The Role of Van Der Waals Forces in the Adhesion of Metal Films to Substrates PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download The Role of Van Der Waals Forces in the Adhesion of Metal Films to Substrates PDF full book. Access full book title The Role of Van Der Waals Forces in the Adhesion of Metal Films to Substrates by Frank E. Vopat. Download full books in PDF and EPUB format.
Author: Frank E. Vopat
Publisher:
ISBN:
Category : Adhesion
Languages : en
Pages : 116
Get Book Here
Book Description
Author: Frank E. Vopat
Publisher:
ISBN:
Category : Adhesion
Languages : en
Pages : 116
Get Book Here
Book Description
Author: Lucas F. M. da Silva
Publisher: Springer
ISBN: 9783642359422
Category : Technology & Engineering
Languages : en
Pages : 1543
Get Book Here
Book Description
Adhesives have been used for thousands of years, but until 100 years ago, the vast majority was from natural products such as bones, skins, fish, milk, and plants. Since about 1900, adhesives based on synthetic polymers have been introduced, and today, there are many industrial uses of adhesives and sealants. It is difficult to imagine a product—in the home, in industry, in transportation, or anywhere else for that matter—that does not use adhesives or sealants in some manner. The Handbook of Adhesion Technology is intended to be the definitive reference in the field of adhesion. Essential information is provided for all those concerned with the adhesion phenomenon. Adhesion is a phenomenon of interest in diverse scientific disciplines and of importance in a wide range of technologies. Therefore, this handbook includes the background science (physics, chemistry and materials science), engineering aspects of adhesion and industry specific applications. It is arranged in a user-friendly format with ten main sections: theory of adhesion, surface treatments, adhesive and sealant materials, testing of adhesive properties, joint design, durability, manufacture, quality control, applications and emerging areas. Each section contains about five chapters written by internationally renowned authors who are authorities in their fields. This book is intended to be a reference for people needing a quick, but authoritative, description of topics in the field of adhesion and the practical use of adhesives and sealants. Scientists and engineers of many different backgrounds who need to have an understanding of various aspects of adhesion technology will find it highly valuable. These will include those working in research or design, as well as others involved with marketing services. Graduate students in materials, processes and manufacturing will also want to consult it.
Author: Jianguo Zhu
Publisher: World Scientific
ISBN: 9811224005
Category : Science
Languages : en
Pages : 706
Get Book Here
Book Description
Thin films have an extremely broad range of applications from electronics and optics to new materials and devices. Collaborative and multidisciplinary efforts from physicists, materials scientists, engineers and others have established and advanced a field with key pillars constituting (i) the synthesis and processing of thin films, (ii) the understanding of physical properties in relation to the nanometer scale, (iii) the design and fabrication of nano-devices or devices with thin film materials as building blocks, and (iv) the design and construction of novel tools for characterization of thin films.Against the backdrop of the increasingly interdisciplinary field, this book sets off to inform the basics of thin film physics and thin film devices. Readers are systematically introduced to the synthesis, processing and application of thin films; they will also study the formation of thin films, their structure and defects, and their various properties — mechanical, electrical, semiconducting, magnetic, and superconducting. With a primary focus on inorganic thin film materials, the book also ventures on organic materials such as self-assembled monolayers and Langmuir-Blodgett films.This book will be effective as a teaching or reference material in the various disciplines, ranging from Materials Science and Engineering, Electronic Science and Engineering, Electronic Materials and Components, Semiconductor Physics and Devices, to Applied Physics and more. The original Chinese publication has been instrumental in this purpose across many Chinese universities and colleges.
Author: Ludmila Eckertová
Publisher: Springer Science & Business Media
ISBN: 1461575893
Category : Science
Languages : en
Pages : 251
Get Book Here
Book Description
The investigation of the physical properties of matter has progressed so much during the last hundred years that today physics is divided into a large group of special branches, which are often very distant from each other. These branches arise because of the vast extent of the science itself, and are distinguished by the particular area studied, the method of investigation and so on. An independent and important branch that has developed recently is the physics of thin films. This deals with systems which have only one common property, namely, that one of their dimensions is very small, though all other physical properties of such systems may be different, as well as methods of investigating them. Usually, we investigate the physical characteristics of three-dimensional bodies. Their characteristic prop::!rties are often related to a unit volume, i.e. it is assumed that they are volume-independent. This assumption is legitimate as long as the dimensions are 'normal', i.e. more or less within macroscopic limits; but as soon as one dimension becomes so small that there is a considerable increase in a surface-to-volume ratio, that assumption is no longer valid.
Author: Anthony J. Kinloch
Publisher: Springer Science & Business Media
ISBN: 9401577641
Category : Technology & Engineering
Languages : en
Pages : 452
Get Book Here
Book Description
Over the last decade, or so, the growth in the use of adhesives, especially in ever more technically demanding applications, has been rapid and many major developments in the technology of adhesives have been reported. This growth has also led to attention being focused on somewhat more basic studies of the science of adhesion and adhesives, and in recent years our level of fundamental knowledge concerning the formation and mechanical performance of adhesive joints has increased dramatically. Such studies have, of course, been aided greatly by the development of the tools at the disposal of the investigators. For example, specific surface analytical techniques, such as X-ray photoelectron and secondary-ion mass spectroscopy, and the increasingly sophisticated methods of stress analysis and fracture mechanics have been put to good use in furthering our understanding of the science of adhesion and adhesives. The present book attempts to review the multidisciplined subject of adhesion and adhesives, considering both the science and technology involved in the formation and mechanical performance of adhesive joints. The author would like to thank his friends and colleagues for useful discus sions and help in the preparation of this book. I am particularly grateful to P. Cawley, J. Comyn, W. A. Lees, A. C. Roulin-Moloney, W. C. Wake, J. G. Williams and R. J. Young who have read and commented on various chapters and P. Farr for preparing the diagrams.
Author: Zhilong Peng
Publisher: Springer
ISBN: 3662469553
Category : Technology & Engineering
Languages : en
Pages : 107
Get Book Here
Book Description
The thesis systematically investigates the factors which influence many animals’ robust adhesion abilities and micro-reversible adhesion mechanisms, including the geometric principles of their adhesion, relative humidity, surface roughness and pre-tension. Studies exploring biological adhesion mechanisms are not only of great significance for the design of advanced adhesive materials and adhesion systems for micro-climbing robots, but also very helpful for resolving the problem of adhesion failure in MEMS/NEMS.
Author: L.H. Lee
Publisher: Springer Science & Business Media
ISBN: 1489920730
Category : Science
Languages : en
Pages : 466
Get Book Here
Book Description
Author: K. L. Mittal
Publisher: John Wiley & Sons
ISBN: 1118831349
Category : Technology & Engineering
Languages : en
Pages : 293
Get Book Here
Book Description
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Author: Changhong Cao
Publisher: Elsevier
ISBN: 0443188440
Category : Science
Languages : en
Pages : 539
Get Book Here
Book Description
Transfer printing (TP) is a class of techniques for the deterministic assembly of disparate micro/nanomaterials into functional devices, and has become an emerging suite of technologies for micro/nanofabrication. Systems enabled by transfer printing range from complex molecular-scale materials, to high-performance hard materials, to fully integrated devices. A variety of sub-techniques for different purposes have grown significantly in the past decade, leading to non-conventional electronics, optoelectronics, photovoltaics, and photonics, and enabling the development of non-planar and flexible electronics.Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques.Transfer Printing Technologies and Applications is a complete guide to transfer printing techniques and their cutting-edge applications. The first section of the book provides a solid grounding in transfer printing methods and the fundamentals behind these technologies. The second part of the book focuses on state-of-the-art applications enabled by transfer printing techniques, including areas such as flexible sensors, flexible transistors, wearable devices, thin film-based energy systems, flexible displays, microLED-based displays, metal films, and more. A concluding chapter addresses current challenges and future opportunities in this innovative field.Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques.This book is of interest to researchers and advanced students across nanotechnology, materials science, electrical engineering, mechanical engineering, chemistry, and biomedicine, as well as scientists, engineers, and R&D professionals involved with nanomaterials, micro- or nano-fabrication, microelectromechanical systems (MEMS), display technology, biotechnology, and devices. Highlights breakthrough results and systems enabled by novel TP techniques. Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques. Highlights breakthrough results and systems enabled by novel TP techniques. - Examines a range of transfer printing technologies and their specific features for different applications - Highlights breakthrough results and systems enabled by novel TP techniques - Offers an insightful outlook into trends and future directions in each sub-area of transfer printing
Author:
Publisher:
ISBN:
Category : Astronautics
Languages : en
Pages : 432
Get Book Here
Book Description
