1980s by the invention of the blue LED, a wavelength that had previously been missing from the available LED spectrum and which opened the way to providing white light. Since that point, LED performance (including energy efficiency) has improved dramatically, and now compares with the performance of fluorescent lights - and there remain further performance improvements yet to be delivered. The book begins with the principles of LED lighting, then focuses on issues and challenges. Chapters are devoted to key steps in LED manufacturing: substrate, epitaxy, process and packaging. Photoelectric characterization of LEDs, Lighting with LEDs and the imposition of a certain level of color quality, are the subject of later chapters, and finally there is a detailed discussion of the emergence of OLEDs, or organic LEDs, which have specific capabilities of immediate interest and importance in this field.
Publisher: John Wiley & Sons
ISBN: 0470610298
Category : Technology & Engineering
Languages : en
Pages : 299
Book Description
Light Emitting Diodes (LEDs) are no longer confined to use in commercial signage and have now moved firmly, and with unquestioned advantages, into the field of commercial and domestic lighting. This development was prompted in the late 1980s by the invention of the blue LED, a wavelength that had previously been missing from the available LED spectrum and which opened the way to providing white light. Since that point, LED performance (including energy efficiency) has improved dramatically, and now compares with the performance of fluorescent lights - and there remain further performance improvements yet to be delivered. The book begins with the principles of LED lighting, then focuses on issues and challenges. Chapters are devoted to key steps in LED manufacturing: substrate, epitaxy, process and packaging. Photoelectric characterization of LEDs, Lighting with LEDs and the imposition of a certain level of color quality, are the subject of later chapters, and finally there is a detailed discussion of the emergence of OLEDs, or organic LEDs, which have specific capabilities of immediate interest and importance in this field.
Antenna-in-Package Technology and Applications
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Advanced Materials for Thermal Management of Electronic Packaging
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
ISBN: 1441977597
Category : Technology & Engineering
Languages : en
Pages : 633
Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Publisher: Springer Science & Business Media
ISBN: 1441977597
Category : Technology & Engineering
Languages : en
Pages : 633
Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Qpedia Thermal Management – Electronics Cooling Book, Volume 1
Author:
Publisher: Advanced Thermal Solutions
ISBN: 061523660X
Category :
Languages : en
Pages : 186
Book Description
Publisher: Advanced Thermal Solutions
ISBN: 061523660X
Category :
Languages : en
Pages : 186
Book Description