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Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 836
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Book Description
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 836
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 376
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Book Description
Author:
Publisher:
ISBN:
Category : Imaging systems
Languages : en
Pages : 1208
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Book Description
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 636
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Book Description
Author: Charles A. Harper
Publisher: McGraw Hill Professional
ISBN: 9780070267138
Category : Technology & Engineering
Languages : en
Pages : 578
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Book Description
Printed circuit boards (PCBs) and ceramic substrates are the baseline on which almost all modern microelectronics are mounted. The increase in complexity of high performance microelectronics has put great stress on PCB technologies - this volume provides data and design information for the new generation fast, dense boards and substrates. It covers microvias, built-up multilayers, and high density boards; advanced ceramic substrates; and environmentally-safe materials.
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 408
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Book Description
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author: Neophytos (Neo) Antoniades
Publisher: Springer Science & Business Media
ISBN: 1461410932
Category : Technology & Engineering
Languages : en
Pages : 536
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Book Description
Modeling, Simulation, Design and Engineering of WDM Systems and Networks provides readers with the basic skills, concepts, and design techniques used to begin design and engineering of optical communication systems and networks at various layers. The latest semi-analytical system simulation techniques are applied to optical WDM systems and networks, and a review of the various current areas of optical communications is presented. Simulation is mixed with experimental verification and engineering to present the industry as well as state-of-the-art research. This contributed volume is divided into three parts, accommodating different readers interested in various types of networks and applications. The first part of the book presents modeling approaches and simulation tools mainly for the physical layer including transmission effects, devices, subsystems, and systems), whereas the second part features more engineering/design issues for various types of optical systems including ULH, access, and in-building systems. The third part of the book covers networking issues related to the design of provisioning and survivability algorithms for impairment-aware and multi-domain networks. Intended for professional scientists, company engineers, and university researchers, the text demonstrates the effectiveness of computer-aided design when it comes to network engineering and prototyping.
Author: Rajesh Singh
Publisher: Springer
ISBN: 9789811017070
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
The book presents high-quality research papers presented at the first international conference, ICICCD 2016, organised by the Department of Electronics, Instrumentation and Control Engineering of University of Petroleum and Energy Studies, Dehradun on 2nd and 3rd April, 2016. The book is broadly divided into three sections: Intelligent Communication, Intelligent Control and Intelligent Devices. The areas covered under these sections are wireless communication and radio technologies, optical communication, communication hardware evolution, machine-to-machine communication networks, routing techniques, network analytics, network applications and services, satellite and space communications, technologies for e-communication, wireless Ad-Hoc and sensor networks, communications and information security, signal processing for communications, communication software, microwave informatics, robotics and automation, optimization techniques and algorithms, intelligent transport, mechatronics system, guidance and navigation, algorithms, linear/non-linear control, home automation, sensors, smart cities, control systems, high performance computing, cognition control, adaptive control, distributed control, prediction models, hybrid control system, control applications, power system, manufacturing, agriculture cyber physical system, network control system, genetic control based, wearable devices, nano devices, MEMS, bio-inspired computing, embedded and real-time software, VLSI and embedded systems, FPGA, digital system and logic design, image and video processing, machine vision, medical imaging, and reconfigurable computing systems.
Author: Andrey A. Radionov
Publisher: Springer Nature
ISBN: 303022063X
Category : Technology & Engineering
Languages : en
Pages : 1449
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Book Description
This book highlights recent findings in industrial, manufacturing and mechanical engineering, and provides an overview of the state of the art in these fields, mainly in Russia and Eastern Europe. A broad range of topics and issues in modern engineering are discussed, including the dynamics of machines and working processes, friction, wear and lubrication in machines, surface transport and technological machines, manufacturing engineering of industrial facilities, materials engineering, metallurgy, control systems and their industrial applications, industrial mechatronics, automation and robotics. The book gathers selected papers presented at the 5th International Conference on Industrial Engineering (ICIE), held in Sochi, Russia in March 2019. The authors are experts in various fields of engineering, and all papers have been carefully reviewed. Given its scope, the book will be of interest to a wide readership, including mechanical and production engineers, lecturers in engineering disciplines, and engineering graduates.
