The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages PDF full book. Access full book title The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages by Gerard Kelly. Download full books in PDF and EPUB format.
Author: Gerard Kelly
Publisher: Springer Science & Business Media
ISBN: 9780792384854
Category : Science
Languages : en
Pages : 170
Get Book Here
Book Description
This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. Failures like delaminations, package cracking, and metal shift occur due to the build-up of residual stress and warpage in the packages because of the TCE mismatch between the package materials as the package cools from its molding temperature to room temperature. The correct use of finite element tools for these problems is emphasised. F.E. techniques are used to predict the internal package stress distribution and help explain the stress transfer mechanism between the die, die paddle, and plastic after molding. Out-of-plane shear stress components are shown to be responsible for experimentally observed metal shift patterns on the die surface. Delaminations dramatically alter the internal stress state within a package, increasing the tensile stress in the plastic and so the likelihood of plastic cracks, the stress on wire bonds, and the incidence of wire bond failure. The application of F.E. techniques to predict the post-mold warpage of both thermally enhanced PQFPs and TQFPs is described. Simulations of a thermally enhanced PQFP warpage based on standard modelling assumptions alone fail to predict either the magnitude or its direction correctly. The modelling assumptions need to be modified to include the chemical shrinkage of the molding compound to enable accurate predictions of package warpage to be made, particularly when the packages are asymmetric in structure. Microsystem packaging in both plastic and 3D package body styles is reviewed. Although microsystem packaging is derived from IC packaging, additional requirements for microsystems, not common to IC packaging are highlighted. The assembly stresses on a novel microsystem, incorporating a micromachined silicon membrane pump integrated into a 3D plastic encapsulated vertical multichip module package (MCM-V), are analysed.
Author: Gerard Kelly
Publisher: Springer Science & Business Media
ISBN: 1461550114
Category : Technology & Engineering
Languages : en
Pages : 143
Get Book Here
Book Description
One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of time and money invested in undertaking costly experimental trials. In a high volume production environment, any design improvement that increases yield and reliability can be of immense benefit to the manufacturer. Components and systems need to be packaged to protect the IC from its environment. Encapsulating devices in plastic is very cheap and has the advantage of allowing them to be produced in high volume on an assembly line. Currently 95% of all ICs are encapsulated in plastic. Plastic packages are robust, light weight, and suitable for automated assembly onto printed circuit boards. They have developed from low pincount (14-28 pins) dual-in-line (DIP) packages in the 1970s, to fine pitch PQFPs (plastic quad flat pack) and TQFPs (thin quad flat pack) in the 1980s-1990s, with leadcounts as high as 256. The demand for PQFPs in 1997 was estimated to be 15 billion and this figure is expected to grow to 20 billion by the year 2000.
Author: Gerard G. Kelly
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 350
Get Book Here
Book Description
Finite element techniques are used to identify the reliability hazards and potential failure mechanisms associated with encapsulating ICs in plastic. Failures like delaminations, package cracking, and metal shift occur due to the build up of residual stress during package manufacture. The stress arises, in the main, because of the TCE mismatch between the package materials as the package cools from its molding temperature. Simulations predict the internal package stress distribution and are used to explain the stress transfer mechanism between the die, die paddle, and plastic after molding. The molding compound induces 53% of the compressive stress on the die. The die stress can be virtually eliminated by putting a stress absorbing soft material at the sides of the die. Die surface coatings reduce die compressive stress by no more than 17% of the uncoated stress. Delaminations dramatically alter the internal stress state within a package. Cracks in the body of the package occur only in the presence of delaminations. A delamination between the plastic and the die surface increases the stress in wire bonds by a factor of 4, and consequently increase the likelihood of wire bond failures. Out-of-plane shear stress components, not currently detectable by piezoresistive stress sensors are identified. Their distribution and line of action correlate with metal shift patterns on the die surface. Measurements of the warpage of a thermally enhanced PQFP possessing an asymmetric structure show an anomalous increase with temperature. F.E. simulations using standard modelling assumptions based on TCE shrinkage alone, fail to accurately predict the post mold warpage of this package. Modelling assumptions need to incorporate molding compound chemical shrinkage to accurately predict warpage. Packing issues specific to microsystems are reviewed. A novel microsystem incorporating a micromachined silicon membrane pump, integrated into a 3D plastic encapsulated vertical multichip module package (MCM-V) is described. F.E. techniques are used to enhance the crack resistance of substrates designed to support the membrane pump.
Author: Marius Bazu
Publisher: John Wiley & Sons
ISBN: 1119990009
Category : Technology & Engineering
Languages : en
Pages : 372
Get Book Here
Book Description
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Author: G.Q. Zhang
Publisher: Springer Science & Business Media
ISBN: 1475731590
Category : Technology & Engineering
Languages : en
Pages : 195
Get Book Here
Book Description
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Author: E-H Wong
Publisher: Woodhead Publishing
ISBN: 0857099116
Category : Technology & Engineering
Languages : en
Pages : 477
Get Book Here
Book Description
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
Author: Jasbir Bath
Publisher: John Wiley & Sons
ISBN: 1119481937
Category : Technology & Engineering
Languages : en
Pages : 512
Get Book Here
Book Description
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Author: Electronic Device Failure Analysis Society
Publisher: ASM International
ISBN: 1615030891
Category : Technology & Engineering
Languages : en
Pages : 524
Get Book Here
Book Description
Author: G.Q. Zhang
Publisher: Springer Science & Business Media
ISBN: 1402049358
Category : Technology & Engineering
Languages : en
Pages : 580
Get Book Here
Book Description
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 180
Get Book Here
Book Description
Author: Ger McCarthy
Publisher:
ISBN:
Category : Packaging
Languages : en
Pages : 380
Get Book Here
Book Description
