Author: Oak Ridge National Laboratory. Metals and Ceramics Division
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 835
Book Description
The 3rd Thermal Conductivity Conference
Author: Oak Ridge National Laboratory. Metals and Ceramics Division
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 835
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 835
Book Description
The 3rd Thermal Conductivity Conference
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 835
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 835
Book Description
Thermal Conductivity Conference
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages :
Book Description
Proceedings of the 4th Conference on Thermal Conductivity
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 944
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 944
Book Description
Thermal Conductivity
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 368
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 368
Book Description
Thermal Conductivity and Electrical Resistivity
Author: Jerome G. Hust
Publisher:
ISBN:
Category : Tungsten
Languages : en
Pages : 52
Book Description
Publisher:
ISBN:
Category : Tungsten
Languages : en
Pages : 52
Book Description
Thermal Conductivity 20
Author: J.R., Jr. Thomas
Publisher: Springer Science & Business Media
ISBN: 1461307619
Category : Technology & Engineering
Languages : en
Pages : 422
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Publisher: Springer Science & Business Media
ISBN: 1461307619
Category : Technology & Engineering
Languages : en
Pages : 422
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti ficial barriers between disciplines and gather together in increasing num bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Conference on Thermal Conductivity ; 21
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Thermal Conductivity 28
Author: Ralph B. Dinwiddie
Publisher: DEStech Publications, Inc
ISBN: 1932078592
Category : Expansion (Heat)
Languages : en
Pages : 858
Book Description
This book presents the most current research on heat flow in materials, ranging from metals to newer materials such as thin films and nanowires.
Publisher: DEStech Publications, Inc
ISBN: 1932078592
Category : Expansion (Heat)
Languages : en
Pages : 858
Book Description
This book presents the most current research on heat flow in materials, ranging from metals to newer materials such as thin films and nanowires.
PROCEEDINGS - 11TH INTERNATIONAL THERMAL CONDUCTIVITY CONFERENCE.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description